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Solid-state imaging apparatus

A technology of solid-state imaging device and solid-state imaging device, applied in radiation control device, image communication, electric solid-state device, etc., can solve problems such as generating light spots, and achieve the effect of suppressing the generation of light spots and phantom images

Active Publication Date: 2012-08-22
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in this case, there is a risk of generating flare or ghost images because light incident from the lens is reflected on the surface of the wire (metal wire) connected to the bonding pad, and enters the light-receiving surface on the image sensor

Method used

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Embodiment Construction

[0044] Embodiments of the present disclosure will be described below with reference to the drawings. Instructions will be given in the following order.

[0045] 1. Solid-state imaging device with wire bonding structure

[0046] 2. Solid-state imaging device with flip-chip structure

[0047] 3. An example of a solid-state imaging device that realizes cavity-free

[0048] 4. Example of forming a light-shielding member with a metal mold

[0049]

[0050] [External structure of solid-state imaging device]

[0051] figure 2 is a view showing the structure of a solid-state imaging device according to an embodiment to which the present disclosure is applied.

[0052] figure 2 The solid-state imaging device includes a CMOS image sensor 10 (hereinafter simply referred to as the image sensor 10) as an optical sensor, a metal wire 11 electrically connecting the image sensor 10 to an unshown substrate, a passive sensor mounted on the unshown substrate, The component 12 and the ...

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Abstract

A solid-state imaging apparatus includes: a solid-state imaging device photoelectrically converting light taken by a lens; and a light shielding member shielding part of light incident on the solid-state imaging device from the lens, wherein an angle made between an edge surface of the light shielding member and an optical axis direction of the lens is larger than an incident angle of light to be incident on an edge portion of the light shielding member.

Description

technical field [0001] The present disclosure relates to a solid-state imaging device, and in particular, to a solid-state imaging device capable of suppressing the generation of flare and ghost images. Background technique [0002] In recent years, also in image sensors in solid-state imaging devices, as with other semiconductor chips, chip miniaturization tends to advance due to the introduction of cutting-edge processes. Therefore, when designing a solid-state imaging device in which an image sensor is connected to a substrate by wire bonding, it may be considered to design the image sensor such that the bonding pad is arranged within the effective diameter of the lens. [0003] In this case, however, there is a risk of generating flare or ghost images because light incident from the lens is reflected on the surface of the wire (metal wire) connected to the bonding pad, and enters the light receiving surface on the image sensor. [0004] In view of this, there has been d...

Claims

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Application Information

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IPC IPC(8): H01L27/146
CPCH01L27/14618H01L27/14623H01L27/14625G02B5/208G02B27/0018H01L27/1462H01L27/14621H01L27/14627H01L27/14629H01L27/14636H01L27/14643H01L27/14649H01L27/14685H01L2224/48463H01L2224/45144H01L2924/00H04N25/61
Inventor 岩渕寿章清水正彦小林宽隆
Owner SONY CORP