Light-emitting element and manufacturing method therefor

Abstract

The invention discloses a light-emitting element with a roughened surface as well as a manufacturing method for the light-emitting element. The light-emitting element comprises a semi-conductor lamination and an electrode layer, wherein the semi-conductor lamination has the roughened surface, the electrode layer is formed on the roughened surface of the semi-conductor lamination, the roughened surface comprises a first area in a first roughened surface type and a second area in a second roughened surface type, a second roughened surface is approximately near the electrode layer, and the junction between the second roughened surface and the electrode layer has an outward-inclined section.

Description

[0001] This application document is a divisional application of the invention patent application No. 200710307437.X filed on December 28, 2007 with the title of "light-emitting element and its manufacturing method". technical field [0002] The invention relates to a light-emitting element, in particular to a light-emitting element with a roughened surface and a manufacturing method thereof. Background technique [0003] Surface roughening is one of the effective methods to improve the light extraction efficiency of LEDs. Taking the surface roughening of the substrate or the uppermost semiconductor layer as an example, it has irregular protrusions and depressions to scatter the light incident on the roughened surface, thereby increasing the light extraction efficiency. Traditional roughening methods can be randomly formed on the surface to be roughened by mechanical grinding or ion etching. Another relatively simple method is to use wet etching, directly place the wafer in ...

AI Technical Summary

Problems solved by technology

Because wet etching belongs to isotropic etching, it is easy to form lateral etching at the junction of p-electrode 16 and p-type semiconductor layer 14 to cause undercut (undercut) 17, so that the bonding area between p-electrode 16 and the lower layer is insufficient, and it is easy to Cause reliability failure of components or electrode peeling due to stress

In addition, the rough surface formed by the traditional wet etching method has poor uniformity, cannot provide stable product quality, and is difficult to apply to mass production processes

[0004] In order to avoid reliability failure or electrode peeling caused by undercutting, another traditional method is to form a rough surface first and then form electrodes on it. This method will cause the contact resistance between the electrode and the underlying layer to increase and affect the performance of the device. , and cause the electrode surface to be uneven and affect the subsequent bonding yield

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