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Compressor type chip temperature reducing system

A technology of refrigeration compressors and chips, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of high-power chips with small area and high heat generation that cannot be effectively cooled, and achieve the effect of improving refrigeration efficiency

Active Publication Date: 2012-09-05
深圳市康普科勒科技开发有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention provides a micro refrigeration compressor type chip cooling system, which overcomes the shortcomings of the above-mentioned prior art, and can solve the problem that the existing high-power chips cannot effectively cool down due to their small area and high calorific value

Method used

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  • Compressor type chip temperature reducing system
  • Compressor type chip temperature reducing system
  • Compressor type chip temperature reducing system

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Embodiment Construction

[0024] Such as figure 1 , figure 2 , image 3 , Figure 4 , Figure 5 and Figure 6 As shown, the micro-refrigeration compressor type chip cooling system of the present invention includes a micro-refrigeration compressor 1, a condenser 2 and a microchannel evaporative cold head 3; The channel evaporative cold head 3 has a sealed installation cavity 18 for filling thermal insulation materials, and the thermal insulation material is filled in the installation cavity 18 according to actual needs. Next to the installation cavity 18, there are micro-channel evaporative cold head inlets 5 and micro-channel evaporative cold head Outlet 7, on the back of the installation cavity 18, there are micro-channel evaporative cold head internal flow channels 6 that communicate with the micro-channel evaporative cold head inlet 5 and the micro-channel evaporative cold head outlet 7 respectively, and a refrigerant is fixedly installed on the micro-refrigeration compressor 1 Filling pipe 15...

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Abstract

The invention relates to the technical field of reducing the temperature of a chip, and discloses a compressor type chip temperature reducing system. The compressor type chip temperature reducing system comprises a mini refrigeration compressor, a condenser and a microchannel evaporation cold head, wherein a condensation fan is fixedly arranged on the condenser, a mounting cavity is sealed in the microchannel evaporation cold head and is used for filling a heat insulation material, the heat insulation material is filled in the mounting cavity according to practical requirements, an inlet of the microchannel evaporation cold head and an outlet of the microchannel evaporation cold head are arranged besides the mounting cavity, and a microchannel evaporation cold head inner flow path is arranged on the back surface of the mounting cavity and is communicated with the inlet of the microchannel evaporation cold head and the outlet of the microchannel evaporation cold head respectively. According to the compressor type chip temperature reducing system disclosed by the invention, the mini refrigeration compressor, the condenser, the condenser fan, a throttling short pipe, the microchannel evaporation cold head, a temperature sensor, a main control board and a hose are used in a matching manner, the main control board is used for sensing the temperature of the microchannel evaporation cold head, regulating the rotation speed of a compressor and outputting cold amount equal to the heat generated by a chip, and can greatly bring away the heat of the chip, thus the refrigeration efficiency of the compressor type chip temperature reducing system is greatly improved.

Description

technical field [0001] The invention relates to the technical field of chip cooling, and relates to a compressor-type chip cooling system. Background technique [0002] With the advancement of technology, the complexity of the chip is getting higher and higher, the computing speed is getting faster and faster, the power consumption and heat generation are getting bigger and bigger, but the size of the chip is expected to be smaller and smaller. When the high calorific value on a small area cannot be eliminated in time, for example, it causes the temperature of the chip to rise. The working efficiency, service life and stability of the chip at high temperature will be greatly reduced. Therefore, the heat dissipation problem of the chip will become a bottleneck on the road of chip development. [0003] The traditional chip heat dissipation method is to take away the heat through the air-cooling method of the fan, and promote the circulation of the air through the fan to achi...

Claims

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Application Information

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IPC IPC(8): H01L23/473
Inventor 孙正军
Owner 深圳市康普科勒科技开发有限公司
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