Supercharge Your Innovation With Domain-Expert AI Agents!

Component having at least one MEMS element and method for the manufacture thereof

A component and component technology, which is applied in the components of TV systems, semiconductor/solid-state device components, and manufacturing microstructure devices, etc., can solve the problems of increased manufacturing costs, expensive microphone packaging, and increased packaging area, and can eliminate The effect of tension

Active Publication Date: 2012-09-12
ROBERT BOSCH GMBH
View PDF7 Cites 13 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, accommodating an ASIC into a microphone package inevitably leads to an increase in package area
Such a microphone package is relatively expensive since the manufacturing cost also increases with the package area

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Component having at least one MEMS element and method for the manufacture thereof
  • Component having at least one MEMS element and method for the manufacture thereof
  • Component having at least one MEMS element and method for the manufacture thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 50

[0044] Figure 5 A further embodiment 50 of a microphone package according to the invention is shown, which has a MEMS microphone assembly 1 which is mounted with the back side of the assembly on a flat support 2, so that below the diaphragm structure 11 The cavity 12 forms together with the support 2 the rear volume of the microphone assembly 1 . In the exemplary embodiment shown here, the microphone assembly 1 is not connected by means of wire bonding, but via connection terminals 53 on the rear side of the assembly. Furthermore, the microphone package 50 comprises an ASIC 3 with a through-hole 4 , which is arranged in flip-chip technology, ie facing downwards, on the microphone assembly 1 and is spaced apart from the diaphragm structure 11 . In the exemplary embodiment shown here, the ASIC 3 is connected to the microphone assembly 1 via a structured adhesive layer 25 which remains permanently in the microphone package 50 and extends only over the frame area of ​​the diaphr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A cost-effective and space-saving component that includes an MEMS element and an access channel to the membrane structure of the MEMS element. The component comprises an MEMS element, with a membrane structure arranged in a top side of the MEMS element. The MEMS element is mounted by the rear side of the component on a substrate and is at least partially embedded in a molding compound. An access port is formed in the molding compound. According to the invention, the component also includes at least one semiconductor component having at least one through hole that is integrated in the molding compound above the MEMS element at a distance from the membrane structure, so that a hollow space is located between the semiconductor component and the membrane structure. The access port in the molding compound opens through into the through hole of the semiconductor component and, together with this and the hollow space between the further semiconductor component and the membrane structure, forms the access channel to the membrane structure.

Description

technical field [0001] The invention relates to a component and a method for producing the component. The component described here comprises at least one MEMS component which has at least one membrane structure which is formed in the upper side of the MEMS component. The MEMS component is mounted on the support with the backside of the component. Furthermore, the MEMS component is at least partially embedded in a molding mass in which at least one access opening is formed. Background technique [0002] An encapsulation of a MEMS pressure sensor element with a molded housing is described in the laid-open document DE 199 29 026 A1. A sensor membrane is formed in the upper side of the pressure sensor element, which covers the cavity in the rear side of the component. The cavity is pressure-tightly closed by means of the base support and serves as a reference volume for pressure detection. The structure is mounted on a lead frame and electrically connected. The lead frame c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/02B81C1/00H04R31/00
CPCH04R19/005H04R19/04H04R31/00B81B7/0061B81B2201/0257B81C2203/0154H01L2224/32145H01L2224/48091H01L2224/73265H01L2924/00014
Inventor R·艾伦普福特U·肖尔茨
Owner ROBERT BOSCH GMBH
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com