Lithography alignment parameter prediction method and lithography method

Abstract

The invention provides a photoetching alignment parameter prediction method and a photoetching method. The photoetching alignment parameter prediction method comprises the following steps of: acquiring a first weighted average value and a first prediction accuracy parameter of a photoetching alignment parameter of other layers similar to the current layer of the same product on a machine; acquiring a second weighted average value and a second prediction accuracy parameter of the photoetching alignment parameter of the same layers of other products which have the same technical platform as the current product on the machine; acquiring a photoetching alignment daily observation result value and a third prediction accuracy parameter of the machine; and if the first prediction accuracy parameter is lower than a given threshold value, setting a photoetching alignment value to be equal to a number which accords with a formula of (the first weighted average value*the first prediction accuracy parameter +the second weighted average value*(1-the first prediction accuracy parameter)*the second prediction accuracy parameter) / (the first prediction accuracy parameter +(1-the first prediction accuracy parameter)*the second prediction accuracy parameter)-the result value*the third prediction accuracy parameter.

Description

technical field [0001] The present invention relates to the field of semiconductor manufacturing, and more specifically, the present invention relates to a method for predicting lithography alignment parameters and a lithography method using the method for predicting lithography alignment parameters. Background technique [0002] In the semiconductor wafer processing technology, the rework rate is a very important indicator for the photolithography process. About 13% of reworked wafers are due to the use of inappropriate photolithography alignment parameters during new product trial production, resulting in measurement exceeding the standard. [0003] Automatic feedback systems are widely used in photolithography processes for better control of photolithography alignment parameters. But for a factory with many kinds of products, there are still many problems. Specifically, this is because low-volume products do not provide sufficient data volumes to accurately predict the ...

AI Technical Summary

Problems solved by technology

[0004] However, if the lithographic alignment parameters of new products cannot be accurately predicted, the first (first) trial production batches will be reworked

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