Lid opening and closing device

Abstract

The invention provides a lid opening and closing device, which is an opening and closing device for a FOUP. By enabling the edge part of the substrate takeout opening of the FOUP to makes contact with the edge portion of the conveying gateway which is opened and closed by an opening / closing door, and by arranging an opening of a front surface of a FOUP lid in the lid, the engagement of the lid and a FOUP body is released and the lid is held. The conveying gateway is formed on a partition wall configured to divide a FOUP conveying region and a substrate conveying region. The lid opening and closing device compsies an exhaust port configured to discharge therethrough an atmospheric gas from a closed space formed between the FOUP making contact with the edge portion of the conveying gateway and the opening / closing door; and a purge gas injecting part provided in the opening / closing door, the purge gas injecting part configured to enter the internal space of the lid through the opening of the front surface of the lid, to inject a purge gas into the internal space and to discharge an atmospheric gas existing in the internal space into the closed space through another opening of the lid different from the opening.

Description

technical field [0001] The present invention relates to a lid opening and closing device for opening and closing a lid that closes a take-out port of a substrate constituting a part of a FOUP. Background technique [0002] As one of semiconductor manufacturing apparatuses, there is, for example, a vertical heat treatment apparatus that heat-treats a plurality of semiconductor wafers (hereinafter referred to as wafers) in batches. The vertical heat treatment device is set in the atmosphere, and includes: a carrier transport area, which is used to transport a carrier called FOUP for storing wafers; a wafer transport area, which is used to transfer the wafer to The wafer boat used as the substrate holder is transported to the heat treatment furnace; the partition wall is arranged between the carrier transport area and the wafer transport area. In order to make the cleanliness of the wafer transfer area higher than that of the carrier transfer area and prevent the natural oxide...

AI Technical Summary

Problems solved by technology

As a result, the wafer may not be processed as desired

[0005] In the past, it has been proposed to provide a loading port with a nozzle for ejecting gas on the surface of the cover in order to remove foreign matter, but it is not enough to remove the air inside the cover as described above.

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