Optical semiconductor device and manufacturing method thereof
A technology for optical semiconductor devices and optical semiconductor components, which is applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, and semiconductor/solid-state device components, etc. The effect of the bulge of the resin
Active Publication Date: 2016-06-08
STANLEY ELECTRIC CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0010] However, in Patent Document 1, it is difficult to confirm whether or not uniform coating is always carried out stably, and many parts depend on the skill of the operator, so there is a problem that the management cost is high.
[0011] In addition, in Patent Document 2, in addition to a normal punching die, a high-precision punching die having a complicated structure is required, and there is a problem that the initial cost increases.
Method used
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Experimental program
Comparison scheme
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Embodiment Construction
[0036] Embodiments of the present invention will be described below with reference to the drawings.
[0037] figure 1 (a) and (b) are figures which show an example of a structure of the optical semiconductor device of this invention. and figure 1 (a) is the front view, figure 1 (b) is a side view. refer to figure 1 (a), (b), the optical semiconductor device 10 has an optical semiconductor element 1, a pair of lead frames 2, 2 on either side of which the optical semiconductor element 1 is provided, and covers the optical semiconductor element 1 and the pair of lead frames. 2. The sealing resin portion 3 at the end portion on the side where the above-mentioned optical semiconductor element of 2 is provided.
[0038] Furthermore, the pair of lead frames 2 and 2 have a flash inversion region 4 in a region opposite to the side where the optical semiconductor element is installed with respect to the bottom surface 3 a of the sealing resin portion 3 (that is, a region not sealed...
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The present invention provides an optical semiconductor device and a manufacturing method thereof. Swelling of the resin in the lead portion (lead frame) can be prevented without requiring much cost and labor. As a solution, an optical semiconductor device has an optical semiconductor element (1), a lead frame (2, 2) for setting the optical semiconductor element (1), a lead frame (2, 2) covering the optical semiconductor element (1), and the aforementioned lead frame (2, 2). ), the sealing resin portion (3) at the end portion of the optical semiconductor element installation side of ), and the above-mentioned lead frame (2, 2) is located on the side where the optical semiconductor element is installed compared with the bottom surface (3a) of the sealing resin portion (3). In the area on the opposite side, there is a flash inversion area (4).
Description
technical field [0001] The present invention relates to an optical semiconductor device and a manufacturing method thereof. Background technique [0002] In the manufacturing process of optical semiconductor devices such as LEDs, semiconductor lasers, and light-receiving devices, a lead frame is usually punched out using a pressed steel plate, an optical semiconductor element is placed on the lead frame, and then the optical semiconductor element and the above-mentioned lead frame are sealed with a resin. part of the process. [0003] In such a manufacturing process, when the lead frame is punched out using a pressed steel sheet, burrs are generated in the direction of punching in the film-forming part, and in the process of sealing the optical semiconductor element and a part of the lead frame with resin, , The surface tension of the resin is transmitted in the flash generated in the die-cut part and swells in the lead frame, and the swelled resin in the lead frame sometim...
Claims
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IPC IPC(8): H01L23/495H01L21/48
CPCH01L24/97H01L2224/48091H01L2224/48247H01L2924/00014H01L33/62
Inventor 大熊弘明大野泰弘
Owner STANLEY ELECTRIC CO LTD