Process chamber device and epitaxial equipment with it

Abstract

The invention discloses a process chamber device and epitaxial equipment with the process chamber device. The process chamber device comprises: a top cap and a bottom cap; an inner quartz tube, which is located between the top cap and the bottom cap and provided with exhaust holes, and defines a process chamber together with the top cap and the bottom cap; a graphite sleeve positioned between the top cap and the bottom cap and sleeved outside the inner quartz tube, with an exhaust path defined between the graphite sleeve and the inner quartz tube, communicated with the outside, and communicated with the process chamber through the exhaust holes; and an outer graphite sleeve positioned between the top cap and the bottom cap and sleeved outside the graphite sleeve, with a cooling channel defined between the outer graphite sleeve and the graphite sleeve and communicated with the outside. According to the process chamber in embodiment of the invention, temperature field distribution in the process chamber can be improved, and ultimately, uniformity of the radial temperature in the process chamber and further in a substrate can be realized. Also, the maintenance frequency and the maintenance cost of the graphite sleeve can be reduced.

Description

technical field

[0001] The invention relates to a process chamber device and epitaxial equipment with the process chamber device. Background technique

[0002] Epitaxial equipment, that is, equipment used to grow epitaxial layers on substrates, such as MOCVD equipment, is a key equipment for producing LED (light emitting diode) epitaxial wafers. By adjusting the process gas and process time, epitaxy equipment can be used to deposit various thin films on the LED substrate, including the multi-quantum well structure that determines the luminous performance of the LED chip. In the process of depositing multiple quantum wells, in order to ensure the uniformity of the film, the temperature uniformity of the substrate surface is generally required to be extremely high.

[0003] The process time of epitaxial equipment is generally long, and in a typical situation, it takes 5-6 hours to complete a complete process. In order to improve the production efficiency of epitaxial equipme...

Examples

Embodiment Construction

[0028] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0029] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientations or positional relationships indicated by "vertical", "horizontal", "top", "bottom", "inner" and "outer" are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and Simplified descriptions, rather than indicating or implying that the device or element refe...

technical field

[0001] The invention relates to a process chamber device and epitaxial equipment with the process chamber device. Background technique

[0002] Epitaxial equipment, that is, equipment used to grow epitaxial layers on substrates, such as MOCVD equipment, is a key equipment for producing LED (light emitting diode) epitaxial wafers. By adjusting the process gas and process time, epitaxy equipment can be used to deposit various thin films on the LED substrate, including the multi-quantum well structure that determines the luminous performance of the LED chip. In the process of depositing multiple quantum wells, in order to ensure the uniformity of the film, the temperature uniformity of the substrate surface is generally required to be extremely high.

[0003] The process time of epitaxial equipment is generally long, and in a typical situation, it takes 5-6 hours to complete a complete process. In order to improve the production efficiency of epitaxial equipme...

Examples

Embodiment Construction

[0028] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0029] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientations or positional relationships indicated by "vertical", "horizontal", "top", "bottom", "inner" and "outer" are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and Simplified descriptions, rather than indicating or implying that the device or element refe...

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