Poly(arylene ether) composition, method, and article

A technology of arylene ether, composition, applied in the field of cured poly(arylene ether) composition, and products, can solve the problem of small increase in toughness and the like

Inactive Publication Date: 2012-10-03
SABIC INNOVATIVE PLASTICS IP BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

On the other hand, when using low molecular weight poly(arylene ether), the poly(arylene ether) can be dissolved into the epoxy resin at low temperature, but a small increase in toughness is observed in the cured product

Method used

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  • Poly(arylene ether) composition, method, and article
  • Poly(arylene ether) composition, method, and article
  • Poly(arylene ether) composition, method, and article

Examples

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Embodiment 1-10

[0229] Embodiment 1-10, comparative example 1-12

[0230] Ten inventive examples illustrating the use of difunctional low molecular weight poly(arylene ether) in epoxy resins are compared with the following comparative examples: 7 illustrate monofunctional low molecular weight poly(arylene ether) ) in epoxy resin, 4 comparative examples illustrating the use of non-functional low molecular weight poly(arylene ether) in epoxy resin, and 1 comparative example using only epoxy resin. The bisphenol A diglycidyl ether ("BPA Epoxy") was obtained from The Dow Chemical Company as DER 332 epoxy resin. The three bifunctional poly(arylene ether) resins are labeled "PPE, 0.12, bifxl.", "PPE, 0.09, bifxl.", and "PPE, 0.06, bifxl.", where "0.12," "0.09" , and "0.06" refers to the intrinsic viscosity of the resin in deciliters per gram. The two monofunctional poly(arylene ether) resins are labeled "PPE, 0.12monofxl." and "PPE, 0.12monofxl.", while the nonfunctional acetic anhydride-terminat...

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Abstract

A curable composition includes an epoxy resin and a bifunctional poly(arylene ether) having an intrinsic viscosity of about 0.03 to about 0.2 deciliter per gram. After curing, the composition exhibits markedly improved impact strength relative to a corresponding composition prepared from mono functional poly (arylene ether). The composition is particularly useful for preparing electronic laminates, prepregs, and circuit boards.

Description

[0001] This application is based on the filing date of July 26, 2007, the priority date of September 15, 2006, the application number is 200780034378.1 (PCT / US2007 / 074432), and the title of the invention is: "cured poly(arylene ether) ) Compositions, methods, and articles of manufacture" is a divisional application of the patent application. Background technique [0002] Epoxy resins are high performance materials used in a wide variety of applications including protective coatings, adhesives, electronic laminates (such as those used in the manufacture of computer printed circuit boards), flooring and paving applications, glass Fiber-reinforced tubes, and automotive components (including leaf springs, pumps, and electronic assemblies). In their cured form, epoxy resins provide desirable properties, including good adhesion to other materials, excellent resistance to corrosion and chemicals, high tensile strength, and good electrical resistance. Two challenges associated with t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08L71/12C08G59/62
CPCH05K1/0326C08L71/12C08L63/00C08G59/621C08L2666/22C08L2666/14
Inventor 埃里克.R.德尔斯曼郭桦爱德华.N.彼得斯
Owner SABIC INNOVATIVE PLASTICS IP BV
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