Step-by-step type electrochemical polishing device

Abstract

The invention discloses a step-by-step type electrochemical polishing device which comprises a power supply, an electric polishing device, a pump, an electrolytic cell, an electrolyte, a suction apparatus, a workpiece and a grinding head, wherein the workpiece is connected with the positive pole of the power supply, the workpiece is internally provided with the electrolyte, one end of the suction apparatus is soaked in the electrolyte of the workpiece, the other end of the suction apparatus is soaked in the electrolyte of the electrolytic cell, the pump is connected with the electrolyte, one end of the electric polishing device is connected with the negative pole of the power supply, the other end of the electric polishing device is connected with the pump, the grinding head is arranged on the electric polishing device, and the grinding head is soaked in the electrolyte of the workpiece. According to the step-by-step type electrochemical polishing device, the power supply, the electric polishing device, the pump and the workpiece are connected into a closed loop by the electrolyte, and the closed loop generates current after the power supply is switched on, so that the polishing machining can be carried out on the workpiece; and the step-by-step type electrochemical polishing device is simple in structure, convenient and fast in operation, high in machining efficiency and favorable for commercial production.

Description

technical field [0001] The invention relates to the field of workpiece polishing, in particular to an electrochemical polishing device. Background technique [0002] Polishing refers to the use of flexible polishing tools and abrasive particles or other polishing media to reduce the roughness of the workpiece surface in order to obtain a bright and flat surface, while most of the current market uses mechanical polishing devices. That is, polishing is carried out on a special polishing machine, and the grinding marks are eliminated by the relative grinding and rolling action between the extremely fine polishing powder and the grinding surface to achieve polishing. However, most of the mechanical polishing cannot polish and level the small recesses of the workpiece, and the cost of mechanical polishing is high, and the processing efficiency is not high. Contents of the invention [0003] Purpose of the invention: The purpose of the present invention is to solve the deficien...

AI Technical Summary

Problems solved by technology

However, most of the mechanical polishing cannot polish and level the small concave parts of the workpiece, and the cost of mechanical polishing is high, and the processing efficiency is not high

Images