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Circuit board provided with embedded type conducting element and application thereof

A technology of conductive components and circuit boards, applied in the direction of printed circuit components, etc., can solve the problems of not having transmission current, etc., achieve the effect of expanding the application range and meeting the work requirements

Inactive Publication Date: 2012-10-03
敬鹏(常熟)电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen that this circuit board can only meet the requirements of heat transfer and does not have other functions such as transmitting current, so it is necessary to improve

Method used

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  • Circuit board provided with embedded type conducting element and application thereof
  • Circuit board provided with embedded type conducting element and application thereof
  • Circuit board provided with embedded type conducting element and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] please see Figure 1 to Figure 3 , a circuit board body 1 is given, and the circuit board body 1 is provided with mounting holes penetrating from one side of the circuit board body 1 to the other side and the number is not limited to the number shown in the figure (the figure is one) 12 ( figure 2 Shown), a conductive element 11 is embedded in the mounting hole 12. Preferably, the conductive element 11 is made of a metal material with high conductivity, and copper is used to make the conductive element 11 in this embodiment. Preferably, an electroplating layer 121 is bonded to the inner wall of the mounting hole 12 by electroplating. When the conductive element 11 is embedded in the mounting hole 12 , the surface of the edge of the conductive element 11 is in close contact with the electroplating layer 121 . Moreover, it can be seen from the figure that the installation hole 12 is a circular hole, and the conductive element 11 is a button-shaped disc body.

[002...

Embodiment 2

[0026] See Figure 4 On the side wall of the conductive element 11 in the circumferential direction, that is, on the surface of the edge portion, a group of pressing flanges 111 protruding from (protruding from) the surface of the edge portion are formed at equal intervals. When the conductive element 11 is embedded in the installation hole 12, the pressing flange 111 is in close contact with the electroplating layer 121 on the wall of the mounting hole 12, such a structure can make the cooperation effect between the conductive element 11 and the mounting hole 12 more reliable. All the other are the same as the description of embodiment 1 .

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Abstract

The invention relates to a circuit board provided with an embedded type conducting element, and belongs to the technical field of circuit boards used for transferring heavy current. The circuit board comprises a circuit board body, wherein the circuit board body is embedded with one or more than one conducting element which are used for implementing connection with two adjacent electronic elements arranged on the circuit board body in an embedded mode and transferring current for the two adjacent electronic elements. The circuit board provided by the invention has the advantages that the circuit board body is embedded with the conducting elements, the electronic elements arranged on the circuit board body realize heavy current transmission by virtue of conducting elements, the job requirements of different electronic equipment are met, and the application range is expanded.

Description

technical field [0001] The invention belongs to the technical field of circuit boards for transmitting large currents, in particular to a circuit board with embedded conductive elements, and also relates to its application . Background technique [0002] Circuit boards with embedded elements in the prior art are usually used for heat dissipation, which can be confirmed by the "embedding method of heat-conducting elements on circuit boards" recommended by the not limited Chinese invention patent application publication number CN101384134A, which is First process a mounting hole on the circuit board, then electroplate the inner wall of the mounting hole and the surroundings of the mounting hole to form a first electroplating layer, and then place a metal one with outwardly protruding pressure on the side edges around it. The heat conducting sheet of the block is embedded in the installation hole through the guide device, and the outer edge part of the pressing block enters ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
Inventor 林万礼郑嘉振彭成荣林昌辉许今耀
Owner 敬鹏(常熟)电子有限公司