Method for producing sensor unit

Abstract

The invention discloses a method for producing a sensor unit. The method comprises the following steps: providing a substrate, each sensor area on the substrate comprising at least two independent circuit areas, and a signal emitter and a signal detector being respectively arranged on the at least two circuit areas of each sensor area; forming a packaging structure on the substrate by utilizing a mould, the packaging structure covering the signal emitter, the signal detector and a cutting area defined between each circuit area; performing a cutting step along the cutting area defined between each circuit area to form separating cut channels between the at least two circuit areas until the substrate is exposed; and assembling a separator on each sensor area, and disposing the separator on the separating cut channel with the substrate exposed to separate the signal emitter and the signal detector in each sensor area. The method is simple in process, and saves costs.

Description

technical field [0001] The invention relates to a method for manufacturing a sensor unit, in particular to a method for manufacturing a distance sensor unit. Background technique [0002] With the development of electronic products, many types of input devices are currently available for performing operations in electronic systems, such as buttons or keys, mice, trackballs, touch screens, and so on. Recently, the application of touch screen is more and more common. The touch screen may include a touch panel, which may be a transparent panel with a touch-sensitive surface, so that the working surface covers the viewable area of ​​the display screen. The touch screen allows the user to make a selection and move a cursor by touching the display screen with a finger or a stylus, and to realize calculation actions according to touch events. Infrared proximity sensors (IR proximity sensors) are widely used in handheld communication devices to detect the distance between the user'...

AI Technical Summary

Problems solved by technology

However, the above-mentioned structure has the following defects: the manufacture and structure of the metal frame are complex; and the packaging structure needs to be glued, and the above-mentioned metal frame is fixed by glue, but the glue coating is not easy to control, too much glue will Causes the problem of overflowing glue; too little glue, the metal frame is not well fixed, easy to fall off or shift, which will lead to poor signal isolation

[0005] Furthermore, under the trend of reducing the size of components, the metal frame and packaging structure must have a very high precision, so that they can be assembled with each other to form a sensor unit with high isolation effect, so the difficulty of the process is greatly increased, and the product’s The yield rate cannot be effectively improved

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