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Heat sink material

A heat dissipation and base material technology, applied in the direction of electrolytic coating, thin material processing, coating, etc., can solve problems such as difficulty in correspondence, shape limitation of heat dissipation materials, etc.

Active Publication Date: 2015-04-22
NIPPON PRECISION JEWEL IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] However, in the case of surface treatment with diamond grains by the CVD method, it is necessary to perform the treatment under high temperature conditions, so there may be problems with the heat resistance of the treatment object.
In addition, in the case of press molding, it is necessary to form a mold frame and it is difficult to cope with complex shapes, so the shape of the obtained heat dissipation material will be limited.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0067] use Figure 7 The indicated electroplating device (the anode material is an electrolytic nickel plate) uses a stainless steel plate (20mm×20mm×0.5mm) as a base material, and the heat dissipation material of Example 1 is prepared according to the operation method described below.

[0068]

[0069] Diamond particles manufactured by Element Six Ltd. with an average particle diameter of 25 μm were dispersed in a nickel plating solution having a composition shown in Table 1 below so that the dispersion amount was 50 g / liter. Set the current density to 8A / dm 2 Then, a plating treatment was performed for 300 minutes to obtain a composite plating film having a predetermined total plating film thickness of 500 μm. During the formation of the composite electroplating film, the stirring speed is gradually changed from 500rpm to 150rpm, so that the eutectoid density of the diamond particles is gradually increased from the substrate surface side to the film surface side from 0vol...

Embodiment 2

[0073] use Figure 7 The electroplating device shown (the anode material is an electrolytic copper plate) uses a stainless steel plate (20mm×20mm×0.5mm) as a base material, and the heat dissipation material of Example 2 is produced according to the operation method described below.

[0074]

[0075] Diamond particles with an average particle diameter of 25 μm manufactured by Element Six Ltd. were dispersed in a copper electroplating solution having a composition shown in Table 2 below so that the dispersion amount was 50 g / liter. The current density was set at 0.1-6A / dm2 and electroplating was performed for 540 minutes to obtain a composite electroplating film with a predetermined total electroplating film thickness of 500 μm. During the formation of the composite electroplating film, the stirring speed is gradually changed from 600rpm to 50rpm, so that the eutectoid density of the diamond particles is gradually increased from the substrate surface side to the film surface s...

Embodiment 3

[0079] use Figure 7 The electroplating device shown (the anode material is an electrolytic nickel plate) uses a stainless steel plate (20mm×20mm×0.5mm) as a base material, and the heat dissipation material of Example 3 is prepared according to the following operation method.

[0080] Diamond particles with an average particle diameter of 25 μm manufactured by Element Six Ltd were dispersed in a nickel plating solution having a composition shown in Table 3 below so that the dispersion amount was 50 g / liter. Set the current density to 8A / dm 2 Then, a plating treatment was performed for 290 minutes to obtain a composite plating film having a predetermined plating film thickness of 490 μm. During the formation of the composite electroplating film, the stirring speed is gradually changed from 500rpm to 150rpm, so that the eutectoid density of the diamond particles gradually increases from 0vol% to 35vol% from the surface side of the substrate to the surface side of the film. Grad...

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Abstract

To provide a heat sink material that not only is excellent in heat sink properties, but also allows molded articles of various shapes made of a variety of materials to be used as a base substrate of the heat sink material. The heat sink material is also excellent in durability when in use as a heat sink material and can be thinned, and can be conveniently utilized for semiconductor devices, particularly for cell phones, personal computers and the like. The heat sink material includes a composite electroplated film having a plated metal film as a matrix wherein diamond particles are co-deposited in the matrix in such a way that a co-deposition amount of the particles gradually changes in a thickness direction of the plated metal film.

Description

technical field [0001] The present invention relates to heat-dissipating materials, and more specifically to heat-dissipating materials that not only exhibit excellent heat-dissipating properties but also can use molded articles made of various shapes and materials as mobile bodies, especially as It is used as the substrate of heat dissipation materials such as vehicles and automobiles. In addition, it is also excellent in durability as a heat dissipation material, and because it can also be thinned, it is used as a semiconductor device, especially as a mobile phone and In particular, heat-dissipating materials such as personal computers can be preferably used. Background technique [0002] Conventionally, in order to efficiently dissipate the heat generated by the electronic components in the device to the outside during operation, a heat dissipation material is arranged in the device. Diamond is used in such heat-dissipating materials as a substance excellent in heat diss...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D15/02H01L23/373
CPCH01L2924/0002Y10T428/12458H01L23/3736C25D15/00H01L2924/09701H01L23/373H01L23/3732H01L23/3735H01L2924/00
Inventor 仲川和志中村宜弘山本晋也松村宗顺
Owner NIPPON PRECISION JEWEL IND
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