Method and system for processing of overlapping copper foil
A technology of copper foil and network attributes, applied in the direction of electrical digital data processing, special data processing applications, instruments, etc., can solve the problems of reduced work efficiency, slow response of fast tools, and low efficiency, so as to improve work efficiency and improve response speed Effect
Active Publication Date: 2012-11-14
BYD CO LTD
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Problems solved by technology
[0004] However, the inventors of the present invention have found that it is inefficient to manually process overlapping copper foils one by one.
In the case of increasingly complex hardware product design and more and more PCB board layers, the slow response of fast tools will greatly reduce our work efficiency
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[0034] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0035] Please refer to figure 1 As shown, the first method for processing overlapping copper foils provided by the present invention, the method may include the following steps:
[0036] S11. Extracting all the copper foils in any electrical layer;
[0037] S12. According to the network property of the copper foil to be processed, select the copper foil having the same network property as the copper foil to be processed;
[0038] S13. Perform an OR operation on all the copper foils in the selected electrical layer having the same network properties as the copper foils to be processed, to obtain...
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The invention provides a method for processing of overlapping copper foil, which comprises the following steps of: S11, extracting all copper foil in any electrical layer; S12, selecting copper foil with the same network properties as copper foil to be processed according to the network properties of the copper foil to be processed; S13, performing OR operation on all the copper foil with the same network properties as the copper foil to be processed in the selected electrical layer to obtain a copper foil overlapping region; S14, removing all the copper foil with the same network properties as the copper foil to be processed in the selected electrical layer, and generating new copper coil in the region; and S15, adding network properties to the newly generated copper foil in the electrical layer. The invention also provides a system for processing of the overlapping copper foil. According to the method for processing of the overlapping copper foil, automatic processing of the overlapping copper foil in each electrical layer can be realized, the response speed of rapid tools can be improved, and the working efficiency of ECAD (electronic computer aided design) engineers in processing of the overlapping copper foil can be greatly increased.
Description
technical field [0001] The invention belongs to the field of electrical design, in particular to a method and system for processing overlapping copper foils. Background technique [0002] Electrical design software (ECAD, Electronics Computer Aid Design) is a CAD software for electrical engineering design running on a microcomputer. This software can easily draw, calculate and generate primary and secondary drawings of electrical engineering. In the process of designing a printed circuit board (PCB, Printed Circuit Board) project, ECAD engineers will always involve the treatment of copper foil, such as the treatment of copper foil at the impedance line to the ground network. Therefore, it is necessary to repeatedly hollow out and fill the copper foil, which will produce many independent ground network copper foils, so that these ground network copper foils will be partially overlapped, and even a large area will overlap with the network copper foil. As a result, the running...
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Inventor 赵瑞樊晓波
Owner BYD CO LTD