Robot system
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- YASKAWA DENKI KK
- Publication Date
- 2012-11-14
- Estimated Expiration
- Not applicable Β· inactive patent
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Abstract
Description
technical field
[0001] The present invention relates to robotic systems for handling substrates. Background technique
[0002] Conventionally, there is known a robot system for carrying a substrate such as a semiconductor wafer or a glass substrate (hereinafter referred to as "wafer") accommodated in a storage case to a specific position.
[0003] There has also been proposed a robot system in which the positions of individual wafers stored in cassettes in multiple levels are sensed by sensors to detect protruding wafers or wafers stored obliquely (see, for example, Japanese Patent Application Publication No. 2010 -219209).
[0004] However, the conventional robot system suffers from the problem that it is not always possible to efficiently unload the wafers stored in the cassettes.
[0005] For example, there is a possibility that a conventional robot system cannot efficiently unload wafers because when normally stored wafers are unloaded from a storage cassette by an unl...