Thin film for vacuum sucking wafer, wafer sucking device and vacuum sucking grinder

A vacuum adsorption and grinding head technology, applied in grinding equipment, grinding machine tools, transportation and packaging, etc., can solve problems such as wafer contamination, wafer damage, manufacturing process errors, etc., to improve wafer pass rate, improve time and human effect
CN1233506CInactive Publication Date: 2005-12-28UNITED MICROELECTRONICS CORP
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
UNITED MICROELECTRONICS CORP
Publication Date
2005-12-28
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

A film for vacuum adsorption to crystal wafer is suitable for the grinding head. Its apparatus has a main sheet body and several microparticles arranged at the positions on said main sheet body, where are corresponding to the holes on the adsorbing plate of grinding head. Said microparticles are used to adsorb wafer with lower adsorptive power and higher reliability.
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Description

technical field

[0001] The invention relates to a semiconductor transmission device, and in particular to a membrane (Membrane) for vacuum adsorption wafers. Background technique

[0002] The mechanism used in the current wafer transfer system includes various methods, among which the method of using vacuum to absorb and hold wafers has been widely used. Taking the evolution of Chemical Mechanical Polishing devices as an example, please refer to figure 1 and figure 2 , and match the description below.

[0003] figure 1 Shown is a partial schematic diagram of a known chemical mechanical polishing device.

[0004] Please refer to figure 1 , the known chemical mechanical polishing device includes a polishing head (Polishing Head) 100 and a polishing platform (Polishing Table) 110, and a layer of polishing pad (Polishing Pad) 120 is covered on the polishing platform 110. Wherein, the grinding head 100 includes a chuck 102 for fixing the wafer 108, and there is also a laye...

Claims

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