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Semiconductor encapsulation structure

A packaging structure, semiconductor technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of semiconductor grain loss of function, moisture infiltration, poor adhesion, etc.

Inactive Publication Date: 2015-07-08
ZHANJING TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the position where the reflective layer is set will be in contact with the electrode electrically connected to the semiconductor crystal grain. The electrode is made of metal, and the reflective layer is made of plastic. The adhesion between the two materials Poor, so there is often moisture infiltration at the interface between the two, resulting in loss of functionality of the semiconductor grains

Method used

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  • Semiconductor encapsulation structure
  • Semiconductor encapsulation structure
  • Semiconductor encapsulation structure

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Embodiment Construction

[0021] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0022] see figure 1 , is a cross-sectional view of the first embodiment of the semiconductor package structure of the present invention, the package structure 10 includes a substrate 12 , at least one semiconductor die 14 , a conductive adhesive layer 16 and a fluorescent layer 18 . The substrate 12 includes a first electrode 122 , a second electrode 124 and a reflective layer 126 . The first electrode 122 and the second electrode 124 are symmetrically arranged left and right, and have a top surface 1222, 1242 respectively, and the reflective layer 126 is arranged on the top surfaces 1222, 1242 of the first and second electrodes 122, 124 superior. The material of the reflective layer 126 can be reflective material or polymer material, for example, PPA (Polyphthalamide) plastic or epoxy resin material. The conductive adhesive layer 16 is disposed inside the reflect...

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Abstract

The invention provides a semiconductor encapsulation structure, which comprises a base plate, at least one semiconductor crystal particle, one conducting glue layer and a fluorescence layer, wherein the base plate comprises a first electrode, a second electrode and a reflection layer, the reflection layer is arranged on the first electrode and the second electrode, the conducting glue layer is arranged inside the reflecting layer and covers the first electrode and the second electrode, the semiconductor crystal particle is fixedly arranged on the first electrode and the second electrode through the conducting glue layer and forms the electric connection, and the fluorescence layer is arranged on the conducting glue layer and covers the semiconductor crystal particle. The invention provides a manufacture process for manufacturing the semiconductor encapsulation structure.

Description

technical field [0001] The invention relates to a semiconductor packaging structure, in particular to a semiconductor packaging structure with better adhesion. Background technique [0002] The LED industry of semiconductor packaging is one of the most watched industries in recent years. So far, LED products have energy saving, power saving, high efficiency, fast response time, long life cycle time, and do not contain mercury, and have environmental protection benefits, etc. advantage. However, in order to increase the luminous efficiency due to the semiconductor packaging structure of the LED, a reflective layer is provided. The reflective layer mainly surrounds the semiconductor crystal grain (that is, the LED chip) to reflect the light emitted by the semiconductor crystal grain, so as to produce the effect of concentrating the light and increasing the luminous brightness. However, the position where the reflective layer is set will be in contact with the electrode elect...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/56H01L33/62H01L33/00
Inventor 张超雄
Owner ZHANJING TECH SHENZHEN