Bluetooth headset circuit board

Abstract

The invention provides a bluetooth headset circuit board, which comprises a signal layer S1, a ground layer G, a power layer P and a signal layer S2 from top to bottom, wherein the radio frequency signal layer and the voice frequency signal layer in the bluetooth headset circuit board are respectively arranged on the signal layer S1 and the signal layer S2, and the radio frequency signal layer and the voice frequency signal layer are partitioned by the ground layer G and the power layer P; on the voice frequency signal layer, the voice frequency routes implement the principle of difference routes, and a power supply for supplying power for a voice frequency circuit also uses the manner of difference; and moreover, the difference routes have equal length, equal thickness, equal distance between routes in parallel. The signal interference is comprehensively reduced from signal layer layout, microphone end and loudspeaker end by using the bluetooth headset circuit board provided by the invention, and the tone quality of bluetooth headsets is improved.

Description

technical field [0001] The invention relates to the technical field of bluetooth earphones, and more specifically, to a noise reduction circuit board used in bluetooth earphones. Background technique [0002] The improvement of the degree of social informatization enables people to communicate and communicate anytime and anywhere. With the application of earplug-type communication earphones such as monophonic bluetooth earphones and stereo communication earphones, users can continue their work while communicating. As a short-distance wireless communication technology with low cost and low power consumption, Bluetooth products and wireless technology applications have been rapidly and widely popularized. Bluetooth headsets have gradually become the most widely used Bluetooth technology in daily life. Through Bluetooth headsets, mobile phone users A wireless hands-free function can be achieved without having to hang a wire from the head to the mobile phone as it is now. [0...

AI Technical Summary

Problems solved by technology

Due to the existence of power supply ripples, pulses, and surges, the noise caused by the power supply is easily coupled into the audio signal

[0007] 2. The interference of the grounding system to the audio signal

Since the PCB area of ​​the Bluetooth headset is relatively small, the area of ​​the ground will also be relatively reduced, resulting in ground bounce, unstable ground plane, and slow signal return, which can easily affect the audio signal.

[0008] 3. Mutual interference between devices inside the earphone and between circuit traces

Since the distance between the internal components of the Bluetooth headset is relatively close, and the wiring is relatively close, some sensitive signals are likely to be interfered by clock and radio frequency signals

[0009] 4. TDMA noise, the noise from GSM with a frequency of 217HZ, because GSM is a duplex mode of communication, as long as there is communication, there will be interference

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