Grounding structure, and heater and chemical vapor deposition apparatus having the same

A grounding structure, grounding connector technology, applied in gaseous chemical plating, connecting parts protective grounding/shielding device, connection, etc., can solve the problems of shortening the life of the heater, unstable initial bonding force, etc., to reduce maintenance costs. Effect

Inactive Publication Date: 2012-11-21
KOMICO
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0007] According to the general theory of screw bonding, the ground connector is fixed on the elastic seat by the initial engagement force caused by the tension of the bolt, so there is a problem: due to the thermal expansion of the ground connector, The initial engagement force is unstable
Therefore, a momentary spark between the ground connector and the resilient seat will generally shorten the life of the heater

Method used

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  • Grounding structure, and heater and chemical vapor deposition apparatus having the same
  • Grounding structure, and heater and chemical vapor deposition apparatus having the same
  • Grounding structure, and heater and chemical vapor deposition apparatus having the same

Examples

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Embodiment Construction

[0037] Various example embodiments will be described more fully hereinafter with reference to the accompanying drawings, in which some example embodiments are shown. This invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these example embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity.

[0038] It will be understood that when a component or layer is referred to as being "on," "coupled to," or "connected to" another component or layer, it can be directly on the other component or layer. layer to, connected to, or coupled to, another component or layer, or with intervening elements or layers. In contrast, when a component is referred to as being "directly on," "directly coupled to" or "directl...

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PUM

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Abstract

The present invention relates to a grounding structure, and a heater and a chemical vapor deposition apparatus having the same. The grounding structure comprises: a grounding mount having a housing for receiving a grounding connector that serves to guide a ground current to a ground receiver; a grounding clamp located at the housing, the grounding clamp having a cylindrical form with an open portion to communicate inside and outside and holding a grounding connector in such a manner as to bring the surface and inner surface of the grounding connector into contact with each other; a pair of jaws protruding from the outer surface close to the open portion and extending in parallel with the outer surface, while keeping a distance from each other as much as the width of the open portion; an interference reinforcing member fastened to the jaws, for reinforcing the bonding force between the grounding clamp and the grounding connector; and a ground wire for connecting the outer surface of the grounding clamp with the grounding mount to transfer the ground current to the grounding mount. By increasing the bonding force between the grounding clamp and the grounding connector, it is possible to restrain the formation of a clearance and thus prevent the damage on the grounding connector due to arcing.

Description

technical field [0001] Example embodiments relate to a ground structure and a heater and chemical vapor deposition apparatus having the same, and more particularly, to a ground structure in a heater for heating a substrate and the ground structure provided therein heaters and chemical vapor deposition equipment. Background technique [0002] Various chemical vapor deposition (CVD) processes are used in the fields of semiconductor devices and flat panel display (FPD) devices to form various thin layers on substrates such as wafers and glass panels through chemical reactions of source gases. [0003] Specifically, according to the recent market trend of light, thin, short, and small electronic products, as the degree of integration increases, in recent integrated circuit devices and FPD devices, the critical dimension or line width decreases, and the plasma Enhanced chemical vapor deposition (PECDV) processes are widely used to form thin layers on substrates because of their ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/205H01R13/648
CPCH01R13/53H01R4/643C23C16/46C23C16/45565C23C16/4586C23C16/509H01R13/648H01L21/205
Inventor 崔正德陆贤美崔镇植
Owner KOMICO
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