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Device for adding binder

A technology of adding devices and binders, which is applied in the field of metamaterials, can solve problems such as inconvenient operation, difficult control, and short time, and achieve the effect of easy use and easy control

Active Publication Date: 2012-11-28
KUANG CHI INST OF ADVANCED TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the dielectric substrate of the existing metamaterial can be manufactured by the manufacturing process of the PCB circuit board, the dielectric substrate manufactured by the existing PCB circuit board processing technology has the problem of small size. For the metamaterial, in some occasions, For example, in the field of base station antennas, its area can reach several square meters or even more than ten square meters. For this, it is necessary to use adhesives to splice multiple metamaterial functional boards, and adhesives are generally solid or semi-solid at room temperature, so It is necessary to melt the adhesive into a liquid at high temperature first, and then carry out the bonding operation as soon as possible. The time is short, difficult to control, and the operation is quite inconvenient.

Method used

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  • Device for adding binder
  • Device for adding binder

Examples

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Embodiment 1

[0020] In the preparation process of metamaterials, for large-area metamaterial functional plates, limited by existing technologies and processing equipment, it is necessary to splice multiple metamaterial functional plates or dielectric substrates, and for splicing, The commonly used method is to use adhesives for bonding. In order to more conveniently realize the splicing of metamaterial functional boards, this embodiment provides an adhesive adding device. For the structural sectional view of the adhesive adding device, please refer to the attached figure 1 , including the device shell, the device shell is composed of a shell cover 1 and a shell 2, the shell cover 2 is circular, and the shell 2 is cylindrical, and the shell cover 1 and the shell 2 are fixedly connected by screws to assemble a hollow cylinder Body-shaped device housing, the shell cover 1 is provided with an upper end opening, the bottom of the housing 2 is provided with a lower end opening, the device housing...

Embodiment 2

[0024] As a preferred embodiment of Example 1, the structural sectional view of the binder adding device in this example can be found in the attached figure 2 , including the device shell, the device shell is composed of a shell cover 1 and a shell 2, the shell cover 2 is circular, and the shell 2 is cylindrical, and the shell cover 1 and the shell 2 are fixedly connected by screws to assemble a hollow cylinder Body-shaped device housing, the shell cover 1 is provided with an upper end opening, the bottom of the housing 2 is provided with a lower end opening, the device housing is nested and fixed by an injection device, and the injection device consists of a cylinder body 3, a nozzle structure 4, a piston 5 and Composed of a push rod 6 fixedly connected to the piston 5, the cylinder body 3 is also designed to be cylindrical, and a solid adhesive epoxy resin 7 is installed in the cylinder body 3, the piston 5 is nested in the cylinder body 3, and the push rod 6 and the piston ...

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Abstract

The invention provides a device for adding a binder. A device shell is arranged outside a material injection device; a heating device is arranged between the device shell and the material injection device and used for heating a binder material filled in the material injection device, so that the solid or semi-solid binder material is smelted into liquid, and a metamaterial functional board is convenient to assemble; and the device has the advantages of convenience in use and simplicity in operation control.

Description

【Technical field】 [0001] The invention relates to the splicing technology of supermaterial functional boards in the field of supermaterials, in particular to an adhesive adding device for splicing supermaterial functional boards. 【Background technique】 [0002] Metamaterial is a kind of composite man-made material. Its basic structure is a metamaterial functional plate with a thickness of millimeter order. The metamaterial functional plate is composed of a dielectric substrate and an artificial microstructure arrayed on the dielectric substrate. The metamaterial plate is passed through a certain The combination of arrangement rules constitutes a metamaterial. The material of the metamaterial dielectric substrate can be selected from ceramics, polymer materials, polytetrafluoroethylene, ferroelectric materials, ferrite materials, ferromagnetic materials, etc., while the artificial microstructure on the dielectric substrate is generally metal copper, Silver and other material...

Claims

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Application Information

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IPC IPC(8): H01Q15/00
Inventor 刘若鹏赵治亚王书文金晶张影
Owner KUANG CHI INST OF ADVANCED TECH