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Metamaterial package method

A packaging method and metamaterial technology, applied in the field of metamaterials, can solve the problems of electromagnetic function design limitations, no electromagnetic function characteristics, etc., and achieve the effect of expanding functional applications

Active Publication Date: 2014-09-03
KUANG CHI INST OF ADVANCED TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, metal microstructures can have artificially designed electromagnetic parameters, resulting in many novel phenomena
[0003] In the existing metamaterial packaging structure, the metamaterial functional plates are stacked or arrayed with each other through separators or adhesives, and there are air gaps or other fillers between the metamaterial functional plates. For the entire metamaterial, the functional properties of the metamaterial It is only determined by each metamaterial functional board, and the air gap or other fillers between metamaterials do not have electromagnetic functional characteristics, and the metamaterial functional board is limited by the selection of dielectric substrate materials, and the electromagnetic function design is also limited

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A metamaterial encapsulation method, comprising the following steps:

[0023] a. Array a plurality of artificial microstructures on a dielectric substrate to form a metamaterial functional board;

[0024] The main function of the dielectric substrate is to adapt to the needs of the application environment in terms of mechanical properties to fix the artificial microstructure array. In the selection of materials, ceramics, polymer materials, PTFE, ferroelectric materials, ferrite materials, ferromagnetic materials, etc. can be used. etc., can be selected according to different application fields. Various metal materials can be selected for the artificial microstructure. By designing the specific structure of each artificial microstructure, the artificial microstructure can show a certain arrangement law as a whole, and then form some special responses to electromagnetic waves to achieve specific functions. application. In this embodiment, an array of metal microstructu...

Embodiment 2

[0032] A metamaterial encapsulation method, comprising the following steps:

[0033] a. Array a plurality of artificial microstructures on a dielectric substrate to form a metamaterial functional board;

[0034] The main function of the dielectric substrate is to adapt to the needs of the application environment in terms of mechanical properties to fix the artificial microstructure array. In the selection of materials, ceramics, polymer materials, PTFE, ferroelectric materials, ferrite materials, ferromagnetic materials, etc. can be used. etc., can be selected according to different application fields. Various metal materials can be selected for the artificial microstructure. By designing the specific structure of each artificial microstructure, the artificial microstructure can show a certain arrangement law as a whole, and then form some special responses to electromagnetic waves to achieve specific functions. application. In this embodiment, an array of metal microstructu...

Embodiment 3

[0042] A metamaterial encapsulation method, comprising the following steps:

[0043] a. Array a plurality of artificial microstructures on a dielectric substrate to form a metamaterial functional board;

[0044] The main function of the dielectric substrate is to adapt to the needs of the application environment in terms of mechanical properties to fix the artificial microstructure array. In the selection of materials, ceramics, polymer materials, PTFE, ferroelectric materials, ferrite materials, ferromagnetic materials, etc. can be used. etc., can be selected according to different application fields. Various metal materials can be selected for the artificial microstructure. By designing the specific structure of each artificial microstructure, the artificial microstructure can show a certain arrangement law as a whole, and then form some special responses to electromagnetic waves to achieve specific functions. application. In this embodiment, an array of metal microstructu...

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PUM

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Abstract

The invention provides a metamaterial package method. Organic resin glue liquid is formed between metamaterial functional boards; and the metamaterial functional boards are fixed and laminated to be packaged through solidification of the organic resin glue liquid. Furthermore, a dielectric material is distributed in a partial region of the organic resin glue liquid, so that the organic resin glue liquid layer has non-uniform dielectric constant distribution; the dielectric constant distribution of the whole metamaterial can be designed by controlling the size and the shape of the partial region and selecting the proper dielectric material; and therefore, an aim of expanding the functional application of the metamaterial can be fulfilled.

Description

【Technical field】 [0001] The present invention relates to the field of metamaterials, in particular to the packaging technology of metamaterials. 【Background technique】 [0002] The so-called metamaterials refer to some artificial composite structures or composite materials with extraordinary physical properties that natural materials do not possess. Through the orderly design of the structure on the key physical scales of the material, it is possible to break through the limitations of some apparent natural laws, thereby obtaining ordinary metamaterial functions beyond the inherent in nature. For example, metamaterials are composed of multi-layer metamaterial functional plates stacked or arrayed. The metamaterial functional plates are composed of a dielectric substrate and a plurality of metal microstructures arranged on the dielectric substrate. Metamaterials can provide various common materials with and without material properties. The size of a single metal microstruct...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q15/00
Inventor 刘若鹏赵治亚法布里齐亚路静
Owner KUANG CHI INST OF ADVANCED TECH
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