A method for forming a selective contact
A selective, contact technology, applied in the direction of photovoltaic power generation, laser welding equipment, electrical components, etc., can solve the problems of increasing complexity and laser system cost, technical complexity, and low throughput
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no. 1 approach
[0024] According to a first embodiment of the present invention, there is provided a method of forming a selective contact for a photovoltaic cell, the method comprising:
[0025] a. forming a doped contact layer on the surface of a semiconductor substrate;
[0026] b. using a laser beam to anneal a portion of the doped contact layer having a 2D pattern corresponding to at least a portion of a corresponding selective contact grid;
[0027] It is characterized in that the laser beam is pulsed and shaped according to the 2D pattern.
[0028] By using laser beams that are pulsed and shaped according to the 2D pattern corresponding to at least one portion of the corresponding selective contact grid, it is no longer necessary to use multiple laser beams to achieve simultaneous irradiation of doped Multiple parts of the contact layer. Obviously, this reduces complexity and laser equipment cost.
[0029] Another advantage of the present invention is that since a significant portio...
example 1
[0066] Conventional emitter contact formation process:
[0067] 1) POCl3 high-temperature furnace diffusion of bulk silicon to form a heavily doped n-type emitter layer
[0068] 2) Phosphosilicate glass etching
[0069] 3) SiNx arc / passivation layer deposition
[0070] 4) Align front side metallization by screen printing
[0071] The selective emitter formation process in the prior art is described as an example in WO 2009 / 128679:
[0072] 1) POCl3 low-temperature furnace diffusion of bulk silicon to form a lightly doped n-type emitter layer
[0073] 2) Selective laser annealing of the emitter layer
[0074] 3) Phosphosilicate glass etching
[0075] 4) SiNx arc / passivation layer deposition
[0076] 5) Align front side metallization by screen printing
[0077] The process of forming a selective emitter according to the present invention:
[0078] 1) POCl3 low-temperature furnace diffusion of bulk silicon to form a lightly doped n-type emitter layer
[0079] 2) Selectiv...
example 2
[0101] Described below is a conventional interdigitated back contact (IBC) solar cell fabrication process with 6 photolithographic steps and a final sintering and annealing step (as in Tom Markvart and Luis Castaner in Elsevier Photovoltaic, Fundamental Principles and application as described in the practical manual):
[0102] 1) FZ wafer with long oxidation life at the beginning
[0103] 2) N+ emitter lithography
[0104] 3) Oxide etching opens the N+ emitter region
[0105] 4) Phosphorus pre-deposition
[0106] 5) P+ emitter lithography
[0107] 6) Oxide etching opens the P+ emitter region
[0108] 7) Boron pre-deposition
[0109] 8) Make the back with a wafer structure (solar cell front side)
[0110] 9) Grow fine oxide or dielectric
[0111] 10) Contact photolithography
[0112] 11) Oxide or dielectric etch to open the contact area
[0113] 12) Level 1 Metallization
[0114] 13) Metal 1 photolithography
[0115] 14) Metal 1 etching
[0116] 15) Precipitation o...
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