Jig and method for repairing ball grid array structured integrated circuit

Abstract

The invention relates to a jig and a method for repairing a ball grid array structure integrated circuit. The jig comprises a jig tray, a spring ring, a silk screen, a locking ring and a pressure reed, wherein a ball grid array structured integrated circuit is arranged in the jig tray and is fixed by the spring ring arranged in the jig tray; the silk screen is covered above the ball grid array structured integrated circuit in the jig tray, so that the pins of the ball grid array structured integrated circuit are located in the screen holes of the silk screen; and the silk screen can be accurately aligned to a bump which is arranged in the jig tray through a notch which is arranged at the outer spherical edge; the locking ring is covered on the silk screen and the screen holes of the silk screen are exposed; the pressure reed arranged on the upper rend of the jig tray tightly locks the locking ring through rotating the locking ring, so as to avoid changing of the alignment position during repairing. According to the jig and the method provided by the invention, the jig is matched with the solder-reflow technique, so that the batch repair and reuse of the ball grid array structured integrated circuit can be realized economically by utilizing the solder-reflow furnaces on the production line for producing the existing electronic circuit boards.

Description

technical field [0001] The invention relates to a jig, in particular to a jig and method for repairing an integrated circuit with a ball grid array structure. Background technique [0002] With the increasing popularity of electronic products such as LED lighting products, MP4, MP5, digital cameras, mobile phones, and computers in modern life, integrated circuit control chips that constitute their circuit structures are widely used. As the functions of integrated circuits become more and more complex and their structures more and more miniaturized, their application fields are becoming more and more extensive. In view of the particularity of the integrated circuit package structure, it can only use solder balls as pins. However, due to the occurrence of defects in the production process, the pins of the integrated circuit are often damaged, and the integrated circuit has to be scrapped when the circuit structure and function are intact, resulting in serious waste and a larg...

AI Technical Summary

Problems solved by technology

[0007] 1. Since the diameter of the ball grid array integrated circuit pins is only 2mm, and the pitch is only 2mm, during the reflow process, the hot air in the reflow oven will blow the solder balls, making the solder balls easy to fall

[0008] 2. After the reflow period, the reflow temperature is high, which will melt the solder balls. During the reflow process, due to the small distance between the solder balls, the pulling effect of the reflow will make several adjacent tubes of the ball grid array integrated circuit The pins melted together, causing a short circuit of these pins, which caused the repair to fail

[0009] It can be seen that the above-mentioned existing repair technology for BGA structure integrated circuits obviously still has inconvenience and defects, and needs to be further improved urgently.

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and the general products do not have a suitable structure to solve the above-mentioned problems. This is obviously related. The problem that the industry is eager to solve

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