Curable resin composition and use thereof
A curable resin and composition technology, applied in the field of curable resin composition, can solve the problems of poor solubility, poor solubility of the composition, and inability to maintain uniformity, so as to improve leveling and reduce surface tension , the effect of good solubility
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
reference example 1
[0346] Add 14.2g of AM-230G, 14.2g of 2-ethylhexyl acrylate, 0.39g of isopropyl xanthate disulfide, 71.05g of hexafluoro-m-xylene, and V-601 into a 100ml pressure-resistant glass bottle 0.21g, sealed and heated at 70°C for 16 hours. The conversion rate of 2-ethylhexyl acrylate was determined by gas chromatography to be 98.6%. The resulting solution is (S1).
Synthetic example 1
[0348] Add 24.22g of the solution (S1) obtained according to the method of Reference Example 1, 0.77g of 2-perfluorohexylethyl acrylate, and 0.052g of V-601 into a 25ml pressure-resistant glass bottle, and heat it at 70°C for 16 Hour. As determined by gas chromatography, the conversion rate of 2-perfluorohexylethyl acrylate was 98.6%. The solvent was distilled off this solution under reduced pressure at 70° C. to recover 6.50 g.
[0349] In addition, the molecular weight Mw was 28,000.
Synthetic example 2
[0351] Add 24.62g of the solution (S1) obtained according to the method of Reference Example 1, 0.37g of 2-perfluorohexylethyl acrylate, and 0.024g of V-601 into a 25ml pressure-resistant glass bottle. After sealing, heat at 70°C for 16 Hour. As determined by gas chromatography, the conversion rate of 2-perfluorohexylethyl acrylate was 94.2%. The solvent was distilled off this solution under reduced pressure at 70° C. to recover 6.50 g.
[0352] In addition, the molecular weight Mw was 27,200.
PUM
| Property | Measurement | Unit |
|---|---|---|
| carbon number | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


