The invention discloses a
polishing pad. The
polishing pad comprises a base material and a
polishing layer arranged on the base material, wherein the base material is formed after infiltration with a water-soluble
adhesive; the polishing layer comprises a
coating body and multiple cylindrical holes, and the
coating body is full of three-dimensional through structure holes; the cylindrical holes are longitudinally distributed in the
coating body; the top end of each cylindrical hole is connected with the top surface of the coating body, and a space is formed between the bottom end of each cylindrical hole and the bottom surface of the coating body; the height of the space is smaller than 1 / 4 of the height of the coating body. The polishing pad can well store chips produced in the storage and polishing process, prevents a polishing
assembly from being scratched and is beneficial to improvement of the polishing effect and long in service life. The invention further discloses a preparation method of the polishing pad. Non-
woven fabric is infiltrated into the water-soluble
adhesive, dried and subjected to hot roller ironing treatment, a surfactant is applied to the back side, then, the surface is coated with a
polyurethane solution, then, the non-
woven fabric enters a coagulation bath and is subjected to
water washing,
drying and surface treatment, and the polishing pad is obtained. The process is simple, the coagulation and
water washing efficiency is high, and the production efficiency is greatly improved.