Polishing pad and preparation method thereof

A polishing pad and polishing layer technology, applied in grinding/polishing equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of low grinding efficiency, high processing needs, low efficiency, etc., and achieve fast solvent exchange speed and water washing time. Short, productive results

Active Publication Date: 2017-06-13
河南惠强新能源材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the polishing pad can prepare polishing pads with various properties according to different types and different materials of substrates, there are many process steps, many process control points, and high processing requirements.
In addition, in the preparation of the polishing layer, there are also problems of solidification, long washing time and low efficiency.
[0006] More importantly, in the existing polishing pads, the holes formed in the coating are uneven in shape, mostly in the shape of water droplets with uneven upper and lower diameters, and the ratio of the height of the holes to the thickness of the coating is small
This type of polishing pad cannot store the debris produced by grinding well during the polishing process, the risk of scratching the surface of the polishing component is high, and the grinding efficiency is low, and the polishing effect is uneven

Method used

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  • Polishing pad and preparation method thereof
  • Polishing pad and preparation method thereof
  • Polishing pad and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0046] A preparation method of a polishing pad, comprising the following steps:

[0047] 1) Prepare the base material; take the preset base material, place it in the water-based glue for roll impregnation; then, remove the excess water-based glue on the surface of the base material, and dry it to obtain a spare base material;

[0048] 2) Substrate pre-treatment: coating the second surfactant on the back of the spare substrate, then drying with a hot roller, and ironing to obtain a molding substrate;

[0049] 3) preparing a polishing layer; configuring a polishing layer composite material, and then coating the polishing layer composite material on the upper surface of the molding substrate; then sequentially performing coagulation bath, washing and drying to obtain a semi-finished product;

[0050] 4) post-treatment: surface treatment is carried out on the semi-finished product.

Embodiment 1

[0052] A polishing pad is prepared according to the following steps:

[0053] 1) The preparation of the polishing pad substrate; the thickness is 2.5mm, and the unit thickness weight (1mm) is 160g / (m 2 .mm) of non-woven fabric, after being impregnated with acrylic water-based latex with a solid content of 8.0% and rolled, the excess liquid on the surface was scraped off, and dried at high temperature. Then use a slicer to divide the impregnated non-woven fabric into two pieces with the same thickness from the thickness direction, and finally polish the two surfaces of the impregnated non-woven fabric with a grinder, wind up and make two pieces with a thickness of 1.1mm and polish The base material of the pad.

[0054] 2) Substrate treatment before coating: sorbitan tristearate (Span 65) with an HLB value of 2.1 was dispersed in acetone with high-speed stirring to form a Span 65-acetone dispersion emulsion with a concentration of 10.0%. Then, use a high-pressure spray gun to ...

Embodiment 2

[0059]A polishing pad is prepared according to the following steps:

[0060] 1) The preparation of the polishing pad substrate; the thickness is 1.4mm, and the unit thickness weight (1mm) is 180g / (m 2 .mm) of non-woven fabrics, after dipping and rolling with polyurethane water-based latex with a solid content of 9.0%, scrape off excess liquid on the surface, and dry at high temperature. Then use a slicer to divide the impregnated non-woven fabric into two pieces with the same thickness from the thickness direction, and finally use a grinder to polish the two surfaces of the impregnated non-woven fabric, wind up two pieces with a thickness of 0.6mm and polish The base material of the pad.

[0061] 2) Substrate treatment before coating: sorbitan monooleate (Span 80) with an HLB value of 4.3 was dissolved in ethanol with high-speed stirring to form a Span 80-ethanol solution with a concentration of 15.0%. Then, use a high-pressure spray gun to spray on the polished surface of t...

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Abstract

The invention discloses a polishing pad. The polishing pad comprises a base material and a polishing layer arranged on the base material, wherein the base material is formed after infiltration with a water-soluble adhesive; the polishing layer comprises a coating body and multiple cylindrical holes, and the coating body is full of three-dimensional through structure holes; the cylindrical holes are longitudinally distributed in the coating body; the top end of each cylindrical hole is connected with the top surface of the coating body, and a space is formed between the bottom end of each cylindrical hole and the bottom surface of the coating body; the height of the space is smaller than 1 / 4 of the height of the coating body. The polishing pad can well store chips produced in the storage and polishing process, prevents a polishing assembly from being scratched and is beneficial to improvement of the polishing effect and long in service life. The invention further discloses a preparation method of the polishing pad. Non-woven fabric is infiltrated into the water-soluble adhesive, dried and subjected to hot roller ironing treatment, a surfactant is applied to the back side, then, the surface is coated with a polyurethane solution, then, the non-woven fabric enters a coagulation bath and is subjected to water washing, drying and surface treatment, and the polishing pad is obtained. The process is simple, the coagulation and water washing efficiency is high, and the production efficiency is greatly improved.

Description

technical field [0001] The invention relates to a multi-layer polishing pad and a preparation method thereof. The polishing pad is applied in the technical field of polishing of chemical mechanical planarization treatment, in particular to the mirror surface treatment of materials such as semiconductor wafers, sapphire windows, optical glass products and various metals process. Background technique [0002] At present, chemical mechanical polishing (CMP) is commonly used for surface mirror treatment of semiconductor wafers, optical glass, sapphire windows and various metals. CMP is a polishing method that combines chemical reaction and mechanical friction. During the polishing process, the rotating polished substrate is pressed against the elastic polishing pad in the same direction as its rotation, and the polishing slurry is between the polishing substrate and the bottom plate. Continuous flow; the upper and lower discs rotate in reverse at high speed, the reaction produc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/22B24B37/24B24B37/26B24D18/00
CPCB24B37/22B24B37/24B24B37/26B24D18/009
Inventor 王晓斌肖志明王松钊蔡朝辉
Owner 河南惠强新能源材料科技股份有限公司
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