Method and system for reconstructing three-dimensional image of electronic speculum

A 3D image and electron microscope technology, applied in image data processing, processor architecture/configuration, 3D modeling, etc., can solve problems such as slow image reconstruction

Active Publication Date: 2013-01-16
INSPUR BEIJING ELECTRONICS INFORMATION IND
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Problems solved by technology

[0008] The invention provides a method and system for reconstructing three-dimensional images of an electron microscope to overcome the defect of relatively slow reconstruction speed of existing images

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  • Method and system for reconstructing three-dimensional image of electronic speculum
  • Method and system for reconstructing three-dimensional image of electronic speculum
  • Method and system for reconstructing three-dimensional image of electronic speculum

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Embodiment Construction

[0033] In order to make the purpose, technical solution and advantages of the present invention more clear, the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined arbitrarily with each other.

[0034] The present invention first analyzes the performance bottleneck of using the SIRT serial method to reconstruct the three-dimensional image of the electron microscope and the difficulty of transplanting the serial method to other high-performance platforms, finds the time-consuming hot code, and tests its performance in the three-dimensional image reconstruction of the electron microscope. The proportion of time taken up in the process and the difficulty of analyzing the performance of improving the overall method and developing the shaft end.

[0035] The test results ...

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Abstract

The invention provides a method and system for reconstructing a three-dimensional image of an electronic speculum. The method for reconstructing the three-dimensional image of the electronic speculum comprises the following steps: a central processing unit (CPU) divides an object in an image to be subjected to iteration reconstruction into slices, and constructs a frame that the CPU cooperatively calculates with a many integrated core (MIC) processor; the CPU schedules all equipment in the frame to obtain reconstruction image values and measurement projection image values of respective current slices in a multi-threading parallel mode, and calculates final reconstruction image values of the current slices through a re-projection algorithm and a back projection algorithm according to the reconstruction image values and the measurement projection image values in sequence till calculating the final reconstruction image values of all slices. According to the method and the system for implementing the electronic speculum three-dimensional image reconstruction, through the cooperative calculation of the CPU and the MIC, the execution of an iteration reconstruction method is greatly accelerated, so that image reconstruction tasks can be rapidly accomplished.

Description

technical field [0001] The present invention relates to image reconstruction technology, in particular to a method and system for electron microscope three-dimensional image reconstruction. Background technique [0002] The many-core (Many Integrated Core, MIC) processor launched by Intel (Intel), compared with the general-purpose multi-core Xeon processor, the MIC many-core architecture has smaller cores and hardware threads, and the computing resource density of the many-core processor is Higher, significantly reduced on-chip communication overhead, more transistors and energy, capable of more complex parallel applications. Intel MIC products are based on the X86 architecture, based on heavy-core many-core processors, including more than 50 cores, and a vector bit width of 512bit, and the double-precision performance exceeds 1TFlops. [0003] The MIC has an extremely flexible programming method. The MIC card can exist as a processor or as an independent node. The basic M...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06T17/00G06T1/20
Inventor 卢晓伟张清
Owner INSPUR BEIJING ELECTRONICS INFORMATION IND
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