Device and method for curing and flattening glue-free soft plate material

Abstract

The invention discloses and provides a device for curing and flattening a glue-free soft plate material, which has the advantages of simple structure, reduction in production cost and superior flatness of a manufactured product, and provides a method for curing and flattening a glue-free soft plate material by applying the device. The device comprises a rewinding machine and a metal heat-conducting plate (1), wherein steel belts (2) are arranged at the two ends of the lower surface of the metal heat-conducting plate (1), and are provided with fine holes (3); in a production process, a soft plate material (4) is attached to the upper surface of the metal heat-conducting plate (1); the metal heat-conducting plate (1) and the soft plate material (4) are tightly coiled on a steel pipe (5) of the rewinding machine for curing; and in a curing process, the soft plate material (4) is always attached to the metal heat-conducting plate (1), and is limited from moving through the metal heat-conducting plate (1), so that flatness is achieved. The device is applied in the field of material flattening.

Description

technical field [0001] The invention relates to a device for curing and smoothing glue-free soft board materials, and also relates to a method for curing and smoothing glue-free soft board materials using the device. Background technique [0002] Adhesive-free flexible board materials have been widely used in the field of circuit board printing due to their unique properties. At present, the characteristics of adhesive-free flexible board materials are required to be smooth, low dimensional change, and high adhesion. In the production process, there must be a curing process for the non-adhesive soft board material. The material will be cured at a high temperature of more than 300 degrees. At that time, the glue coated on the conductor will shrink, and the conductor layer will expand, resulting in unevenness on the surface of the material. It is flat, and the use effect on the application side is poor. Therefore, how to overcome the problem of keeping the flatness of the glu...

AI Technical Summary

Problems solved by technology

This method integrates drying and curing, and requires a high temperature of 300-400 degrees Celsius to achieve it. However, at such a high temperature, it is easy to cause a cyclization reaction of the material, which also causes the surface of the material to be uneven.

[0004] The second method is to use an unwinding machine, which is currently used by most industries. This method only needs a high temperature of 180-200 degrees Celsius during the curing process to avoid cyclization reactions. The method cannot effectively lengthen the length of the material, because the gap and tension cannot be effectively controlled when unwinding

In addition, during the curing process, the inside of the coil is prone to loose and uneven surface and cause surface wrinkles, and even the volatilization of solvent and water during the curing process will cause the materials to adhere to each other, thus reducing the yield rate. Significantly decreased, especially in the production of thin materials

[0005] To sum up, it is difficult to produce flat products with the production method of the non-adhesive flexible board material under the existing technology, which hinders the application and development of the non-adhesive flexible board material

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