Composite phenolic aldehyde fireproofing insulation board
A technology of fireproof insulation board and phenolic board, which is applied in the field of medical equipment, can solve the problems of small adhesion, peeling, and low fireproof performance level, and achieve the effect of improved fireproof performance level and strong adhesion
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Embodiment 1
[0021] Such as Figure 1 to Figure 3 As shown, the composite phenolic fireproof insulation board of this embodiment includes a phenolic board 1, an upper inorganic mortar layer 2 and a lower inorganic mortar layer 3, and grooves 4 are provided on the upper surface 101 and / or lower surface 102 of the phenolic board 1 Each of the grooves 4 is arranged along the length direction of the phenolic board 1 , and adjacent grooves 4 are arranged along the width direction of the phenolic board 1 . The upper inorganic mortar layer 2 covers the upper surface 101 , and the lower inorganic mortar layer 3 covers the lower surface 102 .
[0022] The composite phenolic fire-proof insulation board of this embodiment also includes an upper reinforced inorganic mortar layer 5, a lower reinforced inorganic mortar layer 6, an upper glass fiber mesh cloth layer 7 and a lower glass fiber mesh cloth layer 8, the upper glass fiber mesh The cloth layer 7 is located between the upper inorganic mortar la...
Embodiment 2
[0026] The difference between this embodiment and embodiment 1 is: the thickness of the phenolic board 1 is 50 mm; the depth of the groove 4 is 2.6 mm, and the width is 5.3 mm; the distance between adjacent grooves 4 is 53 mm .
[0027] The tensile bonding strength between the upper inorganic mortar layer or the lower inorganic mortar layer and the phenolic board is 0.096MPa, the adhesion between the inorganic mortar layer and the phenolic board is strong, and no peeling or falling off will occur; in practical applications, the upper surface Or the thickness of the inorganic mortar layer that can be attached to the lower surface (that is, one side) is 1.5 to 4 mm, and the fire performance level is greatly improved.
Embodiment 3
[0029] The difference between this embodiment and embodiment 1 is: the thickness of the phenolic board 1 is 60 mm; the depth of the groove 4 is 2.7 mm, and the width is 5.5 mm; the distance between adjacent grooves 4 is 60 mm .
[0030] The tensile bonding strength between the upper inorganic mortar layer or the lower inorganic mortar layer and the phenolic board is 0.109MPa, the adhesion between the inorganic mortar layer and the phenolic board is strong, and no peeling or falling off occurs; in practical applications, the upper surface Or the thickness of the inorganic mortar layer that can be attached to the lower surface (that is, one side) is 1.5 to 4 mm, and the fire performance level is greatly improved.
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Abstract
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