Method and apparatus for determining acceptance/rejection of fine diameter wire bonding

Abstract

Disclosed are a method and an apparatus for determining acceptance / rejection of fine diameter wire bonding of semiconductor devices, LED devices, and the like at a high accuracy without contact, said acceptance / rejection having not been determined by conventional image inspecting methods and the like. The apparatus is configured of: a heating laser device (1) which spot-heats the bonding portion of the fine diameter wire; a two-wavelength infrared radiation thermometer (2), which corrects an emissivity and measures a temperature at a high speed on the basis of a minute amount of infrared rays radiated from the heated portion of the fine diameter wire; and a correcting / determining means (4), which corrects the measurement results obtained from the two-wavelength infrared radiation thermometer (2) to a temperature change with reference heating power, then determines acceptance / rejection of the bonding by comparing the corrected temperature change or a value correlated to a bonding area obtained on the basis of the corrected temperature change with a temperature change indicated by an acceptable reference product having the temperature change corrected with the reference heating power or a value correlated to a bonding area obtained on the basis of the temperature change indicated by the acceptable reference product.

Description

technical field [0001] The present invention relates to a pass / fail judgment method and a judgment device for small-diameter wire bonding such as gold materials, and more specifically, to a process for connecting elements and lead frames in the manufacture of electronic components such as semiconductor devices and LED devices. A method and apparatus for judging the pass or fail of micro-diameter wire bonding between (lead frames) based on the measurement of the bonding area. Background technique [0002] In general, the joining methods between metals are divided into fusion welding in which joining materials are melted together, pressure welding in which joining materials are joined in a solid state by diffusion of metal atoms, and joining materials in a solid state through Brazing for joining with other solders, and bonding for joining with adhesives. [0003] When considering micro-diameter wire bonding in the manufacture of electronic components, the miniaturization and ...

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Problems solved by technology

[0017] As mentioned above, in the above-mentioned various methods for the pass / fail judgment of the small metal joints to be joined, there are some problems such as lack of quality stability, reliability, evaluation, difficulty in full inspection, and high cost. The problem

Therefore, the object of the present invention is to provide a lead wire with a small diameter that can be provided with high evaluation reliability and relatively low cost and can be evaluated by conventional image inspection methods and the like without such a problem. Pass / fail judgment method and apparatus for micro-diameter wire bonding for pass / fail judgment of bonding state

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