Light-emitting diode (LED) light source module
A technology of LED light source and LED lamp beads, applied in the direction of light source, electric light source, light source fixing, etc., can solve the problems of affecting the stability of phosphor powder, reducing the conversion efficiency of phosphor powder, etc., so as to improve the performance and service life, and improve the service life. , to ensure the effect of work stability
Active Publication Date: 2013-02-13
ZHEJIANG YANKON GROUP
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Problems solved by technology
The LED light source module is mainly composed of LED chips and phosphor layers. In the traditional white LED packaging structure, the phosphor powder is directly coated on the LED chip. When working, the heat released by the LED chip is directly loaded on the phosphor powder, resulting in The temperature rise of the phosphor, the temperature of the phosphor is mainly affected by the heat dissipation of the chip. The closer the phosphor is to the chip, the higher the temperature will be. At high temperatures, the conversion efficiency of the phosphor will decrease
Although the method of coating phosphor far away from the surface of the LED chip can reduce the influence of the heat dissipation of the LED chip on the phosphor, the specific method is to separate the core powder and make a phosphor layer at a suitable distance from the chip surface, which can Reduce the impact of the heat generated by the chip on the stability of the phosphor, but the high-power LED chip emits a lot of heat during operation, which will still affect the stability of the phosphor
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[0016] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0017] As shown in the figure, an LED light source module includes a metal substrate 1 and an LED lamp bead 11 fixedly arranged on the metal substrate 1. A light mixing cover 2 is arranged above the LED lamp bead 11. The light mixing cover 2 is made of fluorescent powder. It is formed by mixing with polycarbonate, PET, polypropylene, polyethylene, acrylic and other plastics and then extruded. The light mixing cover 2 is connected with a cover body cooling assembly, and the cover body cooling assembly includes a radiator 31 and a micropump 32. The light mixing cover 2 There is a first cavity (not marked in the figure) inside, the light mixing cover 2 is integrally provided with a first positioning ear 21 and a second positioning ear 22, and a first opening (not marked in the figure) is opened on the first positioning ear 21 Out), the second pos...
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The invention discloses a light-emitting diode (LED) light source module which comprises a metal substrate and LED lamp beads. The LED lamp beads are fixedly arranged on the metal substrate. The LED light source module is characterized in that a light mixing cover is arranged above the LED lamp beads and connected with a cover body cooling assembly. The LED light source module has the advantages that the LED lamp beads and the light mixing cover are separated so that the temperature of a cover body of the light mixing cover is effectively reduced; and the light mixing cover is connected with the cover body cooling assembly so that the temperature of the cover body of the light mixing cover is further reduced, the service life of the light mixing cover is prolonged, work stability of the light mixing cover is effectively guaranteed, using performances of the LED light source module are improved, and the service life of the LED light source module is prolonged.
Description
technical field [0001] The invention relates to a light source module, in particular to an LED light source module. Background technique [0002] LED is widely used in the field of lighting because of its advantages of energy saving, environmental protection, high brightness, long life and high luminous efficiency. The LED light source module is mainly composed of LED chips and phosphor layers. In the traditional white LED packaging structure, the phosphor powder is directly coated on the LED chip. When working, the heat released by the LED chip is directly loaded on the phosphor powder, resulting in The temperature rise of the phosphor is mainly affected by the heat dissipation of the chip. The closer the phosphor is to the chip, the higher the temperature will be. At high temperatures, the conversion efficiency of the phosphor will decrease. Although the method of coating phosphor far away from the surface of the LED chip can reduce the influence of the heat dissipation ...
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IPC IPC(8): F21S2/00F21V29/02F21V17/00F21Y101/02F21K9/20F21V29/56F21Y115/10
Inventor 李阳马正红
Owner ZHEJIANG YANKON GROUP