Optical unit, method of producing the same, and image pickup apparatus

Abstract

An optical unit includes a plurality of lenses arranged along an optical path from an object side toward an image side, the plurality of lenses including at least one lens including an image side surface and an object side surface, one of which is formed to be an aspheric surface at wafer level, the aspheric surface of the at least one lens being formed to serve as one of an aperture stop surface having an aperture stop function and a light-shielding surface having a light-shielding function.

Description

technical field [0001] The present technology relates to an optical unit employing a wafer-level lens, a method of manufacturing such an optical unit, and an image pickup device. Background technique [0002] In recent years, mobile electronic devices such as cellular phones mount small and thin image pickup devices therein. [0003] Such an image pickup device includes an image pickup element such as a Charge Coupled Device (CCD) or a Complementary Metal Oxide Semiconductor (CMOS) image sensor and a lens system that forms an object image on the image pickup element. [0004] The cell pitch of an image pickup element such as a CCD or a CMOS image sensor is significantly reduced in such an optical system, thus requiring the optical system to have high imaging performance, in which optical aberrations, especially axial chromatic aberration Lower than usual optical systems. [0005] In order to meet cost demands, a wafer-level lens forming technique is known, thereby reducing...

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Problems solved by technology

[0022] In particular, it is difficult to form a uniform film of an IR cut filter on an uneven surface, causing problems such as film unevenness, pinholes, and characteristic failure

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