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Apparatus for plating cylinder

A drum and plating solution technology, which is applied in the field of drum plating equipment, can solve the problems that cannot be called perfect, the hardness of the plating layer decreases, and the temperature rises, so as to eliminate uneven hardness, suppress the vicious cycle, and achieve uniformity Effect

Inactive Publication Date: 2013-02-13
THINK LABORATORY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0020] According to the plating method and device for the cylinder proposed above, the situation that the vicinity of both ends of the cylinder is plated thicker than the straight body can be reliably and greatly suppressed, and the process of uniformizing the plating thickness afterwards can be unnecessary or simplified. Polishing and other treatments, however, cannot be called perfect from the point of view of making the thickness of the plating layer uniform.
The present applicant continued to pursue a technology capable of forming a plated layer with a uniform thickness in the plating technology of a drum, and obtained the following knowledge: During the plating process, heat is accumulated in the drum to become high temperature, and the chuck mechanism for holding the high-temperature drum The edge of the holding side also becomes high temperature, and its holding function decreases, and the uniformity of the rotation of the drum decreases, which in turn leads to a decrease in the uniformity of the thickness of the plating layer.
In addition, when the temperature of the drum rises, copper plating and chromium plating are included, and the hardness of the plating layer decreases. In particular, there is a problem that the hardness of the plating layer on both end surfaces of the drum decreases.
Furthermore, especially if the temperature of the front end portion of the chuck mechanism rises, the front end portion of the chuck mechanism is oxidized and covered with an oxide film, resulting in poor conduction, and since the current flow is deteriorated, if a larger current is to be passed, there is a problem. There will be a problem of a vicious circle in which the temperature of the front end of the chuck mechanism rises, the oxidation intensifies, and the formation of the oxide film increases.

Method used

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  • Apparatus for plating cylinder
  • Apparatus for plating cylinder
  • Apparatus for plating cylinder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] As the gravure cylinder, a cylindrical base material with an aluminum core of 500 mm in circumference and 1100 mm in total length is used. figure 1 The chuck mechanism of the thermal cooling mechanism shown clamps the two ends of the gravure cylinder and assembles it on the plating tank, and the insoluble electrode is approached to the side of the gravure cylinder to 30mm through the sliding mechanism controlled by the computer, so that the copper plating solution overflows , so that the gravure cylinder is completely submerged. Set the rotation speed of the gravure cylinder at 120rpm, the liquid temperature at 40°C, and the current density at 16A / dm 2 (total current 890A, voltage 7V). Such as Figure 8 and figure 2 As shown in , an electrode with a shape in which the lower end portion is bent inward is used. Copper plating was performed under this condition until the thickness was 100 μm. The time required for the plating treatment is about 20 minutes. The end f...

Embodiment 2

[0073] As the gravure cylinder, a cylindrical base material with an aluminum core having a circumference of 430 mm and a total length of 1100 mm was used. Plating was performed in the same manner as in Example 1, and the same results as in Example 1 were obtained.

Embodiment 3

[0075] As a gravure cylinder, except having used the aluminum-cored cylindrical base material of 920 mm in circumference and 1100 mm in total length, plating was performed similarly to Example 1, and the same result as Example 1 was obtained.

[0076] In the above-mentioned embodiment of the invention, an example in which copper plating is performed on the gravure cylinder has been described, but the present invention is not limited to this example, and it is also applicable to the case where chrome plating is performed on the gravure cylinder. It is also applicable to the case of performing plating other than copper plating on the object to be plated. For example, it is also applicable to the case of performing nickel plating on a printing cylinder for roller screen printing.

[0077] In addition, in the embodiment of the invention described above, the thermal cooling mechanism 100 has been described as figure 1 The configuration shown, but known thermal cooling mechanisms su...

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PUM

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Abstract

Provided is an apparatus for plating a cylinder, wherein service life of the whole apparatus can be improved with a technology of plating a cylinder, hardness nonuniformity of the plating layer on the cylinder surface can be eliminated by making the hardness uniform, and oxidation of the tip of a chuck means can be suppressed. The apparatus for plating a cylinder is provided with: a plating tank filled with a plating solution; a chuck means, which stores a long cylinder in the plating tank by rotatably and conductively holding both the cylinder ends in the longitudinal direction; and a pair of insoluble electrodes, which faces each other, is vertically installed to face both the side surfaces of the cylinder in the plating tank, and which has a predetermined current carried thereto. A thermal cooling means is provided in the chuck means, and the cylinder holding section of the chuck means is cooled by making the thermal cooling means have a cooling medium, and circulating the cooling medium, and heat accumulation in the cylinder, especially at the cylinder end portions, and at the cylinder holding section of the chuck means can be eliminated.

Description

technical field [0001] The present invention relates to a method for applying an insoluble electrode as a plate material for plate formation to the outer peripheral surface of a long cylinder, such as a hollow cylindrical gravure cylinder (also called a plate-making roll) used in gravure printing. Plating apparatus for drums such as copper plating or chrome plating, particularly relates to a drum plating apparatus in which a heat cooling mechanism is provided on a chuck mechanism for holding the drum to cool the drum, especially the drum during the plating process. The drum holding portion of the end portion and the chuck mechanism eliminates heat accumulation in the drum, especially in the drum end portion and the drum holding portion of the chuck mechanism, thereby achieving uniform plating treatment on the outer peripheral surface of the drum change. Background technique [0002] In gravure printing, minute recesses (cells) corresponding to plate-making information are f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/06C25D7/00C25D7/04C25D17/08
CPCC25D21/02C25D17/005C25D7/04C25D17/10C25D17/06C25D17/08
Inventor 重田龙男
Owner THINK LABORATORY CO LTD