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Room temperature bonding device and room temperature bonding method

A technology for bonding devices and bonding methods, which is applied in lamination devices, chemical instruments and methods, welding equipment, etc., can solve problems such as defects, and achieve the effects of reducing residual stress and improving quality

Active Publication Date: 2016-04-27
MITSUBISHI HEAVY IND MACHINE TOOL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

MEMS formed by bonding wafers with large waviness often become defective products

Method used

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  • Room temperature bonding device and room temperature bonding method
  • Room temperature bonding device and room temperature bonding method
  • Room temperature bonding device and room temperature bonding method

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Embodiment Construction

[0039] Hereinafter, embodiments of the room temperature bonding apparatus of the present invention will be described with reference to the drawings. The room temperature bonding device includes a room temperature bonding device main body and a room temperature bonding device control device. Such as figure 1 As shown, the main body of the room temperature bonding device includes a load lock chamber 1, a bonding chamber 2, and a heating chamber 3. The load lock chamber 1, the bonding chamber 2, and the heating chamber 3 are containers whose insides are hermetically sealed from the outside environment. The main body of the room temperature bonding device further includes a gate valve 5 and a gate valve 6. The gate valve 5 is provided between the load lock chamber 1 and the joint chamber 2 and forms a first gate connecting the inside of the joint chamber 2 and the load lock chamber 1. The gate valve 5 is controlled by the control device of the joint device to lock the first gate ...

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Abstract

The present invention provides a room temperature bonding method. The room temperature bonding method of the present invention includes: a step of fabricating two activated substrates by activating the two substrates, a step of fabricating a bonded substrate by bonding the two activated substrates, and annealing the bonded substrates. A step for reducing the residual stress of the bonded substrates. According to such a room temperature bonding method, the residual stress of the bonded substrates can be reduced, and the quality can be further improved.

Description

Technical field [0001] The present invention relates to a room temperature bonding device and a room temperature bonding method, and in particular to a room temperature bonding device and a room temperature bonding method used when bonding a plurality of substrates. Background technique [0002] Currently, MEMS (MicroElectroMechanical Systems), which integrates tiny electrical parts and mechanical parts, is known. Examples of the MEMS include micromachines, pressure sensors, and ultra-small motors. The normal temperature bonding in which the surfaces of wafers activated in a vacuum atmosphere are brought into contact with each other and then the wafers are bonded is well known. Such room temperature bonding is preferably used to produce MEMS. MEMS formed by bonding wafers with large waviness often become defective products. It is desired to produce high-quality devices more stably. [0003] (Japan) Japanese Patent Application Publication No. 2003-318219 discloses an installatio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02B23K20/00
CPCH01L21/67092H01L21/67109B23K20/00H01L21/02B32B37/0046
Inventor 津野武志后藤崇之木内雅人井手健介
Owner MITSUBISHI HEAVY IND MACHINE TOOL CO LTD