Apparatus and method for installing chip

Abstract

PROBLEM TO BE SOLVED: To provide a chip mounting device and a chip mounting method. SOLUTION: According to the present invention, a chip mounting device comprises: a first chip mounter on which a working panel with plural arrayed substrate units is loaded, and that has a first feeder station for mounting an entire chip on some of the plural substrate units; a rotary unit rotating the working panel in which a step for mounting a chip to some of the substrate units by the first feeder station is completed; a second chip mounter on which the working panel is loaded, and in which a chip is entirely mounted to the remaining substrate units of the plural substrate units. Also, a chip mounting method is provided. According to the present invention, a process time for recognizing failure of the plural substrate units arrayed on the working panel and mounting the chip can be reduced to improve productivity of a product.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of Korean Patent Application No. 10-2011-0082165, filed on Aug. 18, 2011, entitled "Apparatus and Method for Mounting Chips," which is hereby incorporated by reference in its entirety middle. technical field [0003] The present invention relates to an apparatus and method for mounting a chip, and more particularly, to an apparatus and method for mounting a chip capable of identifying a defective substrate unit among a plurality of substrate units and shortening The processing time required for chip mounting can be reduced, thereby improving product productivity. Background technique [0004] Equipment for mounting chips has been continuously developed in chip mounting speed and chip mounting accuracy, however, the increase in chip mounting speed has lagged behind due to limitations in hardware. [0005] Below, will refer to Figures 1 to 2 A related art is described for an apparat...

AI Technical Summary

Problems solved by technology

[0014] That is, in the related art apparatus and method for mounting chips, the first and second chip mounters 2 and 3 repeatedly perform the same defect identification process, and since the first chip mounter 2 is working along All the plurality of substrate units 15a on the panel 15 mount 50% of the chips 15b on the respective substrate units while moving the first feeder 2a, and then the second chip mounter 3 moves along the working panel 15. All the plurality of substrate units 15a move the second feeder 3a while installing the remaining 50% of the chips 15b on the respective substrate units, so it takes a considerable amount of time to perform defect identification and chip mounting procedures, reducing the processing time. efficiency and productivity

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