Shock absorption mechanism and mobile multimedia broadcast device

Abstract

The invention provides a shock absorption mechanism which comprises an enclosure and a fixed plate fixed below the enclosure, wherein the enclosure comprises at least one curled-up first protruded part which is positioned at the bottom and is provided with three surfaces hollowed out; the fixed plate comprises a curled-up second protruded part which is positioned at the bottom of the fixed plate and provided with three surfaces hollowed out and corresponds to the first protruded part of the enclosure; and the head of the second protruded part abuts against the root of the first protruded part of the enclosure. The invention also provides a mobile multimedia broadcast device using the shock absorption mechanism. The problem of shock during use can be well solved. By the shock absorption mechanism, the problem of shock of equipment during working can be well solved by a dual-shock-absorption mode; the shock absorption mechanism is particularly applicable to an electronic device; the mechanism is convenient to manufacture and is applied to the enclosure made of an engineering plastic material; and the shock absorption mechanism is particularly applicable to vehicle-mounted devices. By the mobile multimedia broadcast device with the shock absorption mechanism, the problem of shock of the device during working can be solved and a good seeing and hearing effect is guaranteed.

Description

technical field [0001] The invention belongs to the field of equipment, and in particular relates to a shock absorbing mechanism, and also relates to a mobile multimedia broadcasting device using the shock absorbing mechanism. Background technique [0002] During the installation of equipment, the problem of vibration is usually involved, especially for some electronic equipment, due to the stability requirements of the PCB board, higher requirements are put forward for shock absorption and shock resistance. [0003] At present, the shock absorption method of the equipment mostly adopts the method of setting three-sided hollowed-out convex parts at the bottom of the housing where the PCB board is placed, and some mechanisms use the method of setting springs. Most of these structures are in the form of one-time shockproof. For larger vibrations, it often requires multiple vibrations of the convex part or the spring to offset the momentum, which has caused great hindrance to t...

AI Technical Summary

Problems solved by technology

Most of these structures are in the form of one-time shockproof. For larger vibrations, it often requires multiple vibrations of the convex part or the spring to offset the momentum, which has caused great hindrance to the normal work of the PCB board.

Especially for some vehicle-mounted electronic devices, bumps will inevitably occur during the driving of the vehicle, and sometimes even continue to bump, which is extremely unfavorable for the normal operation of the device

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