Abrasive particle burying device, polishing device and polishing method

A technology of embedding device and polishing device, which is applied in the direction of grinding device, grinding machine tool, work carrier, etc., can solve the problems of difficult embedding efficiency of abrasive grains, uneven embedding of abrasive grains into the grinding mold seat, etc., and achieves suppression of embedding Non-uniformity, uniform pressure distribution, effect of suppressing non-uniformity of fluid stress

CN102962763AActive Publication Date: 2013-03-13DISCO CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2013-03-13

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Abstract

The invention provides an abrasive particle burying device, a polishing device and a polishing method. Abrasive particles are prevented from being buried unevenly and can be buried into a grinding die holder in a highly efficient manner. According to the abrasive particle burying device, slurry containing the abrasive particles is supplied to one side of a surface of the grinding die holder, and at the same time the grinding die holder is pressed by a press component through separation of the slurry, and the press component and the grinding die holder are made to slide to bury the abrasive particles contained by the slurry into the surface of the grinding die holder. The press component comprises: more than one press part; a hammer part which is arranged above the press parts and is used for pressing the press parts onto the grinding die holder; and an ultrasonic oscillator which is used for applying ultrasonic waves onto the press parts. The press parts have press surfaces equipped with a plurality of press sheets shaped like round discs, so that the press surfaces are equal in terms of length along a direction of relative sliding between the press component and the grinding die holder. Through inhibition of uneven stress of fluid, the abrasive particles are prevented from being buried unevenly into the grinding die holder.
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Description

technical field

[0001] The present invention relates to an abrasive grain embedding device for embedding abrasive grains into the upper surface of a grinding die base, a polishing device provided with the abrasive grain embedding device, and a polishing method for polishing a workpiece using the polishing device. The base is used for grinding various workpieces such as semiconductor wafers, magnetic heads, electronic components, and optical components. Background technique

[0002] In the manufacturing process of semiconductor devices, magnetic heads, electronic components, optical components, etc., the surface of the workpiece is polished by a polishing machine. And, devices such as LSI (Large Scale Integration, large-scale integration) are formed on the surface of the polished workpiece, or the surface is used as an optical surface.

[0003] A polishing device for grinding the surface of a workpiece includes: a grinding die base rotatably supported; a slurry supply member...

Examples

Embodiment 1

[0168] Figure 20 The polishing efficiency of the AlTiC (aluminum titanium carbon) bulk body used in the magnetic head is shown in the following two cases: using the polishing device 9 of the present invention and performing the polishing process by the above-mentioned polishing method 2 and polishing method 3 case; and polishing by a slurry not containing abrasive grains after polishing by a slurry containing abrasive grains in the same manner as the above-mentioned polishing method 2 and polishing method 3 using a common polishing device without an abrasive grain embedding function Case.

[0169] It can be seen that regardless of the polishing methods 2 and 3, the polishing efficiency is higher in the case of using the polishing apparatus 9 of the present invention than in the case of using a normal polishing apparatus. This is because, in the polishing device 9 having the function of embedding abrasive grains, the abrasive grains are embedded in the surface 30 of the grind...