Abrasive particle burying device, polishing device and polishing method

Abstract

The invention provides an abrasive particle burying device, a polishing device and a polishing method. Abrasive particles are prevented from being buried unevenly and can be buried into a grinding die holder in a highly efficient manner. According to the abrasive particle burying device, slurry containing the abrasive particles is supplied to one side of a surface of the grinding die holder, and at the same time the grinding die holder is pressed by a press component through separation of the slurry, and the press component and the grinding die holder are made to slide to bury the abrasive particles contained by the slurry into the surface of the grinding die holder. The press component comprises: more than one press part; a hammer part which is arranged above the press parts and is used for pressing the press parts onto the grinding die holder; and an ultrasonic oscillator which is used for applying ultrasonic waves onto the press parts. The press parts have press surfaces equipped with a plurality of press sheets shaped like round discs, so that the press surfaces are equal in terms of length along a direction of relative sliding between the press component and the grinding die holder. Through inhibition of uneven stress of fluid, the abrasive particles are prevented from being buried unevenly into the grinding die holder.

Description

technical field [0001] The present invention relates to an abrasive grain embedding device for embedding abrasive grains into the upper surface of a grinding die base, a polishing device provided with the abrasive grain embedding device, and a polishing method for polishing a workpiece using the polishing device. The base is used for grinding various workpieces such as semiconductor wafers, magnetic heads, electronic components, and optical components. Background technique [0002] In the manufacturing process of semiconductor devices, magnetic heads, electronic components, optical components, etc., the surface of the workpiece is polished by a polishing machine. And, devices such as LSI (Large Scale Integration, large-scale integration) are formed on the surface of the polished workpiece, or the surface is used as an optical surface. [0003] A polishing device for grinding the surface of a workpiece includes: a grinding die base rotatably supported; a slurry supply member...

AI Technical Summary

Problems solved by technology

Therefore, when embedding the abrasive grains while applying ultrasonic vibration to the pressing member, the following problems arise: the abrasive grains are not evenly embedded on the surface of the grinding die base, and there are areas where too many abrasive grains are locally embedded and unembedded areas. Into areas with abrasive particles

Therefore, it is difficult to improve the embedding efficiency of abrasive grains.

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