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Method for producing 6-mu m ultra-thin electrolytic copper foil

An electrolytic copper foil, ultra-thin technology, applied in the electrolysis process, electroforming, etc., can solve the problems of decreased elongation, inconvenient operation, and difficulty in maintaining stable quality, and achieve the effect of neat distribution and fine and uniform crystal structure

Active Publication Date: 2015-06-24
山东金盛源电子材料有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

This kind of gelatin dissolves at high temperature and freezes after cooling, which brings inconvenience to the operation. After long-term use, the effect is not ideal. The peak and valley shape of the rough surface lacks uniformity, and it is difficult to maintain stable quality. rate dropped significantly

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  • Method for producing 6-mu m ultra-thin electrolytic copper foil

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Embodiment Construction

[0014] Electrolyte preparation is to add needle copper material, sulfuric acid and deionized water into the copper-dissolving tank, and at a constant temperature of 55 degrees, continuously feed oxygen into the copper-dissolving tank, and through the oxidation reaction process, the copper sulfate aqueous solution is finally obtained. In the production process of copper foil, the electrolyte is recycled, and the electrolytic copper is continuously precipitated from the cathode, thereby continuously consuming the copper in the electrolyte, and the copper in the electrolyte is continuously dissolved by the copper dissolving tank to supplement the copper consumed in the electrolyte, so that The copper content in the electrolyte is always in balance. In the process of electrolyte preparation, not only the continuous circulation of the electrolyte must be ensured, but also the composition of the electrolyte should be adjusted and stably controlled in time. The composition of the elec...

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Abstract

The invention discloses a method for producing a 6-mu m ultra-thin electrolytic copper foil, comprising the following steps of: preparing an electrolyte in which the content of copper is 100-120 g / L and the content of sulphuric acid is 140-150 g / L; heating the electrolyte to 55-60 DEG C, adding 10-20 parts by mass of sodium disulphodipropane sulfonate, 0.3-0.6 parts by mass of thiourea, 1.0-2.0 parts by mass of 2-sulfydryl benzimidazole and 30-40 parts by mass of polyethylene glycol having a molecular weight of 400 in 1000 parts by mass of the electrolyte per hour, adding 20 parts by mass of low-molecular peptide having a molecular weight of 500-6000 in every 1000 parts by mass of the electrolyte, uniformly stirring, and then conveying the electrolyte in an anode cell; and performing an electrochemical reaction by means that cations move to a cathode and anions move to an anode in the electrolyte having a current density of 70-75 A / dm<2> under the action of an electric field, so as to prepare the ultra-thin electrolytic copper foil. The 6-mu m ultra-thin electrolytic copper foil produced by the method disclosed by the invention is fine and uniform in crystal structure and order in distribution, and has a thickness uniformity deviation of less than 0.27 mum, a surface roughness Ra of less than 0.18 mum, a tensile strength of 380-460 N / mm<2> and an elongation of greater than 5.0%.

Description

technical field [0001] The invention relates to a method for producing electrolytic copper foil, in particular to a method for producing 6um ultra-thin electrolytic copper foil. Background technique [0002] Electrolytic copper foil has been used in the electronics industry since it was produced in the late 1930s. With the development of the electronics industry, the quality of electrolytic copper foil is constantly improving, and its manufacturing technology is also developing rapidly, forming a mature process. Production technology, as the process of electrolytic copper foil manufacturing, generally includes electrolyte preparation, raw foil manufacturing, surface treatment, slitting processing, and related inspection and control, auxiliary equipment and other processes. With the development of electronic information products in the direction of miniaturization, thinning and multi-function, the demand for thin multilayer printed circuit boards and thin double-sided cloth-b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38C25D1/04C25D7/06
Inventor 盛大庆宋卫华隋善东刘立柱迟明艳王玉洁
Owner 山东金盛源电子材料有限公司
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