Method for producing 6-mu m ultra-thin electrolytic copper foil

An electrolytic copper foil, ultra-thin technology, applied in the electrolysis process, electroforming, etc., can solve the problems of decreased elongation, inconvenient operation, and difficulty in maintaining stable quality, and achieve the effect of neat distribution and fine and uniform crystal structure
CN102965699BActive Publication Date: 2015-06-24山东金盛源电子材料有限公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
山东金盛源电子材料有限公司
Publication Date
2015-06-24

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Abstract

The invention discloses a method for producing a 6-mu m ultra-thin electrolytic copper foil, comprising the following steps of: preparing an electrolyte in which the content of copper is 100-120 g / L and the content of sulphuric acid is 140-150 g / L; heating the electrolyte to 55-60 DEG C, adding 10-20 parts by mass of sodium disulphodipropane sulfonate, 0.3-0.6 parts by mass of thiourea, 1.0-2.0 parts by mass of 2-sulfydryl benzimidazole and 30-40 parts by mass of polyethylene glycol having a molecular weight of 400 in 1000 parts by mass of the electrolyte per hour, adding 20 parts by mass of low-molecular peptide having a molecular weight of 500-6000 in every 1000 parts by mass of the electrolyte, uniformly stirring, and then conveying the electrolyte in an anode cell; and performing an electrochemical reaction by means that cations move to a cathode and anions move to an anode in the electrolyte having a current density of 70-75 A / dm<2> under the action of an electric field, so as to prepare the ultra-thin electrolytic copper foil. The 6-mu m ultra-thin electrolytic copper foil produced by the method disclosed by the invention is fine and uniform in crystal structure and order in distribution, and has a thickness uniformity deviation of less than 0.27 mum, a surface roughness Ra of less than 0.18 mum, a tensile strength of 380-460 N / mm<2> and an elongation of greater than 5.0%.
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Description

technical field

[0001] The invention relates to a method for producing electrolytic copper foil, in particular to a method for producing 6um ultra-thin electrolytic copper foil. Background technique

[0002] Electrolytic copper foil has been used in the electronics industry since it was produced in the late 1930s. With the development of the electronics industry, the quality of electrolytic copper foil is constantly improving, and its manufacturing technology is also developing rapidly, forming a mature process. Production technology, as the process of electrolytic copper foil manufacturing, generally includes electrolyte preparation, raw foil manufacturing, surface treatment, slitting processing, and related inspection and control, auxiliary equipment and other processes. With the development of electronic information products in the direction of miniaturization, thinning and multi-function, the demand for thin multilayer printed circuit boards and thin double-sided cloth-b...

Claims

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