Method for producing 6-mu m ultra-thin electrolytic copper foil
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 山东金盛源电子材料有限公司
- Publication Date
- 2015-06-24
Smart Images
Figure 1
Abstract
Description
technical field
[0001] The invention relates to a method for producing electrolytic copper foil, in particular to a method for producing 6um ultra-thin electrolytic copper foil. Background technique
[0002] Electrolytic copper foil has been used in the electronics industry since it was produced in the late 1930s. With the development of the electronics industry, the quality of electrolytic copper foil is constantly improving, and its manufacturing technology is also developing rapidly, forming a mature process. Production technology, as the process of electrolytic copper foil manufacturing, generally includes electrolyte preparation, raw foil manufacturing, surface treatment, slitting processing, and related inspection and control, auxiliary equipment and other processes. With the development of electronic information products in the direction of miniaturization, thinning and multi-function, the demand for thin multilayer printed circuit boards and thin double-sided cloth-b...