Fully dry wire drawing method for plastic base material
A technology of plastic substrate and full dry method, which is applied in metal material coating process, ion implantation plating, coating, etc., can solve the problems of a large amount of waste water and heavy metal pollutants, achieve high yield rate and reduce waste water discharge , The effect of stable production process
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0029] Embodiment 1 Modified PP plastic substrate coating wire drawing treatment
[0030] (1) Manually wipe and degrease the modified PP plastic substrate.
[0031] (2) High-power sputtering deposits metal layers:
[0032] Perform physical vapor deposition (PVD) metal layer on the plastic substrate treated in step (1), and then perform physical vapor deposition plasma modification in turn, and high-power sputtering to deposit the metal layer; process conditions for physical vapor deposition plasma modification The current of the ion source is 0.3A, the bias voltage is 20V, the duty cycle is 80%, the flow rate of argon is 10SCCM, and the flow rate of acetylene is 150SCCM; the time is 3min to achieve the purpose of cleaning and activating the surface of the substrate; the process conditions of high-power sputtering to deposit the metal layer A high-power DC power supply can be used, the power supply current is 200A, the voltage is 600V, the deposition time is 5min, the bias vol...
Embodiment 2A
[0051] Embodiment 2ABS plastic substrate coating wiredrawing treatment
[0052] (1) ABS plastic substrate is manually wiped and degreased.
[0053] (2) High-power sputtering deposits metal layers:
[0054] Perform physical vapor deposition (PVD) metal layer on the plastic substrate treated in step (1), and then perform physical vapor deposition plasma modification in turn, and high-power sputtering to deposit the metal layer; process conditions for physical vapor deposition plasma modification The current of the ion source is 0.6A, the bias voltage is 80V, the duty cycle is 40%, the flow rate of argon is 10SCCM, and the flow rate of oxygen is 150SCCM; the time is 5min to achieve the purpose of cleaning and activating the surface of the substrate; the process conditions of high-power sputtering to deposit the metal layer A high-power intermediate frequency pulse power supply can be used, the power supply current is 50A, the voltage is 400V, the deposition time is 15min, the bi...
Embodiment 3
[0073] Example 3 Modified nylon plastic substrate coating wire drawing treatment
[0074] (1) The modified nylon plastic substrate is manually wiped and degreased.
[0075] (2) High-power sputtering deposits metal layers:
[0076] Perform physical vapor deposition (PVD) metal layer on the plastic substrate treated in step (1), and then perform physical vapor deposition plasma modification in turn, and high-power sputtering to deposit the metal layer; process conditions for physical vapor deposition plasma modification The current of the ion source is 0.4A, the bias voltage is 60V, the duty cycle is 60%, the flow rate of argon is 50SCCM, and the flow rate of oxygen is 50SCCM; the time is 5min, in order to achieve the purpose of cleaning and activating the surface of the substrate; the process conditions of high-power sputtering to deposit the metal layer A high-power intermediate frequency pulse power supply can be used, the power supply current is 100A, the voltage is 500V, t...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More