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LED luminous chip array packaging structure

A light-emitting chip and array packaging technology, applied in the field of lighting, can solve problems such as shortening the life of LED light-emitting chip arrays, and achieve the effect of effective heat dissipation

Inactive Publication Date: 2013-03-20
YUYAO DECHENG TECH CONSULTING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] When the LED light-emitting chips are assembled into an LED light-emitting chip array structure, because the LED light-emitting chips themselves will generate heat, a large amount of heat will be generated when a large number of them are packaged together, thereby shortening the life of the LED light-emitting chip array

Method used

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Embodiment Construction

[0018] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings.

[0019] figure 1 schematically shows a plan view of an LED light-emitting chip array package structure according to an embodiment of the present invention, and figure 2 A cross-sectional view schematically shows the packaging structure of the LED light-emitting chip array according to the embodiment of the present invention.

[0020] Such as figure 1 and figure 2 As shown, the LED light-emitting chip array packaging structure according to the embodiment of the present invention includes: a substrate 3 for arranging LED light-emitting chips 1, arranging a plurality of LED light-emitting chips 1 in a matrix, and wrapping all the LED light-emitting chips 1 on the peripheral side of the substrate 3. The frame body 2 of the substrate 3, the therm...

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Abstract

The invention provides an LED luminous chip array packing structure which comprises a substrate for arranging LED luminous chips, a plurality of LED luminous chips arranged on the substrate in a matrix manner, a frame body wrapping the substrate on the peripheral side of the substrate, a heat conduction filling material arranged among the plurality of LED luminous chips, and a cover part arranged on the frame body, wherein the substrate, the frame body and the cover part form a closed cavity together, and inert gas is filled in the closed cavity; the LED luminous chip array packaging structure further comprises a fluorescent powder layer arranged on the inner surface of the cover part facing the closed cavity; the cover part is transparent; the frame body is made of a heat conduction material; the heat conduction filling material is a heat conduction material; and a reflecting material is coated on the surface of the heat conduction filling material facing the closed cavity and the frame body. The material of the packaging structure can dissipate heat effectively.

Description

technical field [0001] The invention relates to the lighting field, and more specifically, the invention relates to an LED light-emitting chip array packaging structure. Background technique [0002] LED (Light Emitting Diode) is a solid-state semiconductor device that can directly convert electrical energy into light energy. The heart of LED is a semiconductor chip, and one end of semiconductor chip is attached on a support (as negative pole), and the other end of semiconductor chip connects the positive pole of power supply, and whole chip is encapsulated by epoxy resin. [0003] Semiconductor wafer is made up of two parts, and a part is P-type semiconductor, and inside it, hole occupies an leading position, and the other end of semiconductor wafer is N-type semiconductor, is mainly electron here. Time these two kinds of semiconductors couple together, between them, just form a "P-N junction". [0004] When electric current acts on this chip by wire time, electron will b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/64H01L33/60
Inventor 杨夏芳
Owner YUYAO DECHENG TECH CONSULTING
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