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Organic light-emitting diode (OLED) device packaging method and OLED display device

A display device and device packaging technology, which is applied in the manufacture of electric solid-state devices, semiconductor devices, semiconductor/solid-state devices, etc., can solve the problems of unfavorable narrow frame realization, unfavorable glass substrate utilization rate, production efficiency, and large frame

Active Publication Date: 2013-03-20
BOE TECH GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, in order to ensure the reliability of encapsulation by this method of covering film, as in the case of mobile products, the bezel needs to cover at least 2 mm of the width of the panel, which is not conducive to the utilization rate and production efficiency of glass substrates
Moreover, due to the large frame, it is not conducive to the realization of a narrow frame, so that it cannot meet the experience needs of consumers.

Method used

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  • Organic light-emitting diode (OLED) device packaging method and OLED display device
  • Organic light-emitting diode (OLED) device packaging method and OLED display device
  • Organic light-emitting diode (OLED) device packaging method and OLED display device

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Embodiment Construction

[0018] Embodiments of the present invention provide an OLED encapsulation method and an OLED display device. At least one layer of protective layer and sealant are provided outside the position of the film, thereby preventing moisture intrusion, reducing the frame outside the film during OLED encapsulation, and reducing the The difficulty of the process improves the overall production efficiency and yield.

[0019] Such as figure 2 As shown, the OLED encapsulation method provided by the embodiment of the present invention includes:

[0020] Step S201, forming a first passivation layer (Passivation Layer) pattern on the outside of the corresponding OLED device area on the array substrate;

[0021] Step S202, forming an organic light-emitting layer on the region of the array substrate corresponding to the OLED device;

[0022] Step S203, forming a second protective layer pattern on the outer side of the packaging substrate corresponding to the OLED device area;

[0023] Step...

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Abstract

The invention discloses an organic light-emitting diode (OLED) device packaging method and an OLED display device and relates to the liquid crystal display technique. At least one protective layer and border sealing adhesives are arranged on the outer side of a film, so that water intrusion is prevented, borders on the outer side of the film when an OLED is packaged are reduced, process difficulty is reduced, and the overall production efficiency and yield are improved.

Description

technical field [0001] The invention relates to liquid crystal display technology, in particular to an OLED packaging method and an OLED display device. Background technique [0002] When encapsulating OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode), it is usually encapsulated by a cover film (film) method, such as figure 1 As shown, an organic light-emitting layer 102 is disposed on the array substrate 101. The packaging method is to cover the organic light-emitting layer 102 with a thin film 103, and a packaging substrate 104 is disposed on the thin film 103. Due to the existence of the thin film 103, moisture and air can be prevented. Invasion to realize OLED encapsulation. [0003] However, in order to ensure the reliability of encapsulation by this method of covering the film, as in the case of mobile products, the bezel needs to cover at least 2 mm of the width of the panel, which is not conducive to the utilization rate and production efficiency of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56H01L51/52H01L27/32
Inventor 金东换李周炫洪瑞
Owner BOE TECH GRP CO LTD
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