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Wave crest soldering technique of printed circuit board

A printed circuit board and wave soldering technology, which is applied to the assembly of printed circuits with electrical components, can solve problems such as destructive effects, device performance effects, secondary heating of through-hole devices, etc., to improve efficiency, be easy to implement, and prevent The effect of the secondary heating problem

Inactive Publication Date: 2013-03-27
SHAANXI AVIATION ELECTRICAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Manual soldering is easy to produce false soldering, while reflow soldering needs to put the devices that have been wave soldered into the reflow soldering furnace together, which will cause secondary heating of through-hole devices, which will affect the performance of some devices and even cause destructive effects

Method used

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  • Wave crest soldering technique of printed circuit board
  • Wave crest soldering technique of printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Example 1: The size code of the components is 0402

[0020] Step 1: Dot red glue in the middle of the pad of the SMT device on the welding surface, and the amount of glue dispensed is 0.0005ml;

[0021] Step 2: Then stick the patch device on the pad, put it in an oven, and bake it at 85±10°C for 30 minutes to cure the red glue;

[0022] Step 3: Take it out and let it cool down to room temperature, then bend, insert, spot-fix and cut the pins of the through-hole device;

[0023] Step 4: Use wave soldering and then print the board, so that the SMT devices are soldered together.

Embodiment 2

[0024] Example 2: The size code of the components is 0603

[0025] Step 1: Dot red glue in the middle of the pad of the SMD device on the welding surface, and the amount of glue dispensed is 0.001ml;

[0026] Step 2: Then stick the patch device on the pad, put it in an oven, and bake it at 85±10°C for 30 minutes to cure the red glue;

[0027] Step 3: Take it out and let it cool down to room temperature, then bend, insert, spot-fix and cut the pins of the through-hole device;

[0028] Step 4: Use wave soldering and then print the board, so that the SMT devices are soldered together.

Embodiment 3

[0029] Example 3: The size code of the components is 0805

[0030] Step 1: Dot red glue in the middle of the pad of the SMD device on the welding surface, and the amount of glue dispensed is 0.002ml;

[0031] Step 2: Then stick the patch device on the pad, put it in an oven, and bake it at 85±10°C for 30 minutes to cure the red glue;

[0032] Step 3: Take it out and let it cool down to room temperature, then bend, insert, spot-fix and cut the pins of the through-hole device;

[0033] Step 4: Use wave soldering and then print the board, so that the SMT devices are soldered together.

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Abstract

The invention relates to a wave crest soldering technique of a printed circuit board, comprising the following steps: sticking a paster device on a soldering surface to the soldering surface by using red gum; then roasting a printed board for curing; then performing tin coating of a through hole device, bending plug-in mounting, point fixing, shear pin and the like; and then enabling the printed board to pass through a crest soldering machine once so that the paster device and the through hole device are soldered together through soldering tin wave crest; and therefore, the time is saved, and the problems of secondary manual soldering and solder-reflow can be solved. The wave crest soldering technique of the printed circuit board disclosed by the invention has the beneficial effects that the wave crest soldering technique is simple in operation and easy to realize; the cold solder joint problem of manual soldering can be prevented; the problem that components and parts are heated in second time when solder-reflow is used also can be prevented; moreover, the efficiency is improved, and the cost is reduced. Therefore, the practicability is better. The technique is easy to popularize and relatively high in use value.

Description

technical field [0001] The invention belongs to the welding process of mixed printed circuit boards, and relates to a wave soldering process method of printed circuit boards, in particular to a wave soldering process method of printed circuit board components with patch devices on the welding surface. Background technique [0002] Soldering of printed circuit board components with SMD devices on the soldering surface. The existing soldering process is to use wave soldering to complete the through-hole devices first, and then use manual or reflow soldering to complete the soldering of SMD devices. The above two processes All have defects. Manual soldering is prone to false soldering, while reflow soldering requires the devices that have been wave soldered to be put into the reflow soldering oven together, which will cause secondary heating of through-hole devices, which will affect the performance of some devices, and even cause destructive effects. Contents of the inventio...

Claims

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Application Information

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IPC IPC(8): H05K3/34
Inventor 王兆雅张娟乐张永刚
Owner SHAANXI AVIATION ELECTRICAL
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