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Polyamide composite structures and processes for their preparation

A composite structure, polyamide technology, applied in the direction of chemical instruments and methods, synthetic resin layered products, transportation and packaging, etc., can solve the problems of reducing productivity loss, etc.

Inactive Publication Date: 2013-03-27
EI DU PONT DE NEMOURS & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] While the use of a tie layer between the surface of the composite structure and the overmolding resin improves adhesion, the addition of a tie layer adds an additional step to the overmolding process, resulting in reduced productivity losses
Furthermore, the bonding layer may suffer thermal degradation under the conditions of the manufacturing process, or the process may be limited to lower temperatures due to the bonding layer

Method used

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  • Polyamide composite structures and processes for their preparation
  • Polyamide composite structures and processes for their preparation

Examples

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Embodiment

[0125] The following materials were used to prepare composite structures and overmolded composite structures according to the present invention and comparative examples.

[0126] Material

[0127] The following materials constitute the compositions used in the Examples and Comparative Examples

[0128] Semiaromatic PA : Polyamide (PA) prepared from terephthalic acid and 1,6-hexanediamine (HMD) and 2-methyl-1,5-pentanediamine (MPMD) (HMD:MPMD=50:50). The semiaromatic polyamides are commercially available from E.I. du Pont de Nemours.

[0129] Fully aliphatic PA : Polyamide (PA) made from adipic acid and hexamethylenediamine, this polymer is known as PA6,6 and is commercially available eg from E.I. du Pont de Nemours and Company.

[0130] Functionalized Polyolefin (Ionomer) : Poly(ethylene / n-butyl acrylate / methacrylic acid) (E / n-BA / MAA), an ionomer with about 70% neutralization of zinc ions. The ionomer contained 67% by weight ethylene, 24% by weight n-butyl acrylat...

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Abstract

The present invention relates to composite structures and overmolded structures comprising a fibrous material, a matrix resin composition and a portion of its surface made of a surface resin composition, wherein the compositions are chosen from compositions comprising one or more polyamides and one or more functionalized polyolefins.

Description

technical field [0001] The present invention relates to the field of polyamide composite structures, overmolded composite structures suitable for overmolding an overmolding resin composition over at least a part of their surface, and methods for their preparation. Background technique [0002] In order to replace metal parts to reduce weight and cost while maintaining comparable or superior mechanical properties, structures based on composite materials with a polymer matrix containing fibrous materials have been developed. With growing interest in this field, fiber-reinforced plastic composite structures have been designed due to their excellent physical properties resulting from the combination of fiber materials and polymer matrices, and these fiber-reinforced plastic composite structures have been Used in a variety of end applications. Various fabrication techniques have been developed to improve the impregnation of fibrous materials with polymer matrices to optimize the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/14B32B5/28B32B27/34
CPCB32B27/34B32B2260/046B32B2250/40B32B2262/101B32B2260/023B32B27/08B32B5/024B32B2305/188B32B17/04B32B1/00B32B27/308B32B27/12B32B2270/00B32B5/26B29C45/14786B32B5/28Y10T428/31728B32B2377/00
Inventor A.E.伊里亚
Owner EI DU PONT DE NEMOURS & CO
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