Method for calculating thin-wall profile micropore processing

Abstract

The invention discloses a method for calculating thin-wall profile micropore processing, which is used for building the relationship between micropore dimensions and a punch and a die. The method comprises the following steps: (1) building a part profile equation according to part profile characteristics; (2) obtaining a derivative equation through the derivation of the profile equation; (3) determining a coordinate value of a micropore center in a coordinate system; (4) utilizing the derivative equation to substitute for micropore coordinates and thus obtaining an included angle of a micropore central line and a vertical direction; (5) utilizing the included angle of the micropore central line and the vertical direction to calculate the dimensions of the punch and the die; and (6) utilizing the calculation dimensions to determine the dimensions and structures of the punch and the die, and enabling the micropores of a waveform heat screen to obtain good dimensions and form accuracy. The method has the beneficial effects that the structures of the punch and the die are simplified, the production efficiency is increased, the labor intensity and production cost are reduced, part products have stable quality, dimensions and shapes satisfy product design requirements, and the method can be widely applied to process the similar thin-wall profile micropores.

Description

technical field [0001] The invention relates to a calculation method for processing a small hole on a thin-walled profile, and belongs to the technical field of mechanical processing. Background technique [0002] Usually, the small holes of this kind of parts adopt the following processing methods: (1) Punching or laser cutting is used to directly punch holes on the flat plate, which brings troubles in positioning when the subsequent processing of the part surface, and the small holes are on the surface. During the forming process, it is deformed by force, the size of the small hole cannot be guaranteed, and the position of the hole cannot be guaranteed, and the performance requirements of the part cannot be guaranteed; (2), after forming, use drilling or laser cutting to process small holes, the processing efficiency is extremely low, and There are tens of thousands of holes on the part, and it is impossible to ensure that the center of the hole is consistent with the norm...

AI Technical Summary

Problems solved by technology

[0002] Usually, the following processing methods are used for the small holes of such parts: (1) Punching or laser cutting is used to directly punch holes on the flat plate, which brings troubles in positioning when the subsequent processing of the part surface, and the small holes are on the surface. During the forming process, it is stressed and deformed, the size of the small hole cannot be guaranteed, and the position of the hole cannot be guaranteed, and the performance requirements of the part cannot be guaranteed; (2), after forming, use drilling or laser cutting to process small holes, the processing efficiency is extremely low, and The number of holes on the part is as many as tens of thousands, and it is impossible to ensure that the center of the hole is consistent with the normal direction of the profile, which cannot meet the structural performance requirements required by the part

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