Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Conformal microstructure transfer method

A transfer method and microstructure technology, applied in the field of microelectronics, can solve the problems of high cost and complex conformal transfer process of microstructure, and achieve the effects of reducing process cost, avoiding pattern slip, and reducing complexity

Active Publication Date: 2013-04-03
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a microstructure conformal transfer method, which is used to solve the problem of complex microstructure conformal transfer process and high cost in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Conformal microstructure transfer method
  • Conformal microstructure transfer method
  • Conformal microstructure transfer method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0037] see Figure 1 to Figure 7 . It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of ​​the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the components in actual implementation. Dimensional drawing, the type, quantity and proportion of each component can be changed arb...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a conformal microstructure transfer method. The method at least includes: providing an XOI (X on insulator) substrate comprising bottom silicon, an buried oxide layer and a top X nano-film sequentially from top to bottom, coating the top X nano-film with dumbbell-shaped photoresist used as a mask, and etching to obtain a dumbbell-shaped microstructure; corroding the buried oxide layer by hydrofluoric acid solution or BOE (buffer oxide etch) solution until a middle patterned microbelt part of the microstructure is totally suspended in air and part of the buried oxide layer not completely corroded below two end areas of the microstructure remains, and forming fixed junctions; and providing a base plate to contact with the microstructure, and quickly lifting the base plate to transfer the microstructure to the base plate. The microstructure nano-film is fixed according to the simple design of graph fixation by ends, full conformal transfer is achieved, complexity in conformal transfer process is lowered greatly, and process cost is lowered.

Description

technical field [0001] The invention belongs to the field of microelectronics and relates to a film transfer method, in particular to a microstructure conformal transfer method. Background technique [0002] In recent years, with the improvement of people's technical requirements for portable electronic devices, the rapid development of flexible electronic technology has attracted widespread attention and has become a research and application hotspot. Flexible electronics technology is to transfer thin film materials and functional devices on traditional rigid substrates to flexible substrates, so as to meet the technical requirements of bendable, stretchable and even foldable. [0003] In the flexible technology, firstly, the patterned microstructure on the traditional rigid substrate, especially the microribbon, is transferred to the flexible substrate; secondly, the patterned microstructure on the flexible substrate is used to make flexible electronic devices using the tr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02
Inventor 狄增峰郭庆磊张苗魏星薛忠营母志强戴佳赟
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com