21 results about "Microribbon" patented technology

The present application relates to a kind of micro nuclear magnetic resonance probe and nucleic acid, antibody nuclear magnetic resonance detection method.Micro nuclear magnetic resonance probe includes the parallel arrangement of first plane shimming coil, nuclear magnetic resonance micro coil chip, digital microfluidic chip and second plane shimming coil in sequence, digital microfluidic chip is single pole plate form, the microstrip of medium substrate on nuclear magnetic resonance micro coil chip is annular microstrip coil, nuclear magnetic resonance micro coil chip and digital microfluidic chip are spaced apart.There is beneficial effect: through digital microfluidic chip control droplet, with simple structure, easy integration advantage;Annular microstrip coil can generate a uniform B1 field that matches the shape of droplet, can improve the filling factor of trace sample droplet;Nucleic acid, antibody modified magnetic particle probe can enhance nuclear magnetic resonance detection sensitivity, by quantitative analysis the change amount of relaxation time and the concentration of target detection substance, nucleic acid, antibody quantitative detection can be realized.

The utility model discloses a threaded installation connector, which comprises an inner conductor, an insulator and an outer conductor, the inner conductor, the insulator and the outer conductor are sequentially arranged from inside to outside, the left end of the connector is a standard SMP pin type interface, and the right end of the connector is the inner conductor connected with a printed board. According to the utility model, the frictional resistance between the micro-strip and the metalized via hole is small, the plugging force is soft, and the assembly and disassembly are convenient; according to the utility model, relative rotation between adjacent parts of the inner conductor, the insulator and the outer conductor is not caused, so that risks of loosening and structure failure between the parts are avoided. The threaded installation connector can be reliably connected with a metalized through hole and is convenient to install and disassemble, and the assembling efficiency of a whole machine system is greatly improved.

The utility model discloses a microstrip circulator welding tool easy to assemble, which comprises a base, an upper cover plate and a pressing block plate which are sequentially arranged from bottom to top, the base is provided with a plurality of circulator grooves which are distributed in a matrix mode, the upper cover plate is provided with rectangular hole grooves which are the same as the circulator grooves in size, number and distribution, and the pressing block plate is arranged on the upper cover plate. The pressing block plate is provided with pressing blocks which are the same as circulator grooves in size, number and distribution, the four corners of the base, the four corners of the upper cover plate and the four corners of the pressing block plate are provided with pin holes which coincide in position, and the base, the upper cover plate and the pressing block plate are fixedly connected through matching of pins and the pin holes. The assembling process, the number of parts and operation steps are simplified, the weight of the tool is light, heat dissipation is even and rapid, the batch welding efficiency of circulators is improved, and the welding precision and quality of products are improved.

The utility model discloses a load pin trimming device which comprises a positioning plate, a lower die and an upper die, a second sliding rail is arranged on the lower die, a second nut is arranged in the second sliding rail in a sliding mode, one side of the positioning plate is movably connected with the lower die, a second through hole is formed in the other side of the positioning plate, and a second nut is arranged in the second through hole. A first sliding rail is transversely arranged in the middle of the upper end face of the positioning plate, a first nut is arranged in the first sliding rail in a sliding mode, a limiting rod is longitudinally arranged on the positioning plate, a first through hole is formed in the right side of the limiting rod, and the first through hole is matched with the first sliding rail; and the lower die is correspondingly provided with an upper die. The device has the beneficial effects that the specified shearing length and shearing angle can be realized, the accurate alignment of the positioning plate and the die is realized, the processing precision is ensured, the problems of poor quality consistency, unstable performance parameters and the like of microstrip products can be solved, and the electrical performance parameters of the products are stabilized and improved.

The invention relates to a micro-strip surface-mounted high-temperature welding spot laser welding method, belongs to the technical field of laser welding, and solves one of the problems that in the prior art, welding spots are poor in morphology consistency, welding uniformity and welding performance, a micro-strip is prone to falling off, welding time is difficult to control, and dependence on operators is high. According to the micro-strip surface-mounted high-temperature welding spot laser welding method, efficient welding of a micro-strip welding pad and an antenna in a high-temperature environment is achieved through the steps of fixing of the welding pad and a to-be-welded part, spot coating of welding flux, setting of a multi-section welding process curve, automatic welding and the like, the welding spots are highly consistent in morphology, welding uniformity is good, and welding performance is excellent; and the welding process does not depend on operators, so that the production cost is reduced, and the production capacity is improved while manual operation is removed.

The utility model discloses a microstrip substrate material composite positioning device, which comprises a positioning part, a telescopic part and a displacement platform, the positioning part comprises at least three positioning rods, the three positioning rods are positioned on the same circumference, the telescopic part is connected above the positioning part, a support rod is movably connected above the telescopic part, and the displacement platform is positioned above the telescopic part. A limiting block is connected to the supporting rod, a limiting component is correspondingly arranged on the limiting block, the limiting component comprises a third sliding groove, a bottom plate is arranged below the positioning component, a displacement platform is arranged on the bottom plate, and the limiting component is movably connected to the displacement platform. The punching device has the beneficial effects that through cooperation of a plurality of positioning rods and limiting parts, it is ensured that the circular core body and the punching sheets can be accurately aligned, errors are reduced, the device can adapt to the punching sheets of different sizes and shapes through the design of a displacement platform, the application range of the device is widened, the telescopic parts provide the moving and buffering functions in the vertical direction, and the practicability is high. And it is ensured that the circular core body can be stably and accurately loaded into the punched sheet.

The invention relates to a thermally-induced anisotropic conductive film and a preparation technology thereof, and belongs to the technical field of new material preparation. The method comprises the following four steps: (1) preparing VO2 (M) by combining hydrothermal and high-temperature roasting; (2) synthesizing polymethyl methacrylate (PMMA) by a bulk polymerization method; (3) preparing a spinning solution; and (4) preparing the [PMMA] / / [VO2 / PMMA] Janus micro-ribbon array thermally-induced anisotropic conductive film by adopting a two-axis parallel electrospinning technology. When heating is carried out (80 DEG C), the prepared thermally-induced anisotropic conductive film has strong thermally-induced anisotropic conductivity, that is, high thermally-induced anisotropic conductivity is realized through heating. The preparation method is simple and easy to implement, batch production can be achieved, and the novel anisotropic conductive film material has wide application prospects.

The utility model discloses a capacitor heat dissipation device. An insulating surface of a capacitor is connected with the top surface of an insulating heat dissipation block; the upper microstrip polar plates of the first microstrip polar plate and the second microstrip polar plate are respectively welded with two conductive polar plates of the capacitor, the connecting microstrip polar plates are respectively welded with two parts, which are not contacted with the insulating surface of the capacitor, of the top surface of the insulating heat dissipation block, and the lower microstrip polar plates are respectively welded with two side surfaces of the insulating heat dissipation block; the upper micro-strip polar plate, the connecting part micro-strip polar plate and the lower micro-strip polar plate are integrally formed; the left side bottom surface and the right side bottom surface of the insulating heat dissipation block are respectively welded on the first bonding pad and the second bonding pad; and the lower microstrip polar plates of the first microstrip polar plate and the second microstrip polar plate are respectively welded on the first bonding pad and the second bonding pad. By means of the device, part of heat can be conducted away through the heat bridge when the capacitor works, meanwhile, the heat bridge and the capacitor are fixed through the micro-strip polar plate, the micro-strip polar plate can further effectively enable the heat to flow away from the capacitor, and mechanical stress can also be eliminated.

The invention discloses a welding method for a chip ceramic dielectric capacitor microstrip product, and belongs to the technical field of electronic component welding processes. According to the technical scheme, the method comprises the following steps of: 1, coating a first layer of soldering paste on the top surfaces of two metal ends of the chip ceramic dielectric capacitor; 2, placing a silver sheet on the first layer of soldering paste, wherein the size of the silver sheet is matched with that of the metal end; step 3, coating a second layer of soldering paste on the surface of the silver sheet; fourthly, the welding face of the L-shaped silver strip or the silver-plated copper strip is attached to the silver piece coated with the second layer of soldering paste; (5) the attached assembly is fixed in a mold; and 6, reflow soldering is carried out. The method has the beneficial effects that the welding adhesive force and the appearance of the chip ceramic dielectric capacitor microstrip product are synchronously optimized, and the qualified rate of the product is improved.

An optical system including a dual-layer microelectromechanical systems (MEMS) device, and methods of fabricating and operating the same are disclosed. Generally, the MEMS device includes a substrate having an upper surface; a top modulating layer including a number of light modulating micro-ribbons, each micro-ribbon supported above and separated from the upper surface of the substrate by spring structures in at least one lower actuating layer; and a mechanism for moving one or more of the micro-ribbons relative to the upper surface and / or each other. The spring structures are operable to enable the light modulating micro-ribbons to move continuously and vertically relative to the upper surface of the substrate while maintaining the micro-ribbons substantially parallel to one another and the upper surface of the substrate. The micro-ribbons can be reflective, transmissive, partially reflective / transmissive, and the device is operable to modulate a phase and / or amplitude of light incident thereon.

The invention provides a compressible vertically-oriented high-thermal-conductivity graphene thermal interface material and a preparation method thereof, and belongs to the technical field of heat dissipation materials. The preparation method comprises the following steps: blade-coating a microporous filter membrane with a graphene oxide aqueous solution, heating and drying the filter membrane to obtain a graphene oxide film, graphitizing the graphene oxide film at a high temperature to obtain a graphene film, sputtering a layer of metal nickel at two ends of the graphene film, and cutting the graphene film into micron-sized strips by using a laser cutting machine to obtain the graphene film. And finally, inducing the vertical orientation of the graphene microribbons by using a magnetic field, and encapsulating by using an elastomer. According to the graphene thermal interface material, the thermal conductivity of the thermal interface material in the vertical direction is improved through magnetic field vertical orientation arrangement, a brand new heat dissipation technology is brought to the field of integrated circuits, and the heat dissipation efficiency of the integrated circuits is improved.

The utility model discloses a ceramic dielectric capacitor microstrip fixing and welding device which comprises an upper plate and a bottom plate, a product groove is formed in the middle of the upper plate, the bottom of the product groove is arranged in a penetrating mode, microstrip grooves are formed in the two ends of the upper plate, and the two microstrip grooves are communicated with the product groove. A placing table is arranged in the middle of the bottom plate, and the placing table and the product groove are oppositely arranged; and the welding efficiency is greatly improved, upper, lower, left and right symmetry is achieved after welding is completed, and the appearance quality of a welded product is greatly improved.

The invention discloses a broadband magnetoelectric dipole antenna based on a bowknot-shaped polarization conversion metasurface, and belongs to the technical field of magnetoelectric dipole antennas. In order to solve the problems that an existing antenna is high in profile, radiation and scattering performance is difficult to consider, and broadband RCS reduction is difficult to achieve in a Ka band, the antenna adopts three metallization layers and two dielectric substrates which are arranged in a staggered mode, and a PCM checkerboard array composed of bowknot-shaped PCM units is integrated above a magnetoelectric dipole radiation unit; the magnetoelectric dipole radiation unit adopts a coplanar design, comprises four radiation patches serving as electric dipoles and two perforated annular microstrip feeder lines serving as magnetic dipoles, and feeds through a 50-ohm coaxial feed port arranged at the bottom of the magnetoelectric dipole radiation unit. The overall thickness of the antenna is only 0.762 mm, the low profile is achieved, and meanwhile the antenna has the comprehensive excellent performance of wide impedance matching (23.26%, 30.4-38.4 GHz), high gain (the peak value is 11.9 dBi) and ultra-wideband RCS reduction (gt, 10 dB, and the relative bandwidth is 63.83%, 28.9-56 GHz).

This invention belongs to the field of silicon carbide porous materials technology and provides a method for preparing silicon carbide micron-band sponges based on a thermally controlled strategy. The method uses a porous template containing carbon fibers as a framework and a silicon source as a reaction precursor. A SiC / SiOx composite shell is formed on the surface of the carbon fibers through a high-temperature reaction. Subsequently, controlled heat treatment is performed in an air atmosphere, causing the carbon fibers to be gradually oxidized and consumed. This induces the SiC / SiOx shell to crack along the fiber length and transform into a porous micron-band structure, thereby obtaining a three-dimensional porous network sponge material composed mainly of silicon carbide micron-bands. By controlling the high-temperature reaction temperature and the air heat treatment time window, the target micron-band structure can be stably obtained. The resulting material possesses high porosity, low density, low thermal conductivity, flexible compressibility, and electromagnetic wave absorption properties, making it suitable for integrated thermal insulation and electromagnetic protection applications in extreme environments.

The invention provides a quantum cascade laser epitaxial structure, and relates to the technical field of photoelectrons. The epitaxial structure comprises an InGaAs / InAlAs superlattice active region, and the InGaAs / InAlAs superlattice active region is composed of a plurality of periodic units. And each periodic unit sequentially comprises a transition region and a relaxation region from bottom to top. And the transition region sequentially comprises an Al < 0.93 > In < 0.07 > As quantum barrier layer, a Ga < 0.3 > In < 0.7 > As quantum well barrier layer, an Al < 0.63 > In < 0.37 > As quantum barrier layer, a Ga < 0.4 > In < 0.6 > As quantum well barrier layer, an Al < 0.56 > In < 0.44 > As quantum barrier layer and a Ga < 0.43 > In < 0.57 > As quantum well barrier layer from bottom to top. The relaxation region comprises a plurality of groups of relaxation region potential well structures, the four groups of relaxation region potential well structures located at the uppermost part sequentially comprise a Ga < 0.3 > In < 0.7 > As quantum well barrier layer, an Al < 0.7 > In < 0.3 > As quantum barrier layer, a Ga < 0.3 > In < 0.7 > As quantum well barrier layer, an Al < 0.65 > In < 0.35 > As quantum barrier layer, a Ga < 0.32 > In < 0.68 > As quantum well barrier layer, an Al < 0.65 > In < 0.35 > As quantum barrier layer, a Ga < 0.32 > In < 0.68 > As quantum well barrier layer and an Al < 0.6 > In < 0.4 > As quantum barrier layer from top to bottom, and a micro-strip extraction structure is formed. The epitaxial structure can effectively inhibit carrier leakage and improve tunneling extraction efficiency.

The present disclosure provides an active region and a quantum cascade laser. The active region includes a plurality of periodically cascaded active cores. Each period of the active core includes a gain region and an injection region. The gain region includes four gain region quantum wells and three gain region quantum barriers. Each gain region quantum barrier is disposed between two adjacent gain region quantum wells. Among the four gain region quantum wells, the thickness of the first gain region quantum well disposed at the upper part is the smallest; the thickness of the second gain region quantum well is the largest; the thicknesses of the second gain region quantum well to the fourth gain region quantum well gradually decrease; the difference between the second gain region quantum well and the third gain region quantum well is less than the difference between the third gain region quantum well and the fourth gain region quantum well, so that the additional energy levels in the first miniband partially extend into the injection region, the additional energy levels are coupled with the laser lower energy level, and the electrons injected into the laser upper energy level radiatively transition to the laser lower energy level and the additional energy levels in vertical transition and skew transition manners respectively, and laser is generated.

The present invention discloses a robot intelligent assembly system, the system includes a first four-axis industrial robot, a second four-axis industrial robot, an assembly unit, a photographing unit, a gluing unit and a software control system. The assembly unit is located at the center of the system, the first four-axis industrial robot and the second four-axis industrial robot are separated on both sides of the assembly unit, and the assembly unit cooperates with the first and second four-axis industrial robots according to the instructions of the software control system to complete the mechanical assembly operations of various parts of the product; the photographing unit takes multi-directional photos of the product according to the instructions of the software control system; the gluing unit is controlled by PLC to achieve stable glue output; the software control system is used to streamline the assembly steps through program compilation according to the process flow. The present invention adds a secondary identification and positioning function to ensure the accurate insertion of the low-noise amplifier module pins and the microstrip printed circuit board, realizes automatic management and control, and greatly improves production efficiency.

In one or more embodiments, a system and method for impedance matching across subassemblies comprises forming a PCB with wider traces, wherein a trace is formed based on a width corresponding to a trace design and a tolerance. The larger width reduces a reflection coefficient to reduce impedance differences. A Surface mount technology (SMT) breakout area may include a thicker microstrip and a conductive silk screen layer may be added to further improve impedance matching without increasing the total height of a PCB.

The present disclosure generally relates to micro-ribbon structures used in display systems and methods of fabrication thereof. Individual fibers are made using an extrusion process whereby a core surrounded by an ink portion is extruded to create an individual fiber. The ink portion may include both an inner portion that is in contact with the core and an outer shell portion over the inner portion. The individual fibers are then bonded to adjacent fibers to create micro-ribbon structures. The micro-ribbon structures are of one color and spaced from adjacent micro-ribbon structures of a different color by a light blocking fiber. The micro-ribbon structures are each bonded to the light blocking fiber to create the color stripes used in the display system.

A preparation method of the one-dimensional boron nitride micro-ribbon mainly comprises the following steps: preparing a precursor by taking zinc sulfate, sodium tetraborate and ammonium borate as raw materials, then reacting in a reaction kettle, and nitriding in a tubular furnace after two hydrothermal processes to obtain the one-dimensional boron nitride micro-ribbon. The one-dimensional boron nitride micro-ribbon provided by the invention is in a micron-level solid strip shape, not only is high in product purity and raw material conversion rate, but also is low in raw material price and simple and efficient in preparation process, successfully solves the key problems of the one-dimensional boron nitride material in the aspects of purity, raw material cost, production efficiency and the like, does not need to be supported by high-end equipment, and is suitable for industrial production. And the high-purity one-dimensional boron nitride micro-ribbon product can be produced in a large-scale industrialization manner, so that the production cost is remarkably reduced, and the production efficiency is improved. The boron nitride micro-ribbon prepared by the invention not only has excellent reinforcing and toughening effects, but also can remarkably improve the heat-conducting property, and after the boron nitride micro-ribbon is filled into epoxy resin, the mechanical property and the heat-conducting property of a composite material are remarkably improved.