41 results about "Microribbon" patented technology

An electrochemical gas sensor, a method for making the sensor and methods for the detection of a gaseous species. The electrochemical gas sensor is a solid-state gas sensor that includes a solid polymer electrolyte. A working electrode is separated from a counter electrode by the solid polymer electrolyte. The sensor can include a multilaminate structure for improved detection properties, where electrode microbands are disposed within the solid polymer electrolyte.

This invention relates to a composition of matter comprising predominantly silver metal microribbons, wherein the microribbons are at least 1 micron in length×0.1 to 0.5 microns in width×0.05 to 0.5 microns in height. It further relates to a method of making predominantly silver microribbons comprising providing a reducible silver salt, contacting the reducible silver salt with a fogging agent to form latent image silver centers; reducing the reducible silver salt into silver metal using a reducing agent, supplying a polymer that is soluble in a non-aqueous solvent, and a non-aqueous solvent; allowing the growth of the microribbons in the presence of the polymer and non-aqueous solvent

The invention discloses an optical coupling apparatus for packaging an optoelectronic integration array chip. The optical coupling apparatus comprises a tube shell or a heat sink, the semiconductor optoelectronic integration array chip, a semiconductor optoelectronic integration array chip substrate, an optical collimating lens array, a beam splitter prism, a beam splitter prism bracket, detector array chips, an optical focusing lens array, a fiber array, and a fiber array bracket. According to the optical coupling apparatus for packaging the optoelectronic integration array chip, by means of installation of the beam splitter prism, partial optical signals output by the semiconductor optoelectronic integration array chip collimated by the optical collimating lens array are introduced into the respective corresponding detector array chips, so that difficulties that a backlight detector cannot be placed due to complicated microwave micro-strip circuits or the requirement for double-end optical coupling in coupling packaging of the semiconductor optoelectronic integration array chip are overcome, and real-time monitoring of optical signals of the semiconductor optoelectronic integration array chip is achieved.

The invention discloses a method for fabricating a MEMS friction sensor based on visual alignment. The MEMS friction sensor is decomposed into five parts of a floating component, a silicon microstructure, an electrode substrate, an interface circuit and a package tube. The silicon microstructure and the electrode substrate are fabricated by a MEMS process, the floating component and the package tube are fabricated by precision machining processing technology, and the interface circuit is fabricated by ceramic-based precision micro-strip circuit technology. The MEMS friction sensor uses specialmicro-assembly equipment and micro-assembly process, the micro-assembly equipment consists of a precision vision positioning system, a three-degree-of-freedom micro-operation alignment platform, a vacuum nozzle and an image recognition system, and the assembly of the MEMS friction sensor is completed by using the visual precision positioning and micro-operation alignment technology. The method for fabricating the MEMS friction sensor based on visual alignment provided by the invention improves the processing and assembly precision of the MEMS friction sensor, thereby improving the accuracy ofmeasuring the frictional resistance of the surface in the hypersonic wind tunnel.

The invention discloses a micro-strip filter 3D printing manufacturing method. The method comprises the following steps: S1, designing a substrate printing pattern and a metal circuit printing patternaccording to a circuit pattern of a micro-strip filter; S2, extruding low-temperature co-fired ceramic slurry serving as a printing material out of a nozzle and depositing the slurry on a workbench to form a low-temperature co-fired ceramic substrate by using a 3D printer according to the substrate printing pattern; S3, curing the low-temperature co-fired ceramic substrate on the workbench in aninfrared heating mode; S4, spray-printing nano-silver metal ink serving as a printing material on the surface of the cured low-temperature co-fired ceramic substrate to form a metal circuit by using the 3D printer according to the metal circuit printing pattern; and S5, sintering the low-temperature co-fired ceramic substrate printed with the metal circuit by using a vacuum sintering furnace. Themethod is simple and easy to master, the production cost can be reduced, and a solution is provided for rapid manufacturing and individuation of the micro-strip filter.

The invention discloses a vacuum-ultrasonic composite brazing device. The vacuum-ultrasonic composite brazing device comprises a vacuum assembly, an ultrasonic brazing assembly, a computer numerical control (CNC)motion assembly, a heating assembly and a controller, wherein the vacuum assembly comprises a vacuum cover, the CNC motion assembly is connected with the top face of the interior of the vacuum cover, the ultrasonic brazing assembly is connected with the CNC motion assembly, the heating assembly is connected with the bottom face in the vacuum cover, and the controller is connected with the vacuum assembly, the CNC motion assembly, the heating assembly and the ultrasonic brazing assembly. The invention further discloses a brazing method using the method. The vacuum-ultrasonic composite brazing device and method have the beneficial effects that through the ultrasonic degassing effect of the ultrasonic brazing assembly and the vacuum negative pressure in the vacuum cover, high-brazing-penetration-rate and high-strength connection of a microstrip plate on aluminum alloys is efficiently completed under the working condition that scaling powder is not used for the microstrip plate, and high-efficiency, high-reliability and low-cost connection of the microstrip plate on a microwave assembly is realized.

The invention discloses a reflow-soldering plated-through-hole aluminum-based microstrip plate production process. The production process sequentially comprises the following steps: blanking, drillingof plated through holes, silk-screen printing of solder resist ink on copper foils, three times of zinc immersion and zinc stripping, chemical plating of multi-element nickel alloy, acid copper plating of a printed board, removal of the silk-screen printing solder resist ink, plasma treatment, hole metallization and full-board copper plating, pattern transfer, pattern copper/nickel gold electroplating, etching, silk-screen printing of solder resist and characters, pasting of a protective adhesive film, secondary drilling, appearance processing and removal of the protective adhesive film; 180-mesh silk screens are adopted for silk-screen printing of the solder resist ink on the copper foils; through pretreatment process of three times of zinc immersion and zinc stripping, the bonding forceof a chemical nickel alloy plating layer and an aluminum base layer is improved; a traditional zinc immersion process is replaced with a chemical multi-element nickel alloy plating process, so that the bonding force between plating layers is enhanced, and the high-temperature resistance of the microstrip plate is improved; and the temperature resistance can reach 300 DEG C, and the requirement ofreflow soldering of the aluminum-based microstrip plate is met.

The invention discloses a hard X-ray framing camera and a hard X-ray detection method thereof. The problem that in the prior art, two-dimensional imaging with time resolution capability cannot be carried out on hard X-rays with the energy section range of tens of keV to hundreds of keV is solved. The framing camera comprises a multi-channel hard X-ray detection cathode, a micro-channel plate, a fluorescent screen, a CCD, a pinhole array plate, an electrical control system, a cathode Au micro-strip, a conductive thin layer and a micro-channel plate Au micro-strip. The detection method mainly includes the steps that a target emits hard X-ray pulses to pass through the pinhole array plate, the multi-channel hard X-ray detection cathode, the micro-channel plate and the fluorescent screen, andfinally imaging is conducted on the CCD. The camera is simple in structure, scientific and reasonable in design and convenient to use, and two-dimensional imaging with the time resolution capability can be effectively carried out on the hard X-rays with the energy section range of tens of keV to hundreds of keV.

The invention discloses a micro-strip energy collector, which comprises a fluid inlet, nozzles, flow resistance bodies, miniature cavities, micro-strips and a fluid outlet, wherein the fluid inlet isindependently communicated with the outside and the inlet of each nozzle, and the outlet of each nozzle is communicated with each miniature cavity; the flow resistance bodies are positioned on the positions corresponding to the outlets of the nozzles in the miniature cavities; when fluid enters the miniature cavities through the nozzles and generates a function with the flow resistance bodies, fluttering is generated; the micro-strips are positioned in the miniature cavities, the micro-strips are positioned on one side of a direction where the flow resistance bodies flow along fluid, and keepa set distance with the flow resistance bodies; the fluid outlet is communicated with the inner part and the outer part of each miniature cavity; and the micro-strips are piezoelectric function film materials. By use of the nozzles, the flow rate of the fluid is improved, so that fluid energy collection difficulty is lowered, the flow resistance bodies are added in the inlets of the miniature cavities, so that fluid in the cavities generates vortexes so as to drive the piezoelectric function film materials to generate deformation and generate electric energy.

The invention discloses a eutectic brazing fixture and eutectic brazing process for an MCM. The eutectic brazing fixture for the MCM is used for applying a uniform pressure on micro-strip sheets, LTCCsubstrates and copper-clad dielectric plates at the upper end of an AlSiC carrier plate in a box body of the MCM separately, and comprises a cover plate arranged at the box opening of the box body ina covering manner, wherein a plurality of press blocks parallel to the cover plate through a plurality of adjustment elements are arranged at one side close to the interior of the box, of the cover plate, and each adjustment element penetrates through the cover plate; moreover, each micro-strip sheet, each LTCC substrate and each copper-clad dielectric plate correspond to one press block separately; each press block adjusts the pressure applied onto the corresponding micro-strip sheet, the corresponding LTCC substrate or the corresponding copper-clad dielectric plate through the adjustment element corresponding to the press block; and a brazing hole penetrating through a position exposed in a manner of corresponding to the upper end of the AlSiC carrier plate in the box body, on the coverplate, is formed in the position. The eutectic brazing fixture for the MCM is simple in structure; and moreover, the uniform and controllable pressure can be applied onto the micro-strip sheets, theLTCC substrates and the copper-clad dielectric plates separately by virtue of the fixture, and layers in the box body are mutually extruded, so that eutectic brazing is facilitated.

The invention provides a TiO2-based microwave ceramic substrate material and a preparation method and application thereof. The TiO2-based microwave ceramic substrate material is composed of two crystal phases, namely a ceramic main crystal phase and a second crystal phase, wherein the ceramic main crystal phase is rutile type TiO2, and the second crystal phase is MgTi2O5. Common oxides including ZrO<2>, Nb<2>O<5> and SnO<2> are used as doping agents and enter TiO2 crystal lattices to form a solid solution; and MnCO<3>, CoO, CuO, ZnO and Al<2>O<3> are used as doping agents to play a role in improving the quality factor of the ceramic. The general chemical formula of the material is Ti<1-x>A<x>O<2> + yMgO + zB. The preparation method comprises the steps of burdening, ball milling, granulation, molding and sintering. The TiO2-based microwave ceramic substrate material prepared by the method disclosed by the invention has a relatively high Q*f value (20,000-40,000), a high dielectric constant (80-95) and a series of dielectric constant temperature coefficients (-550 to -900) through laboratory research and tests. The composite ceramic is suitable for manufacturing a substrate materialof a microwave capacitor, and can also be used for manufacturing materials of adjustable microwave devices such as a microstrip filter.

The invention discloses a low-loss spinel microwave ferrite material and a preparation method thereof, and belongs to the technical field of microwave ferrite materials, the chemical general formula of the low-loss spinel microwave ferrite material is Ni1-a-d + e-gZnaInbDycCodSneMnfCugFe2-b-c-2e-f-deltaO4, 0 < = a < = 0.2, 0 < = b < = 0.3, 0.005 < = c < = 0.02, 0 < = d < = 0.03, 0 < = e < = 0.1, 0 < = f < = 0.1, 0 < = g < = 0.2, delta is iron deficiency, 0 < = delta < = 0.1, 0 < = alpha < = 0.2, 0 < = alpha < = 0.2, 0 < = alpha < = 0.2, 0 < = alpha < = 0.2, 0 < = alpha < = 0.2, 0 < = alpha < = 0.2, 0 The sintering temperature of the spinel NiZn gyromagnetic material is adjustable in the range of 1100-1350 DEG C, the saturation magnetization Ms is in the range of 3000-4500 Gauss, the ferromagnetic resonance line width H is small in the range of 150-250 Oe, the dielectric loss is low, the spin wave line width Hk is adjustable in the range of 10-38 Oe, and the microwave ferrite material has the advantages of being wide in sintering temperature selectable range, small in electromagnetic loss, adjustable in power capacity and the like. The material can be used for compounding and co-firing with dielectric ceramic and garnet with low saturation magnetization to prepare a composite substrate, and the requirements of miniaturization and broadband of microwave devices, especially microstrip devices, are met.

The novel micro-strip circulator structurally comprises a permanent magnet, a dielectric substrate and an iron bottom plate which are sequentially arranged from top to bottom, the dielectric substrate comprises a silicon wafer, a polyimide film, an upper Cr/Au double-layer film and an upper Au plating layer are sequentially arranged on the upper surface of the silicon wafer, an upper surface circuit is etched on the upper Cr/Au double-layer film, and a lower surface circuit is etched on the lower Cr/Au double-layer film. The upper Au-plated layer is bonded with the permanent magnet through the ceramic substrate; a lower Cr/Au double-layer film is arranged on the lower surface of the silicon wafer, a lower surface circuit is etched on the lower Cr/Au double-layer film, a ferrite groove is further etched in the middle of the silicon wafer, and a lower Au plating layer is further arranged below the lower surface circuit. According to the novel structure and the processing method provided by the invention, two silicon wafers are not needed, wafer-level metal bonding is not needed, the process steps, the complexity and the cost of the circulator can be effectively reduced, the process redundancy is reduced, the size of the device can be reduced, and the development requirement of miniaturization is met.

The invention discloses a welding method for a microstrip substrate of a stepped structure, the welding voidage of the microstrip substrate can be reduced, and the microstrip substrate is prevented from warping in the welding process. According to the technical scheme, the welding method comprises the steps that array parallel sliding grooves are designed in a welding tool template, a manual knob adjuster is arranged at one end of each screw of a dumbbell-shaped pressurizing rod and a pressing block controlled to stretch out and retract back in the vertical direction through each screw is designed at the other end of the screw according to the actual assembly position of a stepped microstrip substrate, when combination and installation with a welding tool are carried out, each screw penetrates through a pressing cavity and moves along the corresponding step surface of the step-shaped microstrip substrate, the manual knob adjusters clamp the step-shaped microstrip substrate below the pressing blocks, and each manual knob adjuster presses a step area at each position on the step-shaped microstrip substrate, the step-shaped microstrip substrate is put into vacuum welding equipment, the step-shaped microstrip substrate is welded, and a corresponding welding curve is loaded to complete the welding of the micro-strip substrate.

The vertically-arranged MSM capacitor structure and the manufacturing method thereof disclosed by the invention can be applied to various semiconductor integration/packaging structures with small and medium capacitance values and miniaturization requirements. The structure comprises two flat metalized through grooves or blind grooves inserted into a semiconductor dielectric substrate, and the two flat metalized through grooves, blind grooves or buried grooves which are perpendicular to the surface of the semiconductor dielectric substrate and are separated by a dielectric partition wall S1 are formed in specific positions of the semiconductor dielectric substrate. A dielectric partition wall of a vertically-arranged MSM capacitor structure is perpendicular to the upper surface and the lower surface of the semiconductor dielectric substrate to form a dielectric layer of the capacitor. Two parallel rectangular through grooves, blind grooves or buried grooves are embedded with metal electrode plates P1 and P2 which form homoepitaxy of a capacitor body, and the two metal electrode plates extend to two ends of a dielectric partition wall S1 through a metal layer microstrip connecting line etched on the surface of a semiconductor dielectric substrate to form an electrode structure led out from leading-out ends L1 and L2 of the MSM capacitor. Therefore, a vertically-arranged MSM capacitor equivalent circuit structure is formed.

The invention discloses a protection method of a magnesium alloy workpiece for a marine environment, which adopts double-layer protection of an inner layer and an outer layer, and comprises the steps of micro-arc oxidation, conductive paint coating, baking and curing, alkaline chemical nickel plating, acidic chemical nickel plating, sealing and drying, the inner layer adopts a micro-arc oxidation film which is firmly combined with a matrix, and the outer layer adopts a micro-arc oxidation film which is firmly combined with the matrix; the outer layer adopts double-layer nickel plating of a bottom plating layer and a surface plating layer, the bottom plating layer adopts alkaline chemical nickel plating and is plated on the inner layer, the combination is firm, the surface plating layer adopts acid chemical nickel plating and is plated on the bottom plating layer, sealing treatment is performed, the porosity is reduced, the surface is compact, and the finished product is silver gray in appearance, slightly yellow, high in percent of pass, good in quality consistency and free of bubbling or layering phenomenon; through a 200 DEG C thermal shock test, the magnesium alloy micro-arc oxidation film is continuous, uniform, complete and free of pulverization, looseness and scratches, through a 672 h neutral salt spray test, the protection grade Rp is not lower than 9 grade, and the technical bottleneck that the magnesium alloy micro-arc oxidation film is difficult to be plated with a metal coating is broken through.

The invention discloses a color graphical color-changing fabric based on electronic ink and a preparation method, the fabric comprises a conductive fabric micro-strip formed by weaving conductive yarns and insulating yarns, the conductive yarns form a conductive area, and the insulating yarns form an insulating area; an electronic ink microcapsule layer is arranged on the conductive region; a flexible transparent conductive layer is arranged on the electronic ink microcapsule layer; and a transparent polymer layer is arranged on the flexible transparent conductive layer. The surface layer of the micro-strip is a conductive layer, the bottom layer of the micro-strip is an insulating layer, the electrophoretic discoloration micro-capsule, the conductive one-dimensional nano-material and the transparent polymer are uniformly coated on the surface of the micro-strip, and the voltage outputted by the driving circuit is respectively applied to the conductive micro-strip and the transparent conductive layer, so that the selective turning color development of the centimeter-scale micro-area on the surface of the micro-strip is realized. The upper electrode and the lower electrode are connected with a control circuit, centimeter-size pixel control and large-size graph display are achieved, and the foldable, high-environment-tolerance, low-cost and large-area color display and self-adaptive visible light camouflage fabric based on the conductive fabric base material is manufactured.