Eutectic brazing fixture and eutectic brazing process for MCM

Abstract

The invention discloses a eutectic brazing fixture and eutectic brazing process for an MCM. The eutectic brazing fixture for the MCM is used for applying a uniform pressure on micro-strip sheets, LTCCsubstrates and copper-clad dielectric plates at the upper end of an AlSiC carrier plate in a box body of the MCM separately, and comprises a cover plate arranged at the box opening of the box body ina covering manner, wherein a plurality of press blocks parallel to the cover plate through a plurality of adjustment elements are arranged at one side close to the interior of the box, of the cover plate, and each adjustment element penetrates through the cover plate; moreover, each micro-strip sheet, each LTCC substrate and each copper-clad dielectric plate correspond to one press block separately; each press block adjusts the pressure applied onto the corresponding micro-strip sheet, the corresponding LTCC substrate or the corresponding copper-clad dielectric plate through the adjustment element corresponding to the press block; and a brazing hole penetrating through a position exposed in a manner of corresponding to the upper end of the AlSiC carrier plate in the box body, on the coverplate, is formed in the position. The eutectic brazing fixture for the MCM is simple in structure; and moreover, the uniform and controllable pressure can be applied onto the micro-strip sheets, theLTCC substrates and the copper-clad dielectric plates separately by virtue of the fixture, and layers in the box body are mutually extruded, so that eutectic brazing is facilitated.

Description

technical field [0001] The invention belongs to the field of multi-chip module (MCM) packaging, and in particular relates to an MCM eutectic brazing tool and a eutectic brazing process. Background technique [0002] The existing multi-chip module (MCM) uses a deep-cavity microwave base as the box body, and the AlSiC carrier plate is brazed horizontally in the box as the carrier material of the middle layer, and the middle layer is brazed with a thermal expansion coefficient that matches the chip and a wiring integration degree. The high-quality LTCC substrate (LTCC ceramic substrate) and copper-clad dielectric board (Rogers5880 copper-clad dielectric board) are used as microwave transmission substrates, and the surface of the microwave transmission substrate is micro-assembled with MMIC chips. Copper-clad dielectric board, the back is directly brazed to the bottom of the box. [0003] In the micro-assembly process of multilayer interconnect substrates based on LTCC substrat...

AI Technical Summary

Problems solved by technology

[0003] In the micro-assembly process of multilayer interconnect substrates based on LTCC substrates, microwave copper-clad dielectric substrates, and high-power microwave devices, the traditional manual gradient welding process is cumbersome, the process window is small and difficult, and it is often difficult to achieve ideal heat dissipation and microwave after welding. Grounding effect, the flow chart of the traditional process is as follows figure 1 shown

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