Reflow-soldering plated-through-hole aluminum-based microstrip plate production process

A hole metallization and production process technology, applied in the field of aluminum-based microstrip plate production technology, can solve problems such as poor bonding force of the hole metallized aluminum-based microstrip plate coating, achieve good application value, improve high temperature resistance, good heat dissipation effect

Active Publication Date: 2020-08-25
SHAANXI LINGYUN ELECTRONICS GROUP
View PDF11 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] The purpose of the present invention is to overcome the above-mentioned shortcomings of the prior art, and provide a production process for aluminum-based microstrip boards with metallized holes for reflow soldering. The metallized aluminum-based mi

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Reflow-soldering plated-through-hole aluminum-based microstrip plate production process
  • Reflow-soldering plated-through-hole aluminum-based microstrip plate production process
  • Reflow-soldering plated-through-hole aluminum-based microstrip plate production process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] Below in conjunction with accompanying drawing, the present invention is described in further detail:

[0026] Such as figure 2 As shown, the base material for the production of hole metallized aluminum-based microstrip board is aluminum-based copper clad laminate, the front side is a copper foil layer 1 for making conductive patterns, the bottom side is a thermally conductive aluminum base layer, and the middle is an insulating layer 2 . The production process flow of the aluminum-based microstrip board of the present invention is: blanking, drilling metallized holes, silk screen solder resist ink on the copper foil surface, three times of zinc dipping and zinc stripping, electroless plating of multi-element nickel alloy, acid copper plating of printed boards, removal of Silk screen solder resist ink, plasma treatment, hole metallization and full board copper plating, graphic transfer, graphic electroplating copper / nickel / gold, etching, silk screen solder mask and cha...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a reflow-soldering plated-through-hole aluminum-based microstrip plate production process. The production process sequentially comprises the following steps: blanking, drillingof plated through holes, silk-screen printing of solder resist ink on copper foils, three times of zinc immersion and zinc stripping, chemical plating of multi-element nickel alloy, acid copper plating of a printed board, removal of the silk-screen printing solder resist ink, plasma treatment, hole metallization and full-board copper plating, pattern transfer, pattern copper/nickel gold electroplating, etching, silk-screen printing of solder resist and characters, pasting of a protective adhesive film, secondary drilling, appearance processing and removal of the protective adhesive film; 180-mesh silk screens are adopted for silk-screen printing of the solder resist ink on the copper foils; through pretreatment process of three times of zinc immersion and zinc stripping, the bonding forceof a chemical nickel alloy plating layer and an aluminum base layer is improved; a traditional zinc immersion process is replaced with a chemical multi-element nickel alloy plating process, so that the bonding force between plating layers is enhanced, and the high-temperature resistance of the microstrip plate is improved; and the temperature resistance can reach 300 DEG C, and the requirement ofreflow soldering of the aluminum-based microstrip plate is met.

Description

Technical field: [0001] The invention belongs to the field of printed circuit board manufacturing, and in particular relates to a production process of an aluminum-based microstrip board with metallized reflow soldering holes. Background technique: [0002] (1) Aluminum-based microstrip boards began to be used in the military electronics industry in the early 1990s. Its structure is as follows figure 1 As shown, in the circuit design, part of the front microstrip wire (ie copper foil layer) is required to conduct with the aluminum base layer (ie metal base layer) on the bottom surface, such as figure 2 , that is, the via holes on the aluminum-based microstrip board require hole metallization. However, since the aluminum base layer of the aluminum-based microstrip plate is different from the ordinary FR-4 epoxy glass cloth substrate, the chemical activity of metal aluminum makes the conventional hole metallization technology unable to be directly carried out on the aluminum...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/42
CPCH05K3/423Y02P70/50
Inventor 段超胡小峰李娜吕景峰谢明李江海
Owner SHAANXI LINGYUN ELECTRONICS GROUP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products