A framing camera photocathode based on inorganic perovskite and its preparation method

A framing camera, photocathode technology, applied in the manufacture of light-emitting cathodes, secondary and light-emitting cathodes, main electrodes of discharge tubes, etc., to achieve excellent detection efficiency, simple steps, and good stability.

Active Publication Date: 2021-07-02
LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Compared with traditional visible light photocathode materials, CsPbI 3 It has a suitable energy band gap, and has the characteristics of high photoelectric conversion quantum efficiency, stable performance and simple preparation method, so it has high potential in the field of photocathode preparation, but there is no CsPbI 3 Related reports on photocathodes applied to framing cameras

Method used

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  • A framing camera photocathode based on inorganic perovskite and its preparation method
  • A framing camera photocathode based on inorganic perovskite and its preparation method

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preparation example Construction

[0032] Such as figure 2 Shown, the preparation method of the framing camera photocathode based on inorganic perovskite of the present invention comprises the following steps:

[0033] 1. Provide a piece of MCP1, use alcohol to ultrasonically clean the MCP1 and then dry it;

[0034] 2. Cover the upper surface of MCP1 with a mask, and use the coating method of magnetron sputtering or atomic layer deposition to plate metal microstrip 2 on the upper surface of MCP1;

[0035] 3. Configure CsPbI 3 Precursor solution;

[0036] 4. Put the MCP1 obtained in step b into CsPbI 3 Precursor solution is heated until a layer of CsPbI is formed on the upper surface of the metal microstrip 2 and the inner wall of the microchannel of MCP1 3 film3;

[0037] 5. Convert the MCP1 obtained in step d from CsPbI 3 Take it out from the precursor solution, put it into an oven to heat and dry;

[0038] 6. Using the coating method of magnetron sputtering or atomic layer deposition, the lower surfac...

Embodiment 1

[0044]The CsPbI of the framing camera photocathode based on the inorganic perovskite of the present embodiment 3 Thin film 3 has a thickness of 50 nm.

[0045] The preparation process of the framing camera photocathode based on inorganic perovskite in this embodiment is as follows:

[0046] 1. Provide a piece of MCP1, use alcohol to ultrasonically clean the MCP1 and then dry it; the aperture of the microchannel is 3 μm, the thickness of the MCP1 is 100 μm, and the radial direction of the microchannel deviates from the surface normal of the MCP1 by 3°;

[0047] 2. Cover the upper surface of MCP1 with a mask, and use the coating method of magnetron sputtering or atomic layer deposition to plate metal microstrips 2 on the upper surface of MCP1; the number of metal microstrips 2 is 1, and the number of metal microstrips 2 The thickness of the copper layer is 500nm;

[0048] 3. Configure CsPbI 3 Precursor solution; its polar organic solvent is DMF;

[0049] 4. Put the MCP1 obta...

Embodiment 2

[0053] The CsPbI of the framing camera photocathode based on the inorganic perovskite of the present embodiment 3 Thin film 3 has a thickness of 150 nm.

[0054] The preparation process of the framing camera photocathode based on inorganic perovskite in this embodiment is as follows:

[0055] 1. Provide a piece of MCP1, use alcohol to ultrasonically clean the MCP1 and then dry it; the aperture of the microchannel is 5 μm, the thickness of the MCP1 is 500 μm, and the radial direction of the microchannel deviates from the surface normal of the MCP1 by 4°;

[0056] 2. Cover the upper surface of MCP1 with a mask, and use the coating method of magnetron sputtering or atomic layer deposition to plate metal microstrips 2 on the upper surface of MCP1; the number of metal microstrips 2 is 4, and the number of metal microstrips 2 The thickness of the copper layer is 1000nm;

[0057] 3. Configure CsPbI 3 Precursor solution; its polar organic solvent is GBL;

[0058] 4. Put the MCP1 o...

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Abstract

The invention discloses a framing camera photocathode based on inorganic perovskite and a preparation method thereof. The photocathode is composed of microchannel plate MCP, metal microstrip, inorganic perovskite CsPbI 3 Composed of a photocathode, a metal electrode and an electrode protective film; the preparation method of the photocathode is as follows: clean the MCP, plate a metal microstrip on the upper surface of the MCP, and then put the MCP into the CsPbI 3 Heating in the solution forms a deposited layer of CsPbI on the upper surface of the metal microstrip and the inner wall of the MCP microchannel. 3 After the thin film, the MCP is taken out and dried, and finally the metal electrode and the electrode protection film are sequentially plated on the lower surface of the MCP, that is, the preparation of the photocathode of the framing camera based on the inorganic perovskite is completed. The photocathode is based on the inorganic perovskite CsPbI 3 As a photoelectric conversion material, it has high response sensitivity from visible light to X-rays. CsPbI 3 It has good stability in the atmospheric environment, and does not need to be packaged with the framing camera as a whole in vacuum, which reduces the difficulty and cost of preparation.

Description

technical field [0001] The invention belongs to the field of framing camera photocathode and preparation thereof, in particular to a framing camera photocathode based on inorganic perovskite and a preparation method thereof. Background technique [0002] Framing camera photocathode is a photoelectric conversion device that converts optical signals into electronic signals in framing cameras. It has important applications in high-speed photography, detonation physics, high-voltage physics, and weak light detection. The photocathode of framing camera is usually composed of microchannel plate MCP, metal microstrip, photocathode and electrode. When the framing camera is working, an ultrashort pulse voltage is applied between the metal microstrip and the electrode, and the photocathode converts photons into electronic signals. The MCP amplifies the electronic signal, and the amplified electronic signal bombards the fluorescent screen of the framing camera under the action of an ex...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01J1/35H01J9/12
Inventor 黎宇坤杨志文陈韬李晋杨品袁铮邓克立王强强曹柱荣
Owner LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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