13 results about "Planar transmission lines" patented technology

The invention discloses a receiving optical module, a transmitting optical module and a receiving and transmitting optical module, which are used for reducing loss, improving gain and reducing noise. In the receiving optical module, impedance matching is carried out through the first step transformation plane transmission line or the first lumped element network, impedance matching can be realized by adopting a capacitor and an inductor instead of adopting a resistor for impedance matching, the loss in the radio frequency signal transmission process can be reduced, the gain is further improved, and the noise is reduced. In the transmitting optical module, impedance matching is carried out through a second step transformation plane transmission line or a second lumped element network, impedance matching can be realized by adopting a capacitor and an inductor instead of adopting a resistor for impedance matching, the loss in the radio frequency signal transmission process can be reduced, the gain is further improved, and the noise is reduced.

A varactor-tunable radio frequency (RF) resonant circuit is disclosed. The circuit includes a planar impedance-controlled transmission line disposed on a dielectric substrate, and a voltage-controlled varactor diode, or an arrangement of parallel varactor diodes, electrically connecting a resonator of the planar transmission line to a reference node. The resonator can have a stepped impedance. A frequency of the resonator is tunable by configuration of a reverse bias voltage applied to the first plurality of voltage-controlled varactor diodes.

This invention discloses a horizontal radio frequency (RF) transition structure, belonging to the field of microwave wireless communication technology. It includes a structural cavity and a first component and a second component disposed within the structural cavity. A height difference exists between the first and second components. A planar transmission line is disposed within the structural cavity to facilitate RF signal transition between the first and second components in the horizontal direction. The structural cavity also contains multiple interconnected RF GSG structures, which form a stepped interconnection structure in the vertical direction to facilitate RF signal transition between the first and second components in the vertical direction. One end of each stepped interconnection structure is connected to either the first or second component, and the other end is connected to the planar transmission line. This invention solves the technical problem of deep cavity structures caused by height differences between input and output ports and installation gaps.

The application discloses a frequency selective amplitude limiter and a radio frequency device, and relates to the technical field of microwave radio frequency devices. Specifically, the frequency selective amplitude limiter comprises a planar transmission line structure, a first magnetic film and a second magnetic film. The planar transmission line structure is used for transmitting a microwave radio frequency signal and generating a microwave magnetic field. The first magnetic film covers a first surface of the planar transmission line structure. The second magnetic film covers a second surface of the planar transmission line structure, so that the planar transmission line structure is clamped between the first magnetic film and the second magnetic film. The microwave magnetic field generated by the planar transmission line structure is coupled to the first magnetic film and the second magnetic film at the same time. The first surface and the second surface of the planar transmission line structure are covered by the first magnetic film and the second magnetic film respectively, so that the magnetic coupling efficiency can be improved without greatly increasing the interaction length, and the frequency selective amplitude limiter also has a very low nonlinear starting threshold and a very low insertion loss.

A radio frequency (RF) component having a compact form-factor includes a planar transmission line located between first and second dielectric substrates. A first plurality of conductive vias integrated with the first substrate are electrically connected to a second plurality of conductive vias integrated with the second substrate, wherein the electrically connected conductive vias are arranged at least partially about the planar transmission line. The vias are connected to a ground plane on one of the substrates. Multiple RF components can be stacked one atop the other to form an integrated bank of discrete or electrically connected electrical devices implemented as antennas, couplers and filters, among other RF components, and combinations thereof.

Localized heating can use a fixed-frequency planar transmission line resonators arranged along a main-line, selected by tuning an electromagnetic input signal frequency applied to the main line for depositing heat in an adjacent active substrate. More generally, adjusting input signal frequency can be used to selectively address and energize an electromagnetic-to-heat, an electromagnetic-to-vibration, or other transducer to controllably direct energy toward a desired transducer load. Resonators or other electromagnetically energized transducers can be arranged to electromagnetically interfere, such that specifying or adjusting a relative phase of applied electrical signals can be used to specify or adjust the energy directed toward a desired transducer load. Temperature sensing can characterize a material in a target region near the transducer. A cold-hot-cold temperature profile can better manage temperature and avoid overheating a dielectric material such as the active substrate material.

This invention discloses a planar transmission line to rectangular waveguide conversion structure, comprising a multi-layer ground plane, a planar transmission line, a matching unit, and a rectangular waveguide. The multi-layer ground plane has standard waveguide aperture regions formed by cutouts at corresponding waveguide positions. The matching unit is arranged within the standard waveguide aperture regions and is E-shaped, comprising one transverse stub and three longitudinal stubs, with the middle longitudinal stub corresponding to the stripline. This invention utilizes the simple structure of the E-shaped matching unit. The two U-shaped portions formed by the three longitudinal stubs and one transverse stub of the E-shaped structure all possess capacitive characteristics, and these characteristics change little with frequency, resulting in better broadband matching performance. Compared to a conventional square matching structure, the E-shaped matching structure achieves a wider matching effect and reduces the precision requirements during actual assembly.

An interface between cryogenic computational hardware and room temperature computational hardware includes a plurality of discrete stages, including a first stage at room temperature and a last stage at a cryogenic temperature. Each successive stage is configured for operation at a corresponding refrigeration temperature that is lower than the refrigeration temperature of each preceding stage and includes a set of planar transmission lines. The transmission lines of any given stage other than the first stage are proximally coupled to and contiguous with the transmission lines of an immediately preceding stage. The transmission lines of the first stage are proximally coupled to the room temperature computational hardware, and the transmission lines of the last stage are proximally coupled to the cryogenic computational hardware. Each stage has shielding configured to block electromagnetic radiation external to such stage.

This invention discloses a dual-band circularly polarized antenna for maritime communication, comprising: a first dielectric substrate, a radiating patch array, a second dielectric substrate, a slotted ground plane, and a transmission line; the radiating patch array is located on the upper surface of the first dielectric substrate, the slotted ground plane is located between the first and second dielectric substrates, and the transmission line is located on the lower surface of the second dielectric substrate; the radiating patch array consists of several truncated square patches disposed in the central region and parasitic patches disposed around the perimeter; a cross-shaped vertical slot is provided at the center of each truncated square patch; a star-shaped slot is formed on the slotted ground plane; the transmission line is an L-shaped planar transmission line composed of microstrip lines; the slotted ground plane and the transmission line constitute a feeding structure, which excites the circular polarization effect of the radiating patch array. This antenna has advantages such as structural stability, low profile, dual-band circular polarization, and wide bandwidth, and can be applied to fields such as maritime wireless communication and wireless positioning.

The invention provides an integrated interconnection waveguide excitation device which is applied to the technical field of electronic information. The device comprises a metal waveguide, an electric conduction connecting piece and a planar transmission line, a coupling slot is formed in the tail end surface of the metal waveguide along the conduction direction of an electromagnetic signal; the electrical conduction connecting piece is electrically connected with the planar transmission line, passes through the coupling slot and is electrically connected with the tail end surface of the metal waveguide; the plane transmission line is perpendicular to the conduction direction of an electromagnetic signal of the metal waveguide, so that vertical interconnection of the plane transmission line and the metal waveguide is achieved, and therefore the electromagnetic signal is conducted into the metal waveguide from the micro-strip transmission line through the electric conduction connecting piece. Through the device, the vertical interconnection of the integrated waveguide and the planar transmission line can be realized, so that the interconnection loss is reduced, and the electromagnetic signal transmission efficiency is improved.

An impedance matching circuit to provide impedance matching between a radio frequency source and an output load. The impedance matching circuit 20 comprises a planar transmission line having a conduct

Disclosed in the present application are an optical receiving module, an optical transmitting module and an optical transceiving module, which are used for reducing loss, increasing gain and reducing noise. In the optical receiving module, impedance matching is performed by means of a first stepped-impedance transformation planar transmission line or a first lumped-element network, where impedance matching may be achieved not by using resistors, but by using capacitors and inductors, such that the loss of a radio-frequency signal during transmission can be reduced, thereby increasing gain and reducing noise. In the optical transmitting module, impedance matching is performed by means of a second stepped-impedance transformation planar transmission line or a second lumped-element network, where impedance matching may be achieved not by using resistors, but by using capacitors and inductors, such that the loss of a radio-frequency signal during transmission can be reduced, thereby increasing gain and reducing noise.

The present invention provides a wiring structure based on HTCC technology, a preparation method thereof, and a ceramic housing, belonging to the field of high-frequency, high-speed ceramic packaging technology. The wiring structure based on HTCC technology includes: a lower ceramic component; and an upper ceramic component, which together with the lower ceramic component encloses an air cavity. At least one planar GCPW transmission line is formed on the upper surface of the lower ceramic component that forms the air cavity, and at least one vertical GCPW transmission line is formed on the upper surface of the lower ceramic component outside the air cavity and the upper and side surfaces of the upper ceramic component. The projection of the vertical GCPW transmission line on the lower ceramic component intersects the planar GCPW transmission line. Compared to a buried GCPW structure with the same characteristic impedance, the wiring structure based on HTCC technology provided by the present invention has a wider center conductor band width, is more convenient to manufacture, reduces process production difficulty, and is easy to implement.