25 results about "Planar transmission lines" patented technology

The invention relates to a flexible planar transmission line for communication between a first electronic device and a second electronic device. The flexible planar transmission line comprises a first conducting layer, a dielectric layer, a second conducting layer, a signal line provided in the dielectric layer and a concatenation of a first filter and a second filter, wherein the first filter being arranged to attenuate frequency components of a signal and a second filter being arranged to attenuate higher order modes of the propagated signal.

The planar coaxial transmission line comprises a signal line, an upper layer metal ground, a lower layer metal ground, a plated-through hole, a dielectric substrate and a shielding cover, the upper layer metal ground and the lower layer metal ground are arranged on the upper surface and the lower surface of the dielectric substrate respectively, and the plated-through hole is connected with the upper layer metal ground and the lower layer metal ground. The signal line and the upper-layer metal ground are located on the same plane, a medium groove is arranged between the upper-layer metal ground and the signal line, and a shielding cover is arranged above the signal line and is connected with the upper-layer metal ground. The planar coaxial transmission line can be applied to implementation of a radio frequency microwave circuit module and system with low loss and high shielding performance, and can be directly interconnected and integrated with an existing planar transmission line circuit, an existing coaxial line circuit, an existing electronic component and an existing chip device, electromagnetic shielding isolation is improved, electromagnetic signal transmission is enhanced, and the transmission efficiency is improved. And the size and weight of the circuit module and the system are simplified, the reliability is higher, the design is simpler, and the cost is lower.

A method of forming a direct electrical connection between a photonic integrated circuit (PIC) and a coaxial connector for a high-frequency or high-bandwidth connection of 50 GHz or more. The PIC has a planar transmission line with a track of sub-400 micrometer width. A blob of solder paste or electrically conductive adhesive is dispensed onto the track. The PIC is then moved relative to the coaxial connector to bring its connector pin into a bonding position in which an end length portion of the connector pin is in contact with the blob. The blob is then hardened while the connector pin is held in the bonding position to form a permanent electrical connection between the connector pin and the track to which it is to be connected. A high frequency electrical connection is thus made without the use of a bridging electronic integrated circuit (EIC).

The invention discloses a receiving optical module, a transmitting optical module and a receiving and transmitting optical module, which are used for reducing loss, improving gain and reducing noise. In the receiving optical module, impedance matching is carried out through the first step transformation plane transmission line or the first lumped element network, impedance matching can be realized by adopting a capacitor and an inductor instead of adopting a resistor for impedance matching, the loss in the radio frequency signal transmission process can be reduced, the gain is further improved, and the noise is reduced. In the transmitting optical module, impedance matching is carried out through a second step transformation plane transmission line or a second lumped element network, impedance matching can be realized by adopting a capacitor and an inductor instead of adopting a resistor for impedance matching, the loss in the radio frequency signal transmission process can be reduced, the gain is further improved, and the noise is reduced.

A varactor-tunable radio frequency (RF) resonant circuit is disclosed. The circuit includes a planar impedance-controlled transmission line disposed on a dielectric substrate, and a voltage-controlled varactor diode, or an arrangement of parallel varactor diodes, electrically connecting a resonator of the planar transmission line to a reference node. The resonator can have a stepped impedance. A frequency of the resonator is tunable by configuration of a reverse bias voltage applied to the first plurality of voltage-controlled varactor diodes.

The present invention discloses a flexible planar transmission line and a common-mode suppression balun structure, which are made of a flexible printed circuit board, wherein the flexible printed circuit board includes a flexible insulating dielectric layer, an upper copper-clad layer located on the upper surface of the flexible insulating dielectric layer, and a lower copper-clad layer located on the lower surface of the flexible insulating dielectric layer; the upper and lower copper-clad layers are partially overlapped, and the overlapped upper and lower copper-clad layers form a flexible planar capacitor together with the flexible insulating dielectric layer in between; the conductor of the flexible planar transmission line is composed of the upper and lower copper-clad layers of the flexible printed circuit board; the common-mode suppression balun includes a flexible planar transmission line and a flexible planar capacitor. The flexible planar transmission line and the common-mode suppression balun structure of the present invention are made of a flexible printed circuit board, do not require any solder joints and discrete components, can be made into a completely planar structure, are very thin, have very good flexibility, are low in cost, have good reliability, and are very suitable for use in a magnetic resonance flexible radio frequency coil.

A varactor-tunable radio frequency (RF) resonant circuit is disclosed. The circuit includes a planar impedance-controlled transmission line disposed on a dielectric substrate, and a voltage-controlled varactor diode, or an arrangement of parallel varactor diodes, electrically connecting a resonator of the planar transmission line to a reference node. The resonator can have a stepped impedance. A frequency of the resonator is tunable by configuration of a reverse bias voltage applied to the first plurality of voltage-controlled varactor diodes.

This invention discloses a horizontal radio frequency (RF) transition structure, belonging to the field of microwave wireless communication technology. It includes a structural cavity and a first component and a second component disposed within the structural cavity. A height difference exists between the first and second components. A planar transmission line is disposed within the structural cavity to facilitate RF signal transition between the first and second components in the horizontal direction. The structural cavity also contains multiple interconnected RF GSG structures, which form a stepped interconnection structure in the vertical direction to facilitate RF signal transition between the first and second components in the vertical direction. One end of each stepped interconnection structure is connected to either the first or second component, and the other end is connected to the planar transmission line. This invention solves the technical problem of deep cavity structures caused by height differences between input and output ports and installation gaps.

The utility model discloses a space field power combiner with coaxial transmission line to planar transmission line conversion, which comprises an output terminal and a plurality of input terminals, the input part is used for being connected with the plurality of input terminals; the transmission part is connected with the input part so as to match impedance of the plurality of input terminals to the inside; the output terminal is connected between the transmission part and the output terminal; and a stepped transmission portion for implementing impedance conversion and merging of the input terminals and impedance matching with a single output terminal. According to the utility model, through the arrangement of the input part, the transmission part and the step transmission part, impedance conversion of a plurality of input terminals can be realized, then the input terminals are combined, and impedance matching with a single output terminal is realized, so that the power combiner works in a higher microwave frequency band, namely, the bandwidth of the power combiner is fully broadened, and the power combiner has a wide application range. And multiple octaves can be covered.

The application discloses a frequency selective amplitude limiter and a radio frequency device, and relates to the technical field of microwave radio frequency devices. Specifically, the frequency selective amplitude limiter comprises a planar transmission line structure, a first magnetic film and a second magnetic film. The planar transmission line structure is used for transmitting a microwave radio frequency signal and generating a microwave magnetic field. The first magnetic film covers a first surface of the planar transmission line structure. The second magnetic film covers a second surface of the planar transmission line structure, so that the planar transmission line structure is clamped between the first magnetic film and the second magnetic film. The microwave magnetic field generated by the planar transmission line structure is coupled to the first magnetic film and the second magnetic film at the same time. The first surface and the second surface of the planar transmission line structure are covered by the first magnetic film and the second magnetic film respectively, so that the magnetic coupling efficiency can be improved without greatly increasing the interaction length, and the frequency selective amplitude limiter also has a very low nonlinear starting threshold and a very low insertion loss.

The invention discloses a low-loss power matching circuit of a GaN monolithic amplifier, which belongs to the technical field of amplifiers, comprises a series inductor Ls, a planar transmission line transformer unit and a lumped network unit, and solves the technical problems of low loss and impedance conversion in a broadband output matching circuit of a GaN HEMT (High Electron Mobility Transistor) power amplifier. The power loss of the circuit is reduced, the radio frequency short-circuit end of the transmission line transformer can be used as a direct current feed end to provide a drain voltage path for the transistor, and an additional direct current feed circuit is omitted, so that the circuit design is simplified, the circuit area is reduced, the spiral small planar transmission line transformer is adopted, a matching circuit is further miniaturized, and the power consumption is reduced. The chip area is reduced, and the production cost is reduced.

A radio frequency (RF) component having a compact form-factor includes a planar transmission line located between first and second dielectric substrates. A first plurality of conductive vias integrated with the first substrate are electrically connected to a second plurality of conductive vias integrated with the second substrate, wherein the electrically connected conductive vias are arranged at least partially about the planar transmission line. The vias are connected to a ground plane on one of the substrates. Multiple RF components can be stacked one atop the other to form an integrated bank of discrete or electrically connected electrical devices implemented as antennas, couplers and filters, among other RF components, and combinations thereof.

Localized heating can use a fixed-frequency planar transmission line resonators arranged along a main-line, selected by tuning an electromagnetic input signal frequency applied to the main line for depositing heat in an adjacent active substrate. More generally, adjusting input signal frequency can be used to selectively address and energize an electromagnetic-to-heat, an electromagnetic-to-vibration, or other transducer to controllably direct energy toward a desired transducer load. Resonators or other electromagnetically energized transducers can be arranged to electromagnetically interfere, such that specifying or adjusting a relative phase of applied electrical signals can be used to specify or adjust the energy directed toward a desired transducer load. Temperature sensing can characterize a material in a target region near the transducer. A cold-hot-cold temperature profile can better manage temperature and avoid overheating a dielectric material such as the active substrate material.

This invention discloses a planar transmission line to rectangular waveguide conversion structure, comprising a multi-layer ground plane, a planar transmission line, a matching unit, and a rectangular waveguide. The multi-layer ground plane has standard waveguide aperture regions formed by cutouts at corresponding waveguide positions. The matching unit is arranged within the standard waveguide aperture regions and is E-shaped, comprising one transverse stub and three longitudinal stubs, with the middle longitudinal stub corresponding to the stripline. This invention utilizes the simple structure of the E-shaped matching unit. The two U-shaped portions formed by the three longitudinal stubs and one transverse stub of the E-shaped structure all possess capacitive characteristics, and these characteristics change little with frequency, resulting in better broadband matching performance. Compared to a conventional square matching structure, the E-shaped matching structure achieves a wider matching effect and reduces the precision requirements during actual assembly.

An interface between cryogenic computational hardware and room temperature computational hardware includes a plurality of discrete stages, including a first stage at room temperature and a last stage at a cryogenic temperature. Each successive stage is configured for operation at a corresponding refrigeration temperature that is lower than the refrigeration temperature of each preceding stage and includes a set of planar transmission lines. The transmission lines of any given stage other than the first stage are proximally coupled to and contiguous with the transmission lines of an immediately preceding stage. The transmission lines of the first stage are proximally coupled to the room temperature computational hardware, and the transmission lines of the last stage are proximally coupled to the cryogenic computational hardware. Each stage has shielding configured to block electromagnetic radiation external to such stage.

Waveguide structures are built into integrated circuit devices using standard processing steps for semiconductor device fabrication. A waveguide may include a base, a top, and two side walls. At least one of the walls (e.g., the base or the top) may be formed in a metal layer. The base or top may be patterned to provide a transition to a planar transmission line, such as a coplanar waveguide. The side walls may be formed using vias.

The present invention minimizes issues with transmission lines through the use of a normal-metal / superconducting meta-material structure realized with controlled impedance sub-wavelength line sections, which effectively concentrate the uncertainty in the section lengths in a portion of the termination geometry which has minimal impact on the non-resonant absorption in the structure. The present invention is used to achieve broadband absorption response and signal termination in planar transmission line devices. The longest wavelength sets the required length of the meta-material line, and its footprint is set by properties of the guiding structure (i.e., the resultant line can be folded, meandered, or spiraled with a spacing set is set by the field confinement of the transmission line topology in use).

Waveguide structures are built into integrated circuit devices using standard processing steps for semiconductor device fabrication. A waveguide may include a base, a top, and two side walls. At least one of the walls (e.g., the base or the top) may be formed in a metal layer. The base or top may be patterned to provide a transition to a planar transmission line, such as a coplanar waveguide. The side walls may be formed using vias.

This invention discloses a dual-band circularly polarized antenna for maritime communication, comprising: a first dielectric substrate, a radiating patch array, a second dielectric substrate, a slotted ground plane, and a transmission line; the radiating patch array is located on the upper surface of the first dielectric substrate, the slotted ground plane is located between the first and second dielectric substrates, and the transmission line is located on the lower surface of the second dielectric substrate; the radiating patch array consists of several truncated square patches disposed in the central region and parasitic patches disposed around the perimeter; a cross-shaped vertical slot is provided at the center of each truncated square patch; a star-shaped slot is formed on the slotted ground plane; the transmission line is an L-shaped planar transmission line composed of microstrip lines; the slotted ground plane and the transmission line constitute a feeding structure, which excites the circular polarization effect of the radiating patch array. This antenna has advantages such as structural stability, low profile, dual-band circular polarization, and wide bandwidth, and can be applied to fields such as maritime wireless communication and wireless positioning.

The invention provides an integrated interconnection waveguide excitation device which is applied to the technical field of electronic information. The device comprises a metal waveguide, an electric conduction connecting piece and a planar transmission line, a coupling slot is formed in the tail end surface of the metal waveguide along the conduction direction of an electromagnetic signal; the electrical conduction connecting piece is electrically connected with the planar transmission line, passes through the coupling slot and is electrically connected with the tail end surface of the metal waveguide; the plane transmission line is perpendicular to the conduction direction of an electromagnetic signal of the metal waveguide, so that vertical interconnection of the plane transmission line and the metal waveguide is achieved, and therefore the electromagnetic signal is conducted into the metal waveguide from the micro-strip transmission line through the electric conduction connecting piece. Through the device, the vertical interconnection of the integrated waveguide and the planar transmission line can be realized, so that the interconnection loss is reduced, and the electromagnetic signal transmission efficiency is improved.

A radio frequency (RF) component having a compact form-factor includes a planar transmission line located between first and second dielectric substrates. A first plurality of conductive vias integrated with the first substrate are electrically connected to a second plurality of conductive vias integrated with the second substrate, wherein the electrically connected conductive vias are arranged at least partially about the planar transmission line. The vias are connected to a ground plane on one of the substrates. Multiple RF components can be stacked one atop the other to form an integrated bank of discrete or electrically connected electrical devices implemented as antennas, couplers and filters, among other RF components, and combinations thereof.

An impedance matching circuit to provide impedance matching between a radio frequency source and an output load. The impedance matching circuit 20 comprises a planar transmission line having a conduct

Disclosed in the present application are an optical receiving module, an optical transmitting module and an optical transceiving module, which are used for reducing loss, increasing gain and reducing noise. In the optical receiving module, impedance matching is performed by means of a first stepped-impedance transformation planar transmission line or a first lumped-element network, where impedance matching may be achieved not by using resistors, but by using capacitors and inductors, such that the loss of a radio-frequency signal during transmission can be reduced, thereby increasing gain and reducing noise. In the optical transmitting module, impedance matching is performed by means of a second stepped-impedance transformation planar transmission line or a second lumped-element network, where impedance matching may be achieved not by using resistors, but by using capacitors and inductors, such that the loss of a radio-frequency signal during transmission can be reduced, thereby increasing gain and reducing noise.

The present invention provides a wiring structure based on HTCC technology, a preparation method thereof, and a ceramic housing, belonging to the field of high-frequency, high-speed ceramic packaging technology. The wiring structure based on HTCC technology includes: a lower ceramic component; and an upper ceramic component, which together with the lower ceramic component encloses an air cavity. At least one planar GCPW transmission line is formed on the upper surface of the lower ceramic component that forms the air cavity, and at least one vertical GCPW transmission line is formed on the upper surface of the lower ceramic component outside the air cavity and the upper and side surfaces of the upper ceramic component. The projection of the vertical GCPW transmission line on the lower ceramic component intersects the planar GCPW transmission line. Compared to a buried GCPW structure with the same characteristic impedance, the wiring structure based on HTCC technology provided by the present invention has a wider center conductor band width, is more convenient to manufacture, reduces process production difficulty, and is easy to implement.

The invention provides a transmission line structure, a preparation method and application thereof, the transmission line structure comprises a substrate, an insulating medium layer and a conductive wiring layer, the substrate is provided with a plurality of through holes penetrating through the substrate, the inner walls of the through holes are arranged in an inclined manner, the insulating medium layer covers the first surface and the second surface of the substrate and the inner walls of the through holes, and the conductive wiring layer covers the first surface and the second surface of the substrate. The conductive wiring layer is located on the surface of the insulating dielectric layer and comprises a center wire which serves as a signal wire. According to the invention, by directly forming the central lead (namely the in-hole transmission line) on the inner wall of the through hole, the consistency of the structural design of the central lead (planar transmission line) on the first surface and the second surface is realized, so that impedance matching is ensured; signal loss caused by impedance mismatching when signals are transmitted between the in-hole transmission line and the planar transmission line is avoided, so that the integrity and efficiency of signal transmission are remarkably improved, and stable transmission of higher-frequency signals is facilitated.